激光器芯片烧结用AuSn 薄膜焊料制造技术研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 106, doi. 10.14106/j.cnki.1001-2028.2019.08.018
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- Article
Works matching IS 1001-2028 AND VI 38 AND IP 8 AND DT 2019
Results: 18
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基于超表面的钝二面角结构后向散射增强设计.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 99, doi. 10.14106/j.cnki.1001-2028.2019.08.017
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- Article
3
应用于电小接收天线的非福斯特匹配网络研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 91, doi. 10.14106/j.cnki.1001-2028.2019.08.016
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- Article
4
基于半模基片集成波导的片上小型化太赫兹滤波器.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 87, doi. 10.14106/j.cnki.1001-2028.2019.08.015
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- Article
5
微型化器件中多晶Cu 晶向排布对其受压力学特性 的影响仿真研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 82, doi. 10.14106/j.cnki.1001-2028.2019.08.014
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- Article
6
电解液中金属离子对高压光箔腐蚀行为影响的研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 76, doi. 10.14106/j.cnki.1001-2028.2019.08.013
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- Article
7
基于石墨烯/PDMS 介质层的柔性压力传感器.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 72, doi. 10.14106/j.cnki.1001-2028.2019.08.012
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- Article
8
正交氧化钼传感器的制备和硫化氢气敏性能研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 67, doi. 10.14106/j.cnki.1001-2028.2019.08.011
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- Article
9
Cu 掺杂对Cu-Mn-Co-Ni-O 薄膜结构和性能的影响.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 60, doi. 10.14106/j.cnki.1001-2028.2019.08.010
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- Article
10
大功率 LEDs 用 YMASG : Ce 橙光陶瓷的制备与应用.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 53, doi. 10.14106/j.cnki.1001-2028.2019.08.009
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- Article
11
NiCuZn 铁氧体基复合材料表面波吸波特性研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 48, doi. 10.14106/j.cnki.1001-2028.2019.08.008
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- Article
12
Ag-10Pd 结构及陶瓷中的电解质对银迁移的影响.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 43, doi. 10.14106/j.cnki.1001-2028.2019.08.007
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- Article
13
Y<sup>3+</sup> 掺杂BaTiO<sub>3</sub> 陶瓷的介电弛豫特性研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 35, doi. 10.14106/j.cnki.1001-2028.2019.08.006
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14
PbO 和 Nb<sub>2</sub>O<sub>5</sub> 共掺杂对CaCu<sub>3</sub> Ti<sub>4</sub> O<sub>12</sub> 陶瓷介电性能的影响.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 29, doi. 10.14106/j.cnki.1001-2028.2019.08.005
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15
锰锌铁氧体/锆钛酸铅复合陶瓷微结构及磁电性能研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 20, doi. 10.14106/j.cnki.1001-2028.2019.08.004
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- Article
16
PANi/PPy/GO 复合材料的制备与电化学性能.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 13, doi. 10.14106/j.cnki.1001-2028.2019.08.003
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- Article
17
Fe<sub>2</sub>O<sub>3</sub> 基钙钛矿太阳能电池的环境稳定性研究.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 9, doi. 10.14106/j.cnki.1001-2028.2019.08.002
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18
电子封装无铅互连焊点的电迁移研究进展.
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- Electronic Components & Materials, 2019, v. 38, n. 8, p. 1, doi. 10.14106/j.cnki.1001-2028.2019.08.001
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- Article