Works matching IS 09149244 AND DT 2024 AND VI 37 AND IP 5
Results: 16
Meeting Challenges of Advanced Packaging Designs with a Preimidized Polymer as Dielectric Material.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 561, doi. 10.2494/photopolymer.37.561
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Composite Membrane of Bi<sub>2</sub>WO<sub>6</sub>-NCQDs Laminated Hetero-junction Loaded on PES Support for Photo-catalytic Degradation of Organic Pollutants.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 545, doi. 10.2494/photopolymer.37.545
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Ultrasound-Assisted Degradation of Poly(p-tert-butoxycarbonyloxystyrene) using TiO2 and Photoacid Generators.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 541, doi. 10.2494/photopolymer.37.541
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Molecular Dynamics Study of Dependence of Loading Pressure on Shear Properties of Organic Nanofilms.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 533, doi. 10.2494/photopolymer.37.533
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Heat Treatment for a Membrane Composed of Polymer Nanofibers and a Perfluorosulfonic-Acid Polymer Matrix: Effect on Proton-ExchangeMembrane Properties.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 523, doi. 10.2494/photopolymer.37.523
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- Article
Relationship between Tg of Polyimide Resin and Resist Sensitivity in Three-Component Chemically Amplified Polyimide Resist.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 517, doi. 10.2494/photopolymer.37.517
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Thermal, Optical, and Dielectric Properties of Bio-based Polyimides Derived from an Isosorbide-containing Dianhydride and Diamines with Long Alkyl Chains.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 507, doi. 10.2494/photopolymer.37.507
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- Article
Development of A Low k Thermosetting Resin Based on 5,5’6,6’-Tetrahydroxy-3,3,3’,3’- Tetramethylspirobisindane with Decafluorobiphenyl Having Ethynyl Terminals.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 497, doi. 10.2494/photopolymer.37.497
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Synthesis and Structural Characterization of Polyimide Containing Diphenylsiloxane Unit.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 489, doi. 10.2494/photopolymer.37.489
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Polyimide-based Release Material for Rapid and Precise Mass Transfer of Semiconductor Chips.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 485, doi. 10.2494/photopolymer.37.485
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- Article
Novel Low Df Photosensitive Materials for Redistribution Layer.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 481, doi. 10.2494/photopolymer.37.481
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- Article
Application of Self-aligned Quadruple Patterning to Fabrication of Nanoimprint Mold with Sub-12-nm Half-pitch.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 475, doi. 10.2494/photopolymer.37.475
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Durability Test of Replica Mold in UV Nanoimprinting and Enlargement of Mold Patterned Area by Mold Stitching.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 469, doi. 10.2494/photopolymer.37.469
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Hybrid Soft Replica Molds for Residual Layer-Free Patterning.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 465, doi. 10.2494/photopolymer.37.465
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Feature-size Control by Pattern Transfer Etching in Nanoimprint Lithography for Half-pitch 24 nm Damascene Interconnect.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 449, doi. 10.2494/photopolymer.37.449
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- Article
Nanoimprint Lithography for Collagen Micropatterning at Low-Temperature 5°C with TiO<sub>2</sub>-SiO<sub>2</sub> Gas-Permeable Porous Mold.
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- Journal of Photopolymer Science & Technology, 2024, v. 37, n. 5, p. 457, doi. 10.2494/photopolymer.37.457
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- Article