Test Technology Newsletter.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 7, doi. 10.1007/s10836-023-06056-9
- Publication type:
- Article
Works matching IS 09238174 AND DT 2023 AND VI 39 AND IP 1
Results: 12
1
2
2022 Reviewers.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 5, doi. 10.1007/s10836-023-06053-y
- Publication type:
- Article
3
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Editorial
4
Intrinsic Based Self-healing Adder Design Using Chromosome Reconstruction Algorithm.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 111, doi. 10.1007/s10836-023-06050-1
- By:
- Publication type:
- Article
5
Journal of Electronic Testing: Theory and Applications New Editors – 2023.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 3, doi. 10.1007/s10836-023-06049-8
- Publication type:
- Article
6
Fault Detection and Diagnosis of DMFB Using Concurrent Electrodes Actuation.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 89, doi. 10.1007/s10836-023-06048-9
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- Publication type:
- Article
7
A Weighted-Bin Difference Method for Issue Site Identification in Analog and Mixed-Signal Multi-Site Testing.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 57, doi. 10.1007/s10836-023-06047-w
- By:
- Publication type:
- Article
8
Network-on-Chip and Photonic Network-on-Chip Basic Concepts: A Survey.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 11, doi. 10.1007/s10836-023-06046-x
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- Publication type:
- Article
9
DFS-KeyLevel: A Two-Layer Test Scenario Generation Approach for UML Activity Diagram.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 71, doi. 10.1007/s10836-023-06045-y
- By:
- Publication type:
- Article
10
Identifying Resistive Open Defects in Embedded Cells under Variations.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 27, doi. 10.1007/s10836-023-06044-z
- By:
- Publication type:
- Article
11
An Investigation into the Failure Characteristics of External PCB Traces with Different Angle Bends.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 103, doi. 10.1007/s10836-023-06043-0
- By:
- Publication type:
- Article
12
Refined Self-calibration of an Inductorless Low-noise Amplifier with Non-intrusive Circuit.
- Published in:
- Journal of Electronic Testing, 2023, v. 39, n. 1, p. 41, doi. 10.1007/s10836-022-06042-7
- By:
- Publication type:
- Article