Works matching IS 09359648 AND DT 2002 AND VI 14 AND IP 18
1
- Advanced Materials, 2002, v. 14, n. 18, p. 1297, doi. 10.1002/1521-4095(20020916)14:18<1297::AID-ADMA1297>3.0.CO;2-I
- Maillou, T.;
- Le Moigne, J.;
- Dumarcher, V.;
- Rocha, L.;
- Geffroy, B.;
- Nunzi, J.-M.
- Article
2
- Advanced Materials, 2002, v. 14, n. 18, p. 1279, doi. 10.1002/1521-4095(20020916)14:18<1279::AID-ADMA1279>3.0.CO;2-A
- Smay, J.E.;
- Gratson, G.M.;
- Shepherd, R.F.;
- Cesarano, J.;
- Lewis, J.A.
- Article
3
- Advanced Materials, 2002, v. 14, n. 18, p. 1311, doi. 10.1002/1521-4095(20020916)14:18<1311::AID-ADMA1311>3.0.CO;2-R
- Wang, S.;
- Choi, D.-G.;
- Yang, S.-M.
- Article
4
- Advanced Materials, 2002, v. 14, n. 18, p. 1304, doi. 10.1002/1521-4095(20020916)14:18<1304::AID-ADMA1304>3.0.CO;2-B
- Vander Wal, R.L.;
- Hall, L.J.
- Article
5
- Advanced Materials, 2002, v. 14, n. 18, p. 1270, doi. 10.1002/1521-4095(20020916)14:18<1270::AID-ADMA1270>3.0.CO;2-R
- Schmedake, T.A.;
- Cunin, F.;
- Link, J.R.;
- Sailor, M.J.
- Article
6
- Advanced Materials, 2002, v. 14, n. 18, p. 1308, doi. 10.1002/1521-4095(20020916)14:18<1308::AID-ADMA1308>3.0.CO;2-O
- Shang, G.;
- Meng, F.Y.;
- Au, F.C.K.;
- Li, Q.;
- Lee, C.S.;
- Bello, I.;
- Lee, S.T.
- Article
7
- Advanced Materials, 2002, v. 14, n. 18, p. 1267, doi. 10.1002/1521-4095(20020916)14:18<1267::AID-ADMA1267>3.0.CO;2-O
- Article
8
- Advanced Materials, 2002, v. 14, n. 18, p. 1321, doi. 10.1002/1521-4095(20020916)14:18<1321::AID-ADMA1321>3.0.CO;2-P
- Adams, T.B.;
- Sinclair, D.C.;
- West, A.R.
- Article
9
- Advanced Materials, 2002, v. 14, n. 18, p. 1314, doi. 10.1002/1521-4095(20020916)14:18<1314::AID-ADMA1314>3.0.CO;2-9
- Article
10
- Advanced Materials, 2002, v. 14, n. 18, p. 1251, doi. 10.1002/1521-4095(20020916)14:18<1251::AID-ADMA1251>3.0.CO;2-P
- Article
11
- Advanced Materials, 2002, v. 14, n. 18, p. 1284, doi. 10.1002/1521-4095(20020916)14:18<1284::AID-ADMA1284>3.0.CO;2-1
- Sumioka, K.;
- Kayashima, H.;
- Tsutsui, T.
- Article
12
- Advanced Materials, 2002, v. 14, n. 18, p. 1290, doi. 10.1002/1521-4095(20020916)14:18<1290::AID-ADMA1290>3.0.CO;2-N
- Guarini, K.W.;
- Black, C.T.;
- Yeung, S.H.I.
- Article
13
- Advanced Materials, 2002, v. 14, n. 18, p. 1261, doi. 10.1002/1521-4095(20020916)14:18<1261::AID-ADMA1261>3.0.CO;2-N
- Zuccarello, G.;
- Scribner, D.;
- Sands, R.;
- Buckley, L.J.
- Article
14
- Advanced Materials, 2002, v. 14, n. 18, p. 1272, doi. 10.1002/1521-4095(20020916)14:18<1272::AID-ADMA1272>3.0.CO;2-F
- Ichikawa, M.;
- Yanagi, H.;
- Shimizu, Y.;
- Hotta, S.;
- Suganuma, N.;
- Koyama, T.;
- Taniguchi, Y.
- Article
15
- Advanced Materials, 2002, v. 14, n. 18, p. 1317, doi. 10.1002/1521-4095(20020916)14:18<1317::AID-ADMA1317>3.0.CO;2-S
- Li, Y.Q.;
- Fung, M.K.;
- Xie, Z.;
- Lee, S.-T.;
- Hung, L.-S.;
- Shi, J.
- Article
16
- Advanced Materials, 2002, v. 14, n. 18, p. 1294, doi. 10.1002/1521-4095(20020916)14:18<1294::AID-ADMA1294>3.0.CO;2-#
- Cao, L.M.;
- Hahn, K.;
- Wang, Y.Q.;
- Scheu, C.;
- Zhang, Z.;
- Gao, C.X.;
- Li, Y.C.;
- Zhang, X.Y.;
- Sun, L.L.;
- Wang, W.K.;
- Rühle, M.
- Article
17
- Advanced Materials, 2002, v. 14, n. 18, p. 1301, doi. 10.1002/1521-4095(20020916)14:18<1301::AID-ADMA1301>3.0.CO;2-T
- Rama Rao, G.V.;
- López, G.P.;
- Bravo, J.;
- Pham, H.;
- Datye, A.K.;
- Xu, H.F.;
- Ward, T.L.
- Article
18
- Advanced Materials, 2002, v. 14, n. 18, p. 1323, doi. 10.1002/1521-4095(20020916)14:18<1323::AID-ADMA1323>3.0.CO;2-D
- Sheeney-Haj-Ichia, L.;
- Wasserman, J.;
- Willner, I.
- Article
19
- Advanced Materials, 2002, v. 14, n. 18, p. 1275, doi. 10.1002/1521-4095(20020916)14:18<1275::AID-ADMA1275>3.0.CO;2-Y
- Lim, H.;
- Cho, W.-J.;
- Ha, C.-S.;
- Ando, S.;
- Kim, Y.-K.;
- Park, C.-H.;
- Lee, K.
- Article
20
- Advanced Materials, 2002, v. 14, n. 18, p. 1286, doi. 10.1002/1521-4095(20020916)14:18<1286::AID-ADMA1286>3.0.CO;2-Q
- Riveros, G.;
- Guillemoles, J.F.;
- Lincot, D.;
- Gomez Meier, H.;
- Froment, M.;
- Bernard, M.C.;
- Cortes, R.
- Article
21
- Advanced Materials, 2002, v. 14, n. 18, p. 1257, doi. 10.1002/1521-4095(20020916)14:18<1257::AID-ADMA1257>3.0.CO;2-Q
- Article
