Studies on electrosynthesized zinc mercury selenide alloys.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1013, doi. 10.1007/s10854-007-9134-7
- By:
- Publication type:
- Article
Works matching IS 09574522 AND DT 2007 AND VI 18 AND IP 10
Results: 15
1
2
Behavior of ultra fine silver-BaTiO3 composite powders at sintering.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1031, doi. 10.1007/s10854-007-9133-8
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- Publication type:
- Article
3
Magnetic properties of Nd-Y<sub>3</sub>Fe<sub>5</sub>O<sub>12</sub> nanoparticles.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1065, doi. 10.1007/s10854-007-9130-y
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- Publication type:
- Article
4
Direct robust bonding between Sn-based solder and Si substrate.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1057, doi. 10.1007/s10854-006-9114-3
- By:
- Publication type:
- Article
5
Copper nitride films deposited by dc reactive magnetron sputtering.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1003, doi. 10.1007/s10854-007-9120-0
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- Publication type:
- Article
6
The effect of fumed silica in the polymer gel electrolyte on the cycle efficiency of lithium deposition/striping process.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 997, doi. 10.1007/s10854-006-9091-6
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- Publication type:
- Article
7
Structural and electrical properties of Ba(Fe<sub>1/3</sub>Nb<sub>1/3</sub>Ta<sub>1/3</sub>)O<sub>3</sub> perovskite.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 991, doi. 10.1007/s10854-007-9342-1
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- Publication type:
- Article
8
Effect of LP-buffer on the structure of ZnO thin films prepared on glass substrate using RF magnetron sputtering.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1021, doi. 10.1007/s10854-007-9273-x
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- Publication type:
- Article
9
A new binderless thick-film piezoelectric paste.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1037, doi. 10.1007/s10854-007-9275-8
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- Publication type:
- Article
10
Structural and magnetic studies of CTAC-assisted NiZn ferrite films by spray deposition.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1045, doi. 10.1007/s10854-007-9258-9
- By:
- Publication type:
- Article
11
Stress reduction during phase change in Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> by capping TiN film.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1079, doi. 10.1007/s10854-007-9260-2
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- Publication type:
- Article
12
The size effect in current–voltage characteristic of VO<sub>2</sub>-based ceramics in the on-state.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1009, doi. 10.1007/s10854-006-9106-3
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- Publication type:
- Article
13
High transmittance–low resistivity cadmium oxide films grown by reactive pulsed laser deposition.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1027, doi. 10.1007/s10854-007-9129-4
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- Publication type:
- Article
14
Room-temperature indentation creep of lead-free Sn–Bi solder alloys.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1071, doi. 10.1007/s10854-007-9124-9
- By:
- Publication type:
- Article
15
Effect of substrate on hydrogen in and out diffusion from a-Si:H thin films.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1051, doi. 10.1007/s10854-007-9123-x
- By:
- Publication type:
- Article