Works matching IS 09574522 AND DT 2012 AND VI 23 AND IP 1

Results: 50

Enhancement of thermal conductivity of hydrogenated silicon film by microcrystalline structure growth.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 224, doi. 10.1007/s10854-011-0390-1

By:

Li, Shibin;
Jiang, Yadong;
Wu, Zhiming;
Wu, Jiang;
Ying, Zhihua;
Wang, Zhiming;
Li, Wei;
Salamo, Gregory

Publication type:

Article

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 136, doi. 10.1007/s10854-011-0538-z

By:

Tian, Yanhong;
Liu, Wei;
An, Rong;
Zhang, Wei;
Niu, Lina;
Wang, Chunqing

Publication type:

Article

Effects of annealing temperatures on crystalline quality of ceramic thin films by RF-magnetron sputtering using Zn-enriched (BaSr)(ZnNb)O as target.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 164, doi. 10.1007/s10854-011-0375-0

By:

Ji, Feifei;
Shi, Feng;
Wang, Shuyun;
Teng, Shuyun;
Jiang, Shouzhen

Publication type:

Article

Ultra-thin BiFeO nanowires prepared by a sol-gel combustion method: an investigation of its multiferroic and optical properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 180, doi. 10.1007/s10854-011-0379-9

By:

Zhao, Y.;
Miao, J.;
Zhang, X.;
Chen, Y.;
Xu, X.;
Jiang, Y.

Publication type:

Article

Dielectric property and electrical conduction mechanism of ZrO-TiO composite thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 174, doi. 10.1007/s10854-011-0378-x

By:

Dong, Ming;
Wang, Hao;
Shen, Liangping;
Ye, Yun;
Ye, Cong;
Wang, Yi;
Zhang, Jun;
Jiang, Yong

Publication type:

Article

Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 14, doi. 10.1007/s10854-011-0383-0

By:

Wu, Cuiping;
Shen, Jun;
Peng, Changfei

Publication type:

Article

Interface fracture surface energy of sol-gel bonded silicon wafers by three-point bending.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 8, doi. 10.1007/s10854-011-0381-2

By:

Latella, B.;
Ignat, M.

Publication type:

Article

Electrical and optical properties of one-dimensional metallophthalocyanine (M = Fe) thin films grown by thermal evaporation.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 193, doi. 10.1007/s10854-011-0382-1

By:

Sánchez-Vergara, M.;
García-Montalvo, V.;
Alonso-Huitrón, J.;
Rodriguez, A.;
Jiménez-Sandoval, O.

Publication type:

Article

Influence of post-deposition annealing in oxygen ambient on metal-organic decomposed CeO film spin coated on 4H-SiC.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 257, doi. 10.1007/s10854-011-0399-5

By:

Lim, Way;
Cheong, Kuan

Publication type:

Article

The effect of the number of Ag layers on some physical properties of BiPbCaSrCuO.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 212, doi. 10.1007/s10854-011-0389-7

By:

Akdogan, M.;
Erdem, M.;
Terzioglu, C.;
Belenli, I.

Publication type:

Article

Dielectric properties and high-temperature dielectric relaxation of tungsten-bronze structure ceramics BaGdFeNbTaO.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 229, doi. 10.1007/s10854-011-0391-0

By:

Yang, Zhao;
Fang, Liang;
Liu, Laijun;
Hu, Changzhen;
Chen, Xiuli;
Zhou, Huanfu

Publication type:

Article

Dielectric and photoluminesent properties of (CaMgPb)A(TiZr)O [x = 0 & 0.25; A = Nb & Ta] microwave ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 200, doi. 10.1007/s10854-011-0386-x

By:

Suresh, M.;
Padma Kumar, H.;
Wariar, P.;
Thomas, J.;
Solomon, Sam

Publication type:

Article

Preparation and dielectric properties of poly(arylene ether nitrile) containing carboxyl groups/carbon nanotubes composites.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 206, doi. 10.1007/s10854-011-0387-9

By:

Zou, Yanke;
Yang, Jian;
Tang, Hailong;
Zhong, Jiachun;
Zhao, Rui;
Liu, Xiaobo

Publication type:

Article

Dielectric relaxation in complex perovskite Ba(BiTa)O.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 185, doi. 10.1007/s10854-011-0380-3

By:

Mishra, Amodini;
Choudhary, S.;
Choudhary, R.;
Murthy, V.;
Prasad, Kamal

Publication type:

Article

Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 31, doi. 10.1007/s10854-011-0398-6

By:

Çadırlı, E.;
Şahin, M.

