Works matching IS 09574522 AND DT 2009 AND VI 20 AND IP 8
1
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 782, doi. 10.1007/s10854-008-9802-2
- Pavlović, M.;
- Jovalekić, Č.;
- Nikolić, A. S.;
- Manojlović, D.;
- Šojić, N.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 718, doi. 10.1007/s10854-008-9793-z
- Article
3
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 709, doi. 10.1007/s10854-008-9789-8
- Fu, Y. B.;
- Ma, R. B.;
- Chen, Y. M.;
- Jiang, D. D.;
- Zhang, Q. Y.;
- Ma, X. H.
- Article
4
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 695, doi. 10.1007/s10854-008-9787-x
- Fuke, Madhavi V.;
- Vijayan, Anu;
- Kanitkar, Prajakta;
- Kulkarni, Milind;
- Kale, B. B.;
- Aiyer, R. C.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 704, doi. 10.1007/s10854-008-9788-9
- Hyun Ho Shin;
- Yang Hee Joung;
- Seong Jun Kang
- Article
6
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 713, doi. 10.1007/s10854-008-9791-1
- El-Gamal, S.;
- Bishay, A. G.;
- Fikry, W.;
- Diab, S. M.;
- Eid, S.
- Article
7
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 741, doi. 10.1007/s10854-008-9796-9
- Hui Zhang;
- Liang Fang;
- Heping Su;
- Xuemin Cui
- Article
8
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 771, doi. 10.1007/s10854-008-9800-4
- Panda, S. K.;
- Singh, N.;
- Pal, S.;
- Jacob, C.
- Article
9
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 756, doi. 10.1007/s10854-008-9798-7
- Dong Zou;
- Qi-Long Zhang;
- Hui Yang
- Article
10
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 776, doi. 10.1007/s10854-008-9801-3
- Hankare, P. P.;
- Chate, P. A.;
- Sathe, D. J.;
- Patil, A. A.
- Article
11
- 2009
- Zheng, Y.;
- Pearson, J.;
- Tan, R.;
- Gillin, W.;
- Wyatt, P.
- Correction Notice
12
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 685, doi. 10.1007/s10854-009-9895-2
- Liang Zhang;
- Song-bai Xue;
- Li-li Gao;
- Guang Zeng;
- Zhong Sheng;
- Yan Chen;
- Sheng-lin Yu
- Article
13
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 727, doi. 10.1007/s10854-008-9794-y
- Thanikaikarasan, S.;
- Mahalingam, T.;
- Raja, M.;
- Taekyu Kim;
- Yong Deak Kim
- Article
14
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 735, doi. 10.1007/s10854-008-9795-x
- Guo, R. H.;
- Jiang, S. Q.;
- Yuen, C. W. M.;
- Ng, M. C. F.
- Article
15
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 745, doi. 10.1007/s10854-008-9797-8
- Shukla, Archana;
- Choudhary, R. N. P.;
- Thakur, A. K.
- Article
16
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 761, doi. 10.1007/s10854-008-9799-6
- Yan-Ling Luo;
- Qing-Bo Wei;
- Ya-Shao Chen;
- Ting-Ting Huo
- Article