Works matching IS 09574522 AND DT 2008 AND VI 19 AND IP 6
1
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 563, doi. 10.1007/s10854-007-9387-1
- Jing, X. M.;
- Engelmann, G.;
- Chen, D.;
- Wolf, J.;
- Ehrmann, O.;
- Reichl, H.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 500, doi. 10.1007/s10854-007-9370-x
- Pakhomov, Georgy L.;
- Kosterin, Dmitry A.;
- Pakhomov, Lev G.;
- Guo, Tzung-Fang
- Article
3
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 553, doi. 10.1007/s10854-007-9385-3
- He, Anqiang;
- Liu, Qi;
- Ivey, Douglas G.
- Article
4
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 577, doi. 10.1007/s10854-007-9392-4
- Şakar-Deliormanlı, Aylin;
- Çelik, Erdal;
- Polat, Mehmet
- Article
5
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 584, doi. 10.1007/s10854-007-9393-3
- Ardelean, Ioan;
- Cora, Simona
- Article
6
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 543, doi. 10.1007/s10854-007-9383-5
- Dongyun Gui;
- Hui Zhang;
- Liang Fang;
- Lihui Xue
- Article
7
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 533, doi. 10.1007/s10854-007-9376-4
- Murali, K. R.;
- Saravanan, T.;
- Jayachandran, M.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 493, doi. 10.1007/s10854-008-9604-6
- Basu, P. K.;
- Saha, N.;
- Maji, S.;
- Saha, H.;
- Basu, Sukumar
- Article
9
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 509, doi. 10.1007/s10854-007-9372-8
- Haitao Xu;
- Hua Yang;
- Lei Lu
- Article
10
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 505, doi. 10.1007/s10854-007-9371-9
- Shunhua Wu;
- Shuang Wang;
- Liying Chen;
- Xiaoyong Wang
- Article
11
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 528, doi. 10.1007/s10854-007-9375-5
- Yeon-Keon Moon;
- Borae Bang;
- Se-Hyun Kim;
- Chang-Oh Jeong;
- Jong-Wan Park
- Article
12
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 538, doi. 10.1007/s10854-007-9377-3
- Dong, Weiwei;
- Zhu, Xuebin;
- Tao, Ruhua;
- Fang, Xiaodong
- Article
13
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 514, doi. 10.1007/s10854-007-9374-6
- Yong Sun;
- Jin Liang;
- Zhi-Hui Xu;
- Guofeng Wang;
- Xiaodong Li
- Article
14
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 522, doi. 10.1007/s10854-007-9373-7
- Jagtap, Shweta;
- Deshpande, Varsha;
- Rane, Vivek;
- Rane, Sunit;
- Phatak, Girish;
- Amalnerkar, Dinesh
- Article
15
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 547, doi. 10.1007/s10854-007-9384-4
- Garje, Anil D.;
- Aiyer, Rohini C.
- Article
16
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 569, doi. 10.1007/s10854-007-9391-5
- Hasanuzzaman, Mohammad;
- Haddara, Yaser M.
- Article