Works matching IS 09574522 AND DT 2010 AND VI 21 AND IP 7
1
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 649, doi. 10.1007/s10854-009-9971-7
- Dunmin Lin;
- Qiaoji Zheng;
- Kwok, K. W.;
- Chenggang Xu;
- Chun Yang
- Article
2
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 726, doi. 10.1007/s10854-009-9985-1
- Majchrowski, A.;
- Ebothe, J.;
- Sanetra, J.;
- Ozga, K.;
- Kityk, I. V.;
- Reshak, A. H.;
- Lukasiewicz, T.
- Article
3
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 737, doi. 10.1007/s10854-009-9987-z
- Shirazi, A.;
- Lu, H.;
- Varvani-Farahani, A.
- Article
4
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 698, doi. 10.1007/s10854-009-9980-6
- Hankare, P. P.;
- Manikshete, A. H.;
- Sathe, D. J.;
- Chate, P. A.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 671, doi. 10.1007/s10854-009-9975-3
- XinAn Zhang;
- JingWen Zhang;
- WeiFeng Zhang;
- Xun Hou
- Article
6
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 666, doi. 10.1007/s10854-009-9974-4
- Ning, B. Q.;
- Jiang, H.;
- Yan, Z. S.
- Article
7
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 659, doi. 10.1007/s10854-009-9973-5
- Miedzinski, R.;
- Ebothe, J.;
- Fuks-Janczarek, I.;
- Kityk, I. V.;
- Majchrowski, A.;
- Weglowski, R.;
- Klosowicz, S. J.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 708, doi. 10.1007/s10854-009-9982-4
- Kun Jia;
- RuiZhao;
- Jiachun Zhong;
- Xiaobo Liu
- Article
9
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 676, doi. 10.1007/s10854-009-9976-2
- Hong He;
- Yongge Cao;
- Renli Fu;
- Wang, Hai;
- Jiquan Huang;
- Changgang Huang;
- Meili Wang;
- Zhonghua Deng
- Article
10
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 713, doi. 10.1007/s10854-009-9983-3
- Jinting Jiu;
- Keiichi Murai;
- Keunsoo Kim;
- Katsuaki Suganuma
- Article
11
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 643, doi. 10.1007/s10854-009-9970-8
- Lili Gao;
- Songbai Xue;
- Liang Zhang;
- Zhong Sheng;
- Guang Zeng;
- Feng Ji
- Article
12
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 687, doi. 10.1007/s10854-009-9978-0
- Article
13
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 702, doi. 10.1007/s10854-009-9981-5
- Tai, F.;
- Guo, F.;
- Xia, Z. D.;
- Lei, Y. P.;
- Shi, Y. W.
- Article
14
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 719, doi. 10.1007/s10854-009-9984-2
- WenXue Chen;
- Songbai Xue;
- Hui Wang;
- YuHua Hu;
- Jianxin Wang
- Article
15
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 730, doi. 10.1007/s10854-009-9986-0
- Article
16
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 656, doi. 10.1007/s10854-009-9972-6
- Qing Zhi Shi;
- Ze Sheng Yan
- Article
17
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 682, doi. 10.1007/s10854-009-9977-1
- Shengli Lu;
- Sam-Shajing Sun;
- Xiaoxia Jiang;
- Jianwei Mao;
- Tiehu Li;
- Kexi Wan
- Article
18
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 692, doi. 10.1007/s10854-009-9979-z
- Yildiz, A.;
- Lisesivdin, S. B.;
- Kasap, M.;
- Mardare, Diana
- Article