Works matching IS 04247760 AND DT 2019 AND VI 206 AND IP 2
Results: 8
Metal‐bonding‐based hermetic wafer‐level MEMS packaging technology using in‐plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 44, doi. 10.1002/eej.23193
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- Article
A power smoothing control method for a photovoltaic generation system using a water electrolyzer and its filtering characteristics.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 25, doi. 10.1002/eej.23191
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- Article
Touch fault calculation method on transmission lines stringing on the same tower based on symmetrical coordinate method.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 16, doi. 10.1002/eej.23172
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- Article
Blockchain technology outline and its application to field of power and energy system.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 11, doi. 10.1002/eej.23167
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- Article
Electromagnetic silicon MEMS resonator.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 54, doi. 10.1002/eej.23154
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- Article
Evaluation of hemiplegia caused by stroke by using joint detection of depth sensors—case of SIAS.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 33, doi. 10.1002/eej.23152
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- Article
Performance of surface ionic conduction single chamber fuel cell prepared by the sol gel method.
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- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 3, doi. 10.1002/eej.23137
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- Article
Issue Information.
- Published in:
- Electrical Engineering in Japan, 2019, v. 206, n. 2, p. 1, doi. 10.1002/eej.23121
- Publication type:
- Article