银纳米立方焊膏制备及其焊接性能研究.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 625, doi. 10.14106/j.cnki.1001-2028.2023.1458
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Works in Electronic Components & Materials, 2023, Vol 42, Issue 5
Results: 18
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基于磁偶极子加载的机翼后向散射增强设计.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 618, doi. 10.14106/j.cnki.1001-2028.2023.1761
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- Article
3
渐变宽度分形环宽带天线的设计与研究.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 611, doi. 10.14106/j.cnki.1001-2028.2023.1684
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- Article
4
基于M 型六角铁氧体Ba( ZnHf)<sub>0.08</sub> Fe<sub>11.92</sub> O<sub>19</sub> 的 自偏置微带环行器设计.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 604, doi. 10.14106/j.cnki.1001-2028.2023.1450
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- Article
5
一种高增益带宽积高摆率运算跨导放大器.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 598, doi. 10.14106/j.cnki.1001-2028.2023.1543
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- Article
6
入射角度不敏感的宽带超材料吸波器.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 592, doi. 10.14106/j.cnki.1001-2028.2023.0106
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- Article
7
基于电磁带隙结构的平衡五频带滤波器设计.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 584, doi. 10.14106/j.cnki.1001-2028.2023.1679
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- Article
8
不同表面活性剂对浅沟槽隔离CMP 中SiO<sub>2</sub> 与Si<sub>3</sub> N<sub>4</sub> 速率选择性的影响.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 578, doi. 10.14106/j.cnki.1001-2028.2023.1635
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- Article
9
有机载体对铜电极浆料性能影响的研究.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 568, doi. 10.14106/j.cnki.1001-2028.2023.1693
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- Article
10
CO<sub>2</sub> 激光直写PI 薄膜温度、应力场仿真与分析.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 560, doi. 10.14106/j.cnki.1001-2028.2023.1629
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- Article
11
一种基于有效媒质理论的电磁参数优化计算方法.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 555, doi. 10.14106/j.cnki.1001-2028.2023.1618
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- Article
12
纤维结构对静电纺丝辐射制冷材料 可见光-红外光学性能的影响.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 545, doi. 10.14106/j.cnki.1001-2028.2023.1731
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- Article
13
石墨烯压力传感器Au-Si 共晶键合的气密性封装.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 539, doi. 10.14106/j.cnki.1001-2028.2023.1758
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- Article
14
一种模拟输出CMOS 温度传感器的设计与实现.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 534, doi. 10.14106/j.cnki.1001-2028.2023.1740
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- Article
15
基于传感器阵列结合GA-BP 算法对VOC 的识别研究.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 526, doi. 10.14106/j.cnki.1001-2028.2023.1650
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- Article
16
基于三维导电网络多孔敏感层的柔性电阻式应变传感器.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 521, doi. 10.14106/j.cnki.1001-2028.2023.1647
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- Article
17
角蛋白柔性摩擦电人体运动传感器的研究.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 514, doi. 10.14106/j.cnki.1001-2028.2023.1749
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- Article
18
扇出型晶圆级封装可靠性问题与思考.
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- Electronic Components & Materials, 2023, v. 42, n. 5, p. 505, doi. 10.14106/j.cnki.1001-2028.2023.1730
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- Article