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Works matching IS 09540083 AND DT 2025 AND VI 37 AND IP 5

Results: 5

1

Preparation and properties of soluble thermoplastic polyimides with phenol side-groups for flexible copper clad laminates.

Published in:

High Performance Polymers, 2025, v. 37, n. 5, p. 271, doi. 10.1177/09540083251323202

By:

He, Juan;
Niu, Xiang;
Chen, Wenqiu;
Chen, Wei;
Yu, Yang;
Fan, Hepin

Publication type:

Article

2

Low-dielectric polyimide resins with improved processability and thermal properties.

Published in:

High Performance Polymers, 2025, v. 37, n. 5, p. 300, doi. 10.1177/09540083251323204

By:

Hong, Guoqing;
Meng, Xiangsheng;
Chen, Aimin;
Yan, Jingling;
Wang, Zhen

Publication type:

Article

3

Unlocking efficiency: Imidazole-nitrile based catalyst as latent thermal curative for improved epoxy resin curing and exploring mechanical behavior.

Published in:

High Performance Polymers, 2025, v. 37, n. 5, p. 286, doi. 10.1177/09540083251323197

By:

Mohamed Mydeen, K;
Krishnasamy, Balaji;
Ramachandran, Sasikumar;
Muthukaruppan, Alagar

Publication type:

Article

4

Thermomechanical response of high performance benzoxazine/epoxy polymers based nanocomposites.

Published in:

High Performance Polymers, 2025, v. 37, n. 5, p. 314, doi. 10.1177/09540083251322519

By:

Tikarrouchine, El-hadi;
Mehelli, Oussama;
Tria, Djalel Eddine;
Bouteldja, Amar;
Hemmouche, Larbi;
Rezig, Naima;
Derradji, Mehdi

Publication type:

Article

5

Photosensitive polyimide with high pattern stability and low thermal expansion coefficient based on poly (amic acid) containing dual cross-linked groups.

Published in:

High Performance Polymers, 2025, v. 37, n. 5, p. 328, doi. 10.1177/09540083251322534

By:

Zhou, Lei;
Chen, Shengyu;
Fei, Chentao;
Min, Yonggang

Publication type:

Article