Publication type:

Article

Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 22, doi. 10.1007/s10854-011-0388-8

By:

Gao, Hong;
Liu, Lan;
Liu, Konghua;
Luo, Yuanfang;
Jia, Demin;
Lu, Jiasheng

Publication type:

Article

Effects of Nb doping on microstructure and properties of BiTiNbO thin films prepared by magnetron sputtering.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 234, doi. 10.1007/s10854-011-0392-z

By:

Wang, Hua;
Huang, Xiaodan;
Xu, Jiwen;
Yang, Ling;
Zhou, Shangju

Publication type:

Article

Microwave dielectric properties and compatibility with silver of low-fired BaTiNbO ceramics with BaCu(BO) addition.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 238, doi. 10.1007/s10854-011-0393-y

By:

Zhou, Huanfu;
Liu, Xiaobin;
Chen, Xiuli;
Fang, Liang;
Wang, Hong

Publication type:

Article

Bismuth effect in the structural, magnetic and dielectric properties of CoZn ferrite.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 243, doi. 10.1007/s10854-011-0395-9

By:

Sathishkumar, G.;
Venkataraju, C.;
Murugaraj, R.;
Sivakumar, K.

Publication type:

Article

Effect of deposition condition and UV-ozone post-treatment on work function of DC magnetron sputtered AZO thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 267, doi. 10.1007/s10854-011-0400-3

By:

Feng, Quanyu;
Wang, Weiyan;
Jiang, Kemin;
Huang, Jinhua;
Zhang, Yulong;
Song, Weijie;
Tan, Ruiqin

Publication type:

Article

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1

By:

Yoon, Jeong-Won;
Lee, Jong-Gun;
Lee, Jong-Bum;
Noh, Bo-In;
Jung, Seung-Boo

Publication type:

Article

Poly (thienylene methine) grafted nanocrystalline TiO based hybrid solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 251, doi. 10.1007/s10854-011-0397-7

By:

Lu, Shengli;
Sun, Sam-Shajing;
Niu, Junfeng;
Zeng, Ling;
Liu, Heyang;
Zhao, Xianliang

Publication type:

Article

Nanocrystalline TiO thin films for NH monitoring: microstructural and physical characterization.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 273, doi. 10.1007/s10854-011-0403-0

By:

Pawar, S.;
Patil, S.;
Chougule, M.;
Raut, B.;
Mulik, R.;
Patil, V.

Publication type:

Article

Synthesis and characterization of flexible one-dimensional TiO nanocrystalline films.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 295, doi. 10.1007/s10854-011-0408-8

By:

Deng, Jie;
Tao, Jie;
Wu, Tao;
Zhu, Hong

Publication type:

Article

Impact of interfacial solubility on penetration of metals into dielectrics and the mechanism of failure.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 48, doi. 10.1007/s10854-011-0406-x

By:

Plawsky, Joel.;
Gill, William;
Achanta, Ravi

Publication type:

Article

Luminescent properties of GdPO:Eu nanorods.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 285, doi. 10.1007/s10854-011-0405-y

By:

Lai, Hua;
Yang, Xuewei;
Yang, Hua

Publication type:

Article

Ti/NiCu/Ag and Al/NiCu/Ag thin film deposited on positive temperature coefficient (PTC) thermistor by direct current magnetron sputtering.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 290, doi. 10.1007/s10854-011-0407-9

By:

Cen, Jiabao;
Jin, Hao;
Wang, Demiao

Publication type:

Article

Microwave dielectric properties of CaLaTiO-LaAlO system ceramic materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 280, doi. 10.1007/s10854-011-0404-z

By:

Chen, Guo-hua;
Di, Jie-chang;
Xu, Hua-rui;
Yang, Yun;
Yuan, Chang-lai;
Zhou, Chang-rong;
Cheng, Jun;
Liu, Xin-yu

Publication type:

Article

Effects of ZnO and CeO additions on the microstructure and dielectric properties of Mn-modified (BiNa)CaTiO ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 309, doi. 10.1007/s10854-011-0410-1

By:

Yuan, Ying;
Li, Enzhu;
Tang, Bin;
Bo, Li;
Zhou, Xiaohua

Publication type:

Article

Preparation and photocatalytic activity of N-doped TiO nanotube array films.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 320, doi. 10.1007/s10854-011-0413-y

By:

