Works matching IS 09574522 AND DT 2009 AND VI 20 AND IP 3
1
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 197, doi. 10.1007/s10854-008-9698-x
- Liu, C.;
- Zhang, B.;
- Lu, Z.;
- Binh, N.;
- Wakatsuki, K.;
- Segawa, Y.;
- Mu, R.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 223, doi. 10.1007/s10854-008-9706-1
- Manivannan, S.;
- Jeong, Il;
- Ryu, Je;
- Lee, Chang;
- Kim, Ki;
- Jang, Jin;
- Park, Kyu
- Article
3
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 212, doi. 10.1007/s10854-008-9701-6
- Zuo, Ruzhong;
- Fu, Jian;
- Su, Shi;
- Fang, Xusheng;
- Cao, Jiang-Li
- Article
4
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 206, doi. 10.1007/s10854-008-9700-7
- Murali, K.;
- Thirumoorthy, P.;
- Sengodan, V.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 234, doi. 10.1007/s10854-008-9709-y
- Lao, Yeh-Wu;
- Kuo, Shu-Ting;
- Tuan, Wei-Hsing
- Article
6
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 217, doi. 10.1007/s10854-008-9705-2
- D’Urzo, Lucia;
- Bozzini, Benedetto
- Article
7
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 202, doi. 10.1007/s10854-008-9699-9
- Gao, Huazhong;
- Shao, Mingwang;
- Wang, Sheng;
- Fu, Yan
- Article
8
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 262, doi. 10.1007/s10854-008-9717-y
- Zhou, Xiaohua;
- Li, Bo;
- Zhang, Shuren;
- Ning, Haiyan
- Article
9
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 248, doi. 10.1007/s10854-008-9711-4
- Article
10
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 230, doi. 10.1007/s10854-008-9708-z
- Majid, Abdul;
- Ali, Akbar;
- Zhu, J.;
- Wang, Y.
- Article
11
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 242, doi. 10.1007/s10854-008-9710-5
- Savić, S.;
- Stojanović, G.;
- Nikolić, M.;
- Aleksić, O.;
- Luković Golić, D.;
- Nikolić, P.
- Article
12
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 267, doi. 10.1007/s10854-008-9718-x
- Pradhan, Basudev;
- Sharma, Ashwani;
- Ray, Asim
- Article
13
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 276, doi. 10.1007/s10854-008-9720-3
- Article
14
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 289, doi. 10.1007/s10854-008-9831-x
- Matuchova, Marie;
- Zdansky, Karel;
- Zavadil, Jiri;
- Danilewsky, Andreas;
- Maixner, Jaroslav;
- Alexiev, Dimitri
- Article
15
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 272, doi. 10.1007/s10854-008-9719-9
- Shen, Xiang;
- Li, Haifeng;
- Li, HaiHua;
- Nie, Jianghua
- Article
16
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 253, doi. 10.1007/s10854-008-9712-3
- Bai, Shr-Nan;
- Tseng, Tseung-Yuen
- Article
17
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 257, doi. 10.1007/s10854-008-9716-z
- Article
18
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 283, doi. 10.1007/s10854-008-9721-2
- Zhou, Huanfu;
- Wang, Hong;
- Li, Kecheng;
- Yao, Xi
- Article