Works matching IS 1001-2028 AND VI 37 AND IP 8 AND DT 2018


Results: 17
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    图像传感器封装结构设计与分析.

    Published in:
    Electronic Components & Materials, 2018, v. 37, n. 8, p. 76, doi. 10.14106/j.cnki.1001-2028.2018.08.015
    By:
    • 刘东静;
    • 樊亚松;
    • 潘莹瑛;
    • 秦贤兵
    Publication type:
    Article
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    BT 基无铅压电陶瓷的最新进展.

    Published in:
    Electronic Components & Materials, 2018, v. 37, n. 8, p. 1, doi. 10.14106/j.cnki.1001-2028.2018.08.001
    By:
    • 戴中华;
    • 谢景龙;
    • 琚思懿;
    • 刘卫国
    Publication type:
    Article