Works matching IS 09574522 AND DT 2008 AND VI 19 AND IP 2
1
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 131, doi. 10.1007/s10854-007-9305-6
- Usui, Hiroyuki;
- Yasuda, Hidehiro;
- Mori, Hirotaro
- Article
2
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 111, doi. 10.1007/s10854-007-9311-8
- Article
3
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 167, doi. 10.1007/s10854-007-9329-y
- Takakura, K.;
- Kudou, T.;
- Hayama, K.;
- Shigaki, K.;
- Ohyama, H.;
- Kayamoto, K.;
- Shibuya, M.
- Article
4
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 203, doi. 10.1007/s10854-007-9333-2
- Yoshino, K.;
- Oyama, S.;
- Yoneta, M.
- Article
6
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 137, doi. 10.1007/s10854-007-9306-5
- Reentilä, O.;
- Lankinen, A.;
- Mattila, M.;
- Säynätjoki, A.;
- Tuomi, T. O.;
- Lipsanen, H.;
- O'Reilly, L.;
- McNally, P. J.
- Article
7
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 149, doi. 10.1007/s10854-007-9303-8
- Säynätjoki, A.;
- Lankinen, A.;
- Tuomi, T. O.;
- McNally, P. J.;
- Danilewsky, A.;
- Zhilyaev, Y.;
- Fedorov, L.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 103, doi. 10.1007/s10854-007-9310-9
- Natarajan, Gomathi;
- Rajendra Kumar, R. T.;
- Daniels, S.;
- Cameron, D. C.;
- McNally, P. J.
- Article
9
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 161, doi. 10.1007/s10854-007-9301-x
- Hayama, K.;
- Takakura, K.;
- Ohyama, H.;
- Rafí, J. M.;
- Mercha, A.;
- Simoen, E.;
- Claeys, C.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 125, doi. 10.1007/s10854-007-9308-3
- Article
11
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 99, doi. 10.1007/s10854-007-9309-2
- Lucas, Francis Olabanji;
- Mitra, A.;
- McNally, P. J.;
- O'Reilly, L.;
- Daniels, S.;
- Natarajan, Gomathi;
- Durose, K.;
- Proskuryakov, Y. Y.;
- Cameron, D. C.
- Article
12
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 179, doi. 10.1007/s10854-007-9299-0
- Iamraksa, P.;
- Lloyd, N. S.;
- Bagnall, D. M.
- Article
13
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 183, doi. 10.1007/s10854-007-9300-y
- Pengpad, P.;
- Bagnall, D. M.
- Article
14
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 107, doi. 10.1007/s10854-007-9336-z
- Fitriawan, Helmy;
- Ogawa, Matsuto;
- Souma, Satofumi;
- Miyoshi, Tanroku
- Article
15
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 115, doi. 10.1007/s10854-007-9328-z
- Fossati, D.;
- Beitia, C.;
- Plantier, L.;
- Imbert, G.;
- Passefort, S.;
- Desbois, M.;
- Volpi, F.;
- Royer, J.-C.
- Article
16
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 175, doi. 10.1007/s10854-007-9330-5
- Ohyama, H.;
- Takakura, K.;
- Uemura, K.;
- Shigaki, K.;
- Kudou, T.;
- Matsumoto, T.;
- Arai, M.;
- Kuboyama, S.;
- Kamezawa, C.;
- Simoen, E.;
- Claeys, C.
- Article
17
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 143, doi. 10.1007/s10854-007-9307-4
- Lankinen, A.;
- Lang, T.;
- Suihkonen, S.;
- Svensk, O.;
- Säynätjoki, A.;
- Tuomi, T. O.;
- McNally, P. J.;
- Odnoblyudov, M.;
- Bougrov, V.;
- Danilewsky, A. N.;
- Bergman, P.;
- Simon, R.
- Article
18
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 199, doi. 10.1007/s10854-007-9332-3
- Yoshino, K.;
- Yoneta, M.;
- Yonenaga, I.
- Article
19
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 119, doi. 10.1007/s10854-007-9337-y
- McNeill, D. W.;
- Bhattacharya, S.;
- Wadsworth, H.;
- Ruddell, F. H.;
- Mitchell, S. J. N.;
- Armstrong, B. M.;
- Gamble, H. S.
- Article
20
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 189, doi. 10.1007/s10854-007-9298-1
- Cuerdo, R.;
- Pedrós, J.;
- Navarro, A.;
- Braña, A. F.;
- Pau, J. L.;
- Muñoz, E.;
- Calle, F.
- Article
21
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 195, doi. 10.1007/s10854-007-9331-4
- Tilak, V.;
- Jiang, J.;
- Batoni, P.;
- Knobloch, A.
- Article
22
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 171, doi. 10.1007/s10854-007-9302-9
- Ohyama, H.;
- Shitogiden, H.;
- Takakura, K.;
- Shigaki, K.;
- Kuboyama, S.;
- Kamesawa, C.;
- Simoen, E.;
- Claeys, C.
- Article
23
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 155, doi. 10.1007/s10854-007-9304-7
- Prieto, A. C.;
- Torres, A.;
- Jiménez, J.;
- Rodríguez, A.;
- Sangrador, J.;
- Rodríguez, T.
- Article