Works matching IS 09574522 AND DT 2007 AND VI 18 AND IP 1-3

Results: 24

Electromigration issues in lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 259

By:

Chih Chen;
S. Liang

Publication type:

Article

Impact of the ROHS directive on high-performance electronic systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 331

By:

Karl Puttlitz;
George Galyon

Publication type:

Article

Life expectancies of Pb-free SAC solder interconnects in electronic hardware.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 229

By:

Michael Osterman;
Abhijit Dasgupta

Publication type:

Article

Sn–Zn low temperature solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 121

By:

Katsuaki Suganuma;
Kuen-Soo Kim

Publication type:

Article

Tin pest issues in lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 307

By:

W. Plumbridge

Publication type:

Article

Mechanical fatigue of Sn-rich Pb-free solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 211

By:

Q. Zeng;
L. Zhang;
Q. Zhu

Publication type:

Article

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 93

By:

Paul Vianco;
Jerome Rejent;
Arlo Fossum;
Michael Neilsen

Publication type:

Article

Phase Diagrams of Pb-Free Solders and their Related Materials Systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 19

By:

Sinn-Wen Chen;
Chao-Hong Wang;
Shih-Kang Lin;
Chen-Nan Chiu

Publication type:

Article

Interfacial reaction issues for lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 155

By:

C. Ho;
S. Yang;
C. Kao

Publication type:

Article

Processing and material issues related to lead-free soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 147

By:

Laura Turbini

Publication type:

Article

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 175

By:

N. Chawla;
R. Sidhu

Publication type:

Article

Issues related to the implementation of Pb-free electronic solders in consumer electronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 319

By:

D. Frear

Publication type:

Article

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 247

By:

Seung-Hyun Chae;
Xuefeng Zhang;
Kuan-Hsun Lu;
Huang-Lin Chao;
Paul Ho;
Min Ding;
Peng Su;
Trent Uehling;
Lakshmi Ramanathan

Publication type:

Article

Deformation behavior of tin and some tin alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 191

By:

Fuqian Yang;
J. C. M. Li

Publication type:

Article

Preface.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 1

By:

K. Subramanian

Publication type:

Article

Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 237

By:

K. Subramanian

Publication type:

Article

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 39

By:

D. Swenson

Publication type:

Article

Thermodynamics and phase diagrams of lead-free solder materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 3

By:

H. Ipser;
H. Flandorfer;
Ch. Luef;
C. Schmetterer;
U. Saeed

Publication type:

Article

Stress analysis of spontaneous Sn whisker growth.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 269

By:

K. Tu;
Chih Chen;
Albert Wu

Publication type:

Article

Impact of the ROHS Directive on high-performance electronic systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 347

By:

Karl Puttlitz;
George Galyon

Publication type:

Article

Composite lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 129

By:

Fu Guo

Publication type:

Article

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 55

By:

Iver Anderson

Publication type:

Article

Rare-earth additions to lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 77

By:

C. Wu;
Y. Wong

Publication type:

Article

Sn-whiskers: truths and myths.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 283

By:

J. Osenbach;
J. DeLucca;
B. Potteiger;
A. Amin;
F. Baiocchi

Publication type:

Article