Works matching IS 09574522 AND DT 2007 AND VI 18 AND IP 8
1
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 863, doi. 10.1007/s10854-007-9143-6
- Xiangchun Liu;
- Feng Gao;
- Lili Zhao;
- Changsheng Tian
- Article
2
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 805, doi. 10.1007/s10854-007-9210-z
- Article
3
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 887, doi. 10.1007/s10854-006-9062-y
- Wenjian Leng;
- Chuanren Yang;
- Hong Ji;
- Jihua Zhang;
- Jinlong Tang;
- Hongwei Chen;
- Lifeng Gao
- Article
4
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 869, doi. 10.1007/s10854-007-9149-0
- Zheng-Jian Qi;
- Wei-Dong Feng;
- Yue-Ming Sun;
- Da-Zhi Yan;
- Yan-Fang He;
- Jing Yu
- Article
5
- 2007
- Currie, James R.;
- Batra, Ashok K.;
- Alim, Mohammad A.;
- Aggarwal, Manmohan D.;
- Lal, Ravindra B.
- Correction Notice
6
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 883, doi. 10.1007/s10854-006-9108-1
- Ying Luo;
- Xinyu Liu;
- Xvqiong Li;
- Jun Cheng
- Article
7
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 877, doi. 10.1007/s10854-006-9081-8
- Zhang, Tianjin;
- Wang, Jinzhao;
- Zhang, Baishun;
- Jiang, Juan;
- Pan, Runkun;
- He, Jun
- Article
8
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 831, doi. 10.1007/s10854-006-9112-5
- Jacob, Lovely;
- Kumar, H. Padma;
- Gopchandran, K. G.;
- Thomas, Jijimon K.;
- Solomon, Sam
- Article
9
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 823, doi. 10.1007/s10854-006-9105-4
- Bhattacharyya, P.;
- Basu, P. K.;
- Mukherjee, N.;
- Mondal, A.;
- Saha, H.;
- Basu, S.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 893, doi. 10.1007/s10854-007-9125-8
- Jihoon Oh;
- Sunyoung Chang;
- Jiyoung Jang;
- Seungkwang Roh;
- Jaehong Park;
- Jungwoo Lee;
- Daewon Sohn;
- Whikun Yi;
- Yeongri Jung;
- Sung-Jin Kim
- Article
11
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 847, doi. 10.1007/s10854-006-9088-1
- Tan, S. Y.;
- Sung, C. L.;
- Wu, W. F.
- Article
12
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 855, doi. 10.1007/s10854-006-9089-0
- Liu, Y. C.;
- Shi, Q. Z.;
- Zhao, Q.;
- Ma, Z. Q.
- Article
13
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 843, doi. 10.1007/s10854-006-9060-0
- Md. Salleh, F.;
- Yahya, A. K.;
- Jumali, M. H.;
- Awang, Z.
- Article
14
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 837, doi. 10.1007/s10854-006-9087-2
- Ardelean, I.;
- Lungu, R.;
- Păşcutţ, P.
- Article
15
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 817, doi. 10.1007/s10854-007-9257-x
- Wencheng Hu;
- Lin Zhu;
- Dong Dong;
- Wei He;
- Xianzhong Tang;
- Xiaobo Liu
- Article
16
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 811, doi. 10.1007/s10854-006-9086-3
- Vovk, R. V.;
- Obolenskii, M. A.;
- Zavgorodniy, A. A.;
- Bondarenko, A. V.;
- Goulatis, I. L.;
- Chroneos, A.
- Article