Works matching IS 09574522 AND DT 2009 AND VI 20 AND IP 7
1
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 619, doi. 10.1007/s10854-008-9775-1
- Maie, Hiroki;
- Lee, Burtrand I.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 587, doi. 10.1007/s10854-008-9770-6
- Anjana, Prabhakaran Sreekumari;
- Jawahar, Isuhak Naseema;
- Sebastian, Mailadil Thomas
- Article
3
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 614, doi. 10.1007/s10854-008-9774-2
- Wang, Bo;
- Yang, Chuan-ren;
- Chen, Hong-wei;
- Zhang, Ji-hua;
- Yu, An;
- Zhang, Rui-ting
- Article
4
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 628, doi. 10.1007/s10854-008-9776-0
- Liu, H. L.;
- Yang, J. H.;
- Zhang, Y. J.;
- Wang, Y. X.;
- Wei, M. B.;
- Wang, D. D.;
- Zhao, L. Y.;
- Lang, J. H.;
- Gao, M.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 597, doi. 10.1007/s10854-008-9771-5
- Tang, Huaijun;
- Tang, Hao;
- Zhang, Zhiguo;
- Cong, Changjie;
- Zhang, Keli
- Article
6
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 609, doi. 10.1007/s10854-008-9773-3
- Cui, Fangming;
- Wang, Lei;
- Xi, Zhenqiang;
- Sun, Yun;
- Yang, Deren
- Article
7
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 604, doi. 10.1007/s10854-008-9772-4
- Bai, Shr-Nan;
- Tseng, Tseung-Yuen
- Article
8
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 637, doi. 10.1007/s10854-008-9778-y
- El-Kheshen, A. A.;
- Zawrah, M. F.;
- Awaad, M.
- Article
9
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 675, doi. 10.1007/s10854-008-9785-z
- Xu, R. L.;
- Liu, Y. C.;
- Han, Y. J.;
- Wei, C.;
- Wang, X.;
- Yu, L. M.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 632, doi. 10.1007/s10854-008-9777-z
- Kanamadi, C. M.;
- Kulkarni, S. R.;
- Chougule, B. K.;
- Jeong, Jung Hyun;
- Choi, Byung Chun;
- Kang, Young Soo
- Article
11
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 644, doi. 10.1007/s10854-008-9779-x
- Yang, Haibo;
- Lin, Ying;
- Zhu, Jianfeng;
- Wang, Fen;
- Luo, Hongjie
- Article
12
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 648, doi. 10.1007/s10854-008-9780-4
- Renukappa, N. M.;
- Siddaramaiah;
- Sudhaker Samuel, R. D.;
- Sundara Rajan, J.;
- Lee, Joong Hee
- Article
13
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 671, doi. 10.1007/s10854-008-9784-0
- Yu, Qian;
- Fang, Liang;
- Zhang, Hui;
- Su, Heping
- Article
14
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 680, doi. 10.1007/s10854-008-9786-y
- Jo, Soo Kyong;
- Han, Young Ho
- Article
15
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 666, doi. 10.1007/s10854-008-9783-1
- D’Urzo, Lucia;
- Bozzini, Benedetto
- Article
16
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 657, doi. 10.1007/s10854-008-9781-3
- Yang, Haibo;
- Lin, Ying;
- Zhu, Jianfeng;
- Wang, Fen
- Article
17
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 661, doi. 10.1007/s10854-008-9782-2
- Chen, Qi;
- Zeng, Guanggen;
- Song, Huijin;
- Zheng, Jiagui;
- Feng, Lianghuan
- Article