Works matching IS 09574522 AND DT 2009 AND VI 20 AND IP 11
1
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1073, doi. 10.1007/s10854-008-9828-5
- Kolev, T.;
- Koleva, B.;
- Kasperczyk, J.;
- Kityk, Ivan;
- Tkaczyk, S.;
- Spiteler, M.;
- Reshak, Ali H.;
- Kuznik, W.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1068, doi. 10.1007/s10854-008-9827-6
- Manna, Jhimli Sarkar;
- Basu, S.;
- Mitra, M. K.;
- Mukherjee, S.;
- Das, Gopes Chandra
- Article
3
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1078, doi. 10.1007/s10854-008-9829-4
- Hongmei Deng;
- Jing Kong;
- Pingxiong Yang
- Article
4
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1090, doi. 10.1007/s10854-008-9832-9
- Ying Yuan;
- Shuren Zhang;
- Xiaohua Zhou
- Article
5
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1083, doi. 10.1007/s10854-008-9830-y
- Sefton, D. E.;
- Rist, M. A.;
- Gungor, S.
- Article
6
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1112, doi. 10.1007/s10854-008-9835-6
- Jie Chen;
- Jun Shen;
- Dong Min;
- Changfei Peng
- Article
7
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1095, doi. 10.1007/s10854-008-9833-8
- Mikla, V. I.;
- Mikla, V. V.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1106, doi. 10.1007/s10854-008-9834-7
- Shuwang Ma;
- Guixia Dong;
- Zhimin Yang;
- Jun Du
- Article
9
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1123, doi. 10.1007/s10854-008-9837-4
- Bo Li;
- Xiaohua Zhou;
- Shuren Zhang;
- Hongmei Jiang
- Article
10
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1118, doi. 10.1007/s10854-008-9836-5
- Guo, C.;
- Tang, Y. H.;
- Zhang, E. L.;
- Li, X. C.;
- Li, J. L.
- Article
11
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1135, doi. 10.1007/s10854-008-9839-2
- Haikui Zhu;
- Hongqing Zhou;
- Min Liu;
- Pengfei Wei;
- Guijun Xu;
- Ge Ning
- Article
12
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1129, doi. 10.1007/s10854-008-9838-3
- Devika, M.;
- Reddy, N. Koteeswara;
- Reddy, S. Venkatramana;
- Ramesh, K.;
- Gunasekhar, K. R.
- Article
13
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1150, doi. 10.1007/s10854-008-9842-7
- Jun, Jina;
- Sunghoon Park;
- Jaeho Lee;
- Chongmu Lee
- Article
14
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1154, doi. 10.1007/s10854-008-9843-6
- Ke Wang;
- Paine, Mark D.;
- Stark, John P. W.
- Article
15
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1140, doi. 10.1007/s10854-008-9840-9
- Ruzhong Zuo;
- Hongqiang Wang;
- Bing Ma;
- Longtu Li
- Article
16
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8
- Pequegnat, A.;
- Hang, C. J.;
- Mayer, M.;
- Zhou, Y.;
- Moon, J. T.;
- Persic, J.
- Article
17
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1039, doi. 10.1007/s10854-009-9927-y
- Mohammedy, Farseem M.;
- Deen, M. Jamal
- Article
18
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1059, doi. 10.1007/s10854-009-9951-y
- Mikla, V. I.;
- Mikla, V. V.
- Article