Found: 18
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A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 421, doi. 10.1007/s10854-010-0086-y
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- Article
The effect of post-annealing under CdCl<sub>2</sub> atmosphere on the properties of ITO thin films deposited by DC magnetron sputtering.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 441, doi. 10.1007/s10854-009-9932-1
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- Article
InAs quantum dot superluminescent diodes with trench structure.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 445, doi. 10.1007/s10854-009-9936-x
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Formation mechanism of NaNbO<sub>3</sub> powders during hydrothermal synthesis.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 450, doi. 10.1007/s10854-009-9937-9
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Dielectric and ferromagnetic properties of BaTiO<sub>3</sub>/Ni<sub>0.93</sub>Co<sub>0.02</sub>Cu<sub>0.05</sub>Fe<sub>2</sub>O<sub>4</sub> composites.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 456, doi. 10.1007/s10854-009-9938-8
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- Article
Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 461, doi. 10.1007/s10854-009-9939-7
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Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 468, doi. 10.1007/s10854-009-9940-1
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- Article
Analysis of weakly bonded oxygen in HfO<sub>2</sub>/SiO<sub>2</sub>/Si stacks by using HRBS and ARXPS.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 475, doi. 10.1007/s10854-009-9941-0
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- Article
Effect of oxygen to argon ratio on the properties of thin SiO<sub> x</sub> films deposited by r.f. sputtering.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 481, doi. 10.1007/s10854-009-9942-z
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- Article
Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 486, doi. 10.1007/s10854-009-9943-y
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- Article
Electrical properties of the CdS/InP solar cell for photovoltaic applications.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 491, doi. 10.1007/s10854-009-9944-x
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- Article
Investigation on properties of Ga to Sn–9Zn lead-free solder.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 496, doi. 10.1007/s10854-009-9945-9
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- Article
Structural and electrical properties of fritless Ni<sub>(1− x)</sub>Cu<sub> x</sub>Mn<sub>2</sub>O<sub>4</sub> (0 ≤ x ≤ 1) thick film NTC ceramic.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 503, doi. 10.1007/s10854-009-9946-8
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- Article
Carbon helixes produced by hot filament assisted chemical vapor deposition.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 509, doi. 10.1007/s10854-009-9947-7
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- Article
Orientation controlling of Pb(Zr<sub>0.53</sub>Ti<sub>0.47</sub>)O<sub>3</sub> thin films prepared on silicon substrates with the thickness of La<sub>0.5</sub>Sr<sub>0.5</sub>CoO<sub>3</sub> electrodes.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 514, doi. 10.1007/s10854-009-9948-6
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Phase transition and domain variation contributions to piezoelectric properties of alkaline niobate based lead-free systems.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 519, doi. 10.1007/s10854-009-9949-5
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- Article
Photocatalytic activities of hollow and hierarchical Bi<sub>3.15</sub>Nd<sub>0.85</sub>Ti<sub>3</sub>O<sub>12</sub> microspheres synthesized through a hydrothermal process.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 523, doi. 10.1007/s10854-009-9950-z
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- Article
Optical and electrical properties of Mg<sub> x</sub>Zn<sub>1− x</sub>O thin films by sol–gel method.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 529, doi. 10.1007/s10854-009-9952-x
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