Design of solder joints for fundamental studies on the effects of electromigration.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 569, doi. 10.1007/s10854-007-9263-z
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- Publication type:
- Article
Works matching IS 09574522 AND DT 2007 AND VI 18 AND IP 6
Results: 16
1
2
Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 655, doi. 10.1007/s10854-007-9118-7
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- Publication type:
- Article
3
Elimination of current non-uniformity in carbon nanotube field emitters.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 677, doi. 10.1007/s10854-006-9079-2
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- Publication type:
- Article
4
Electrical properties of iron phthalocyanine thin film device using gold and aluminium electrodes.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 587, doi. 10.1007/s10854-006-9082-7
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- Publication type:
- Article
5
Piezoelectric and optical properties of ZnO thin films deposited using various O<sub>2</sub>/(Ar+O<sub>2</sub>) gas ratios.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 647, doi. 10.1007/s10854-007-9142-7
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- Publication type:
- Article
6
Whisker nucleation in indentation residual stress field on tin plated component leads.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 599, doi. 10.1007/s10854-007-9153-4
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- Publication type:
- Article
7
Study of electrical and microstructure properties of high dielectric hafnium oxide thin film for MOS devices.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 615, doi. 10.1007/s10854-006-9111-6
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- Publication type:
- Article
8
Electrodeposition and characterization of CdSe semiconductor thin films.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 575, doi. 10.1007/s10854-007-9141-8
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- Publication type:
- Article
9
Ferroelectric properties of modified Ba-based perovskite compound and its solid solution with BaTiO<sub>3</sub>.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 671, doi. 10.1007/s10854-006-9055-x
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- Publication type:
- Article
10
Effect of frequency and current density on A.C. etching of aluminum electrolytic capacitor foil.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 627, doi. 10.1007/s10854-006-9058-7
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- Publication type:
- Article
11
Styrene butadiene rubber/aluminum powder composites—mechanical, morphological and electrical behaviors.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 635, doi. 10.1007/s10854-006-9077-4
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- Publication type:
- Article
12
Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 665, doi. 10.1007/s10854-006-9078-3
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- Publication type:
- Article
13
Improvement of Ge/Pd/GaAs ohmic contact by In layer.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 621, doi. 10.1007/s10854-007-9122-y
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- Publication type:
- Article
14
Compositional effects on the properties of (1- x)BaTiO<sub>3</sub>- xBi<sub>0.5</sub>Na<sub>0.5</sub>TiO<sub>3</sub> ceramics.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 605, doi. 10.1007/s10854-007-9128-5
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- Publication type:
- Article
15
Dye-sensitized solar cell based on nanocrystalline TiO<sub>2</sub> with 3–10 nm in diameter.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 593, doi. 10.1007/s10854-006-9100-9
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- Publication type:
- Article
16
Aluminum doped ZnO by reactive sputtering of coaxial Zn and Al metallic targets.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 611, doi. 10.1007/s10854-006-9115-2
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- Publication type:
- Article