Found: 13
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Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 885, doi. 10.1007/s10854-008-9811-1
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- Article
Effect of halogen substitution on azo-naphthol dye based poly(alkyloxymethacrylate)s and their Z-scan measurements.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 835, doi. 10.1007/s10854-008-9803-1
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- Article
Incoherent transport and pseudo-gap in HoBa<sub>2</sub>Cu<sub>3</sub>O<sub>7−δ</sub> single crystals with different oxygen content.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 858, doi. 10.1007/s10854-008-9806-y
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- Article
Plasma treatment effects on surface morphology and field emission characteristics of carbon nanotubes.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 851, doi. 10.1007/s10854-008-9805-z
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- Article
Function of glycine during solid-state reaction toward well-crystallized fine particulate barium titanate.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 844, doi. 10.1007/s10854-008-9804-0
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- Article
Preparation and characterization of soluble and DBSA doped polyaniline grafted multi-walled carbon nanotubes nano-composite.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 891, doi. 10.1007/s10854-008-9812-0
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- Article
Low temperature sintering and microwave dielectric properties of MgNb<sub>2</sub>O<sub>6</sub> ceramics.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 867, doi. 10.1007/s10854-008-9808-9
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- Article
Formation of interfacial structure of Sn–3.7Ag–0.9Zn eutectic solder with different Al additions.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 861, doi. 10.1007/s10854-008-9807-x
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- Article
Microwave ferrites, part 1: fundamental properties.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 789, doi. 10.1007/s10854-009-9923-2
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- Article
Influence of post-deposition annealing on the microstructure and properties of Ga<sub>2</sub>O<sub>3</sub>:Mn thin films deposited by RF planar magnetron sputtering.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 879, doi. 10.1007/s10854-008-9810-2
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- Article
Controllable synthesis and luminescence property of CePO<sub>4</sub>:Tb nanorods.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 899, doi. 10.1007/s10854-008-9813-z
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- Article
Structural investigation of xFe<sub>2</sub>O<sub>3</sub> · (100 − x)[P<sub>2</sub>O<sub>5</sub> · TeO<sub>2</sub>] glass system by FT-IR study and EPR spectroscopy.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 905, doi. 10.1007/s10854-008-9814-y
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- Article
Dielectric and impedance properties of Nd<sub>3/2</sub>Bi<sub>3/2</sub>Fe<sub>5</sub>O<sub>12</sub> ceramics.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 872, doi. 10.1007/s10854-008-9809-8
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- Article