Works matching IS 07306679 AND DT 2000 AND VI 19 AND IP 2
Results: 7
Thermal behavior and electrical conductivity of poly(vinyl pyridine)/copper complexes.
- Published in:
- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 113, doi. 10.1002/(SICI)1098-2329(200022)19:2<113::AID-ADV4>3.0.CO;2-G
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Degradation mechanism and kinetics of a high thermally stable aromatic polyamide.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 120, doi. 10.1002/(SICI)1098-2329(200022)19:2<120::AID-ADV5>3.0.CO;2-L
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Growth of gas bubbles in the foam extrusion process.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 97, doi. 10.1002/(SICI)1098-2329(200022)19:2<97::AID-ADV3>3.0.CO;2-B
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News from the Polymer Processing Institute.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 140, doi. 10.1002/(SICI)1098-2329(200022)19:2<140::AID-ADV7>3.0.CO;2-D
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Surrounding temperature effects on extruded polyethylene foam structure.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 87, doi. 10.1002/(SICI)1098-2329(200022)19:2<87::AID-ADV2>3.0.CO;2-F
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Temperature distributions of molten polypropylene during injection molding.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 79, doi. 10.1002/(SICI)1098-2329(200022)19:2<79::AID-ADV1>3.0.CO;2-D
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Processability, mechanical properties, and electrical conductivities of carbon black-filled ethylene-vinyl acetate copolymers.
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- Advances in Polymer Technology, 2000, v. 19, n. 2, p. 132, doi. 10.1002/(SICI)1098-2329(200022)19:2<132::AID-ADV6>3.0.CO;2-B
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- Article