Works matching IS 09574522 AND DT 2012 AND VI 23 AND IP 6
1
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1182, doi. 10.1007/s10854-011-0569-5
- Liu, Jialei;
- Xu, Huajun;
- Liu, Xinhou;
- Zhen, Zhen;
- Kuznik, W.;
- Kityk, I.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1151, doi. 10.1007/s10854-011-0563-y
- Badr, A.;
- Ramadan, S.;
- Thorrya, M.
- Article
3
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1169, doi. 10.1007/s10854-011-0567-7
- Article
4
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1193, doi. 10.1007/s10854-011-0571-y
- Wu, Haidong;
- Pu, Yongping;
- Wei, Jifeng;
- Chen, Kai;
- Wang, Bo
- Article
5
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1224, doi. 10.1007/s10854-011-0577-5
- Yang, G.;
- Chen, P.;
- Wu, Z.;
- Yu, Z.;
- Zhao, H.;
- Liu, B.;
- Hua, X.;
- Xie, Z.;
- Xiu, X.;
- Han, P.;
- Shi, Y.;
- Zhang, R.;
- Zheng, Y.
- Article
6
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1268, doi. 10.1007/s10854-011-0585-5
- Thomas, Dhanesh;
- Rethika, K.;
- Sebastian, M.
- Article
7
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1243, doi. 10.1007/s10854-011-0581-9
- Joseph, T.;
- Uma, S.;
- Philip, J.;
- Sebastian, M.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1272, doi. 10.1007/s10854-011-0586-4
- Xue, Peng;
- Xue, Song-bai;
- Shen, Yi-fu;
- Zhu, Hong;
- Gao, Li-li
- Article
9
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1260, doi. 10.1007/s10854-011-0583-7
- Kumar, Sanjeev;
- Sharma, Satinder
- Article
10
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1210, doi. 10.1007/s10854-011-0574-8
- Dong, Xiang;
- Wang, Haiqing;
- Hua, Zhongqiu;
- Peng, Shujie;
- Dong, Liang;
- Wang, Yu
- Article
11
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1255, doi. 10.1007/s10854-011-0582-8
- Vovk, R.;
- Obolenskii, M.;
- Nazyrov, Z.;
- Goulatis, I.;
- Chroneos, A.;
- Pinto Simoes, V.
- Article
12
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1263, doi. 10.1007/s10854-011-0584-6
- Chang, Lantao;
- Wang, Lei;
- Sheng, Xia;
- Luo, Yeping;
- Yang, Deren
- Article
13
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1229, doi. 10.1007/s10854-011-0578-4
- Somphan, Weeraya;
- Sangwong, Nuchjarin;
- Yamwong, Teerapon;
- Thongbai, Prasit
- Article
14
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1235, doi. 10.1007/s10854-011-0580-x
- Article
15
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1201, doi. 10.1007/s10854-011-0573-9
- Anbarasu, Venugopalan;
- Manigandan, Appasamy;
- Karthik, Thangavelu;
- Sivakumar, Kandasamy
- Article
16
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1143, doi. 10.1007/s10854-011-0562-z
- Wu, Jun;
- Qi, Ting;
- Li, Taotao;
- Qin, Qingwei;
- Li, Guangqiang;
- Zhu, Bailin;
- Xiang, Zhidong;
- Xie, Changsheng
- Article
17
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1215, doi. 10.1007/s10854-011-0575-7
- Deng, Huan;
- Deng, Hongmei;
- Yang, Pingxiong;
- Chu, Junhao
- Article
18
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1219, doi. 10.1007/s10854-011-0576-6
- Article
19
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1197, doi. 10.1007/s10854-011-0572-x
- Article
20
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1174, doi. 10.1007/s10854-011-0568-6
- Mehrizi, S.;
- Heydarzadeh Sohi, M.;
- Shafahian, E.;
- Khangholi, A.
- Article
21
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1188, doi. 10.1007/s10854-011-0570-z
- Ju, Yongfeng;
- Wu, Zhiming;
- Li, Shibin;
- Li, Lin;
- Jiang, Yadong
- Article
22
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1163, doi. 10.1007/s10854-011-0565-9
- Venkataraju, C.;
- Satishkumar, G.;
- Sivakumar, K.
- Article
23
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1127, doi. 10.1007/s10854-011-0560-1
- Kanagesan, S.;
- Jesurani, S.;
- Velmurugan, R.;
- Prabu, S.;
- Kalaivani, T.
- Article
24
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1131, doi. 10.1007/s10854-011-0561-0
- Ibrahim, S.;
- Darwish, H.;
- Gomaa, M.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1159, doi. 10.1007/s10854-011-0564-x
- Jiang, Shouzhen;
- Ji, Feifei;
- Shi, Feng
- Article