Dang, Mingming;
Zhou, Yi;
Li, Hong;
Lv, Caixia

Publication type:

Article

Reaction behaviour of NiMO's (M = Li, Na) formation and its thermoelectric properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 315, doi. 10.1007/s10854-011-0411-0

By:

Lu, Yun;
Hao, Liang;
Yoshida, Hiroyuki;
Hirohashi, Mitsuji

Publication type:

Article

Suppression of CuSn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 56, doi. 10.1007/s10854-011-0412-z

By:

Yu, Chun;
Yang, Yang;
Li, Peilin;
Chen, Junmei;
Lu, Hao

Publication type:

Article

Pr doped BaMoO octahedron to shuttle-like microcrystals: synthesis and luminescence properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 325, doi. 10.1007/s10854-011-0415-9

By:

Thirumalai, J.;
Chandramohan, R.;
Basheer Ahamed, M.;
Ezhilvizhian, S.;
Vijayan, T.

Publication type:

Article

Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 61, doi. 10.1007/s10854-011-0414-x

By:

Wang, Dong-Liang;
Yuan, Yuan;
Luo, Le

Publication type:

Article

Photovoltaic properties of nanocrystalline CdS films deposited by SILAR and CBD techniques-a comparative study.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 302, doi. 10.1007/s10854-011-0409-7

By:

Senthamilselvi, V.;
Saravanakumar, K.;
Jabena Begum, N.;
Anandhi, R.;
Ravichandran, A.;
Sakthivel, B.;
Ravichandran, K.

Publication type:

Article

Effect of Ti on the interfacial reaction between Sn and Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 68, doi. 10.1007/s10854-011-0426-6

By:

Vuorinen, V.;
Dong, H.;
Laurila, T.

Publication type:

Article

Growth and consumption rates of the phase layers during interdiffusion in a diffusion couple with finite end member.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 75, doi. 10.1007/s10854-011-0438-2

By:

Prasad, S.;
Paul, A.

Publication type:

Article

Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 2, doi. 10.1007/s10854-011-0376-z

By:

Zou, Changdong;
Gao, Yulai;
Yang, Bin;
Zhai, Qijie

Publication type:

Article

Synthesis and magnetic properties of NiFe/NiFeO nanocomposite.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 169, doi. 10.1007/s10854-011-0377-y

By:

Li, Shuiming;
Wang, Lei;
Yang, Hua

Publication type:

Article

Effects of addition of copper particles of different size to Sn-3.5Ag solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 86, doi. 10.1007/s10854-011-0441-7

By:

Nadia, Aemi;
Haseeb, A.

Publication type:

Article

Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 94, doi. 10.1007/s10854-011-0469-8

By:

Negm, Samia

Publication type:

Article

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5AlO composite solder/Cu interface during soldering reaction.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 100, doi. 10.1007/s10854-011-0476-9

By:

Chang, S.;
Tsao, L.;
Wu, M.;
Chen, C.

Publication type:

Article

Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 108, doi. 10.1007/s10854-011-0485-8

By:

Yang, Xiaojian;
He, Wei;
Wang, Shouxu;
Zhou, Guoyun;
Tang, Yao

Publication type:

Article

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 124, doi. 10.1007/s10854-011-0516-5

By:

Yu, Chun;
Yang, Yang;
Wang, Kaiyun;
Xu, Jijin;
Chen, Junmei;
Lu, Hao

Publication type:

Article

Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 115, doi. 10.1007/s10854-011-0511-x

By:

Haque, A.;
Lim, B.;
Haseeb, A.;
Masjuki, H.

Publication type:

Article

Optimization of Bosch etch process for vertically stacked Si nanowires.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 334, doi. 10.1007/s10854-011-0534-3

By:

Guo, Qing;
Wang, Tao;
Sheng, Kuang;
Yu, Bin

Publication type:

Article

Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 130, doi. 10.1007/s10854-011-0536-1

By:

Wei, G.;
Huang, Y.

Publication type:

Article

Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 148, doi. 10.1007/s10854-011-0552-1

By:

Wang, Mingna;
Wang, Jianqiu;
Feng, Hao;
Ke, Wei

Publication type:

Article

Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 156, doi. 10.1007/s10854-011-0566-8

By:

Shen, Jun;
Wu, Cuiping;
Li, Shizeng

Publication type:

Article

Featured issue: Lead-free solder and packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 1, doi. 10.1007/s10854-011-0593-5

By:

Willoughby, Arthur

Publication type:

Article