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Preparation of the LTCC composite ceramics with low permittivity.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 453, doi. 10.1007/s10854-010-0158-z
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- Article
Preparation and piezoelectric properties of CuO-doped (NaK)NbO ceramics by the citrate precursor method.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 458, doi. 10.1007/s10854-010-0159-y
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- Article
Epitaxial growth mechanism of LaZrO thin film on metal substrate.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 474, doi. 10.1007/s10854-010-0162-3
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Synthesis, sintering behavior and magnetic properties of Cu-substituted CoZ hexagonal ferrites.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 467, doi. 10.1007/s10854-010-0161-4
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Optical and structural properties of TiO films as a function of Nb doping concentration.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 463, doi. 10.1007/s10854-010-0160-5
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- Article
Capacitance-voltage characteristics of Pt/BiVO/p-Si structures.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 488, doi. 10.1007/s10854-010-0165-0
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- Article
Optical, structural and surface characterization of CdO:Mg films.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 492, doi. 10.1007/s10854-010-0166-z
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Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 481, doi. 10.1007/s10854-010-0163-2
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- Article
Fabrication of high Tc lead free (1 − x)BaTiO- xBiKTiO positive temperature coefficient of resistivity ceramics using reoxidation method.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 551, doi. 10.1007/s10854-010-0176-x
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Optical and electrical properties of Bi doped ZnO thin films deposited by ultrasonic spray pyrolysis.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 499, doi. 10.1007/s10854-010-0167-y
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- Article
Effect of different copper fillers on the electrical resistivity of conductive adhesives.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 538, doi. 10.1007/s10854-010-0174-z
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- Article
Room temperature ferromagnetic behavior of Eu doped CdZnS nanoparticles.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 523, doi. 10.1007/s10854-010-0171-2
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- Article
Effect of dispersibility of silver powders in conductive paste on microstructure of screen-printed front contacts and electrical performance of crystalline silicon solar cells.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 527, doi. 10.1007/s10854-010-0172-1
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Improvement in the dielectric properties of Ba(NdBi)TiO( x = 1-1.5) ceramics by LiBSi/BaLiF glass additives.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 561, doi. 10.1007/s10854-010-0178-8
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Structural and optical properties of AgSeTe nano thin films prepared by thermal evaporation.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 545, doi. 10.1007/s10854-010-0175-y
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Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 531, doi. 10.1007/s10854-010-0173-0
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Electrical properties of LiNiFeCuVO ceramics.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 506, doi. 10.1007/s10854-010-0168-x
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- Article
Effects of TiO-SiO fillers on thermal and dielectric properties of bismuth glass microcomposite dielectrics for plasma display panel.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 515, doi. 10.1007/s10854-010-0170-3
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Preparation of Eu-Y co-doping red-emitting phosphors for white-light emitting diodes (W-LEDs) application and investigation of their optical characteristics.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 510, doi. 10.1007/s10854-010-0169-9
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High permeability and stress insensitivity of MgCuZn-NiCuZn ferrite composites for microinductor applications.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 555, doi. 10.1007/s10854-010-0177-9
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