Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging.
- Published in:
- International Journal of Fracture, 2022, v. 236, n. 1, p. 109, doi. 10.1007/s10704-022-00637-z
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- Publication type:
- Article
Works matching IS 03769429 AND DT 2022 AND VI 236 AND IP 1
Results: 5
1
2
Simulation of dynamic brittle and quasi-brittle fracture: a revisited local damage approach.
- Published in:
- International Journal of Fracture, 2022, v. 236, n. 1, p. 59, doi. 10.1007/s10704-022-00635-1
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- Publication type:
- Article
3
Adaptive modelling of dynamic brittle fracture - a combined phase field regularized cohesive zone model and scaled boundary finite element approach.
- Published in:
- International Journal of Fracture, 2022, v. 236, n. 1, p. 87, doi. 10.1007/s10704-022-00634-2
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- Publication type:
- Article
4
Interaction of crack and hole: effects on crack trajectory, crack driving force and fracture toughness.
- Published in:
- International Journal of Fracture, 2022, v. 236, n. 1, p. 33, doi. 10.1007/s10704-021-00611-1
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- Publication type:
- Article
5
Experimental fracture mechanics analysis of tearing in oriented polyethylene films using digital image correlation and full-field solid mechanics post-processing.
- Published in:
- International Journal of Fracture, 2022, v. 236, n. 1, p. 1, doi. 10.1007/s10704-021-00600-4
- By:
- Publication type:
- Article