Works matching IS 03769429 AND DT 2003 AND VI 119 AND IP 4

Results: 19

Channel cracking in thin films on substrates of finite thickness.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 299, doi. 10.1023/A:1024962825938

By:

Vlassak, J.J.

Publication type:

Article

Channel cracking during thermal cycling of thin film multi-layers.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 325, doi. 10.1023/A:1024915510009

By:

Begley, M.R.;
Ambrico, J.M.

Publication type:

Article

In situ TEM observations of fracture in nanolaminated metallic thin films.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 351, doi. 10.1023/A:1024967510917

By:

Foecke, T.;
Kramer, D.E.

Publication type:

Article

Flow and fracture of free-standing Ag and Cu thin films and Ag/Cu multilayers.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 359, doi. 10.1023/A:1024971611826

By:

Haibo Huang;
Yu, Denis Y.W.;
Verdier, Marc;
Spaepen, Frans

Publication type:

Article

Co-planar crack interaction in cleaved mica.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 365, doi. 10.1023/A:1024975728664

By:

Hill, J.C.;
Bennison, S.J.;
Klein, P.A.;
Foulk, J.W.;
Jagota, A.;
Saigal, S.

Publication type:

Article

Length scales for the fracture of nanostructures.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 387, doi. 10.1023/A:1024927812734

By:

Gerberich, William W.;
Jungk, John M.;
Min Li;
Volinsky, Alex A.;
Hoehn, Joel W.;
Yoder, Karl

Publication type:

Article

Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 407, doi. 10.1023/A:1024979829573

By:

Moody, N.R.;
Adams, D.P.;
Medlin, D.;
Headley, T.;
Yang, N.;
Volinsky, A.

Publication type:

Article

Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 421, doi. 10.1023/A:1024931913643

By:

Scherban, T.;
Pantuso, D.;
Sun, B.;
El-Mansy, S.;
Xu, J.;
Elizalde, M.R.;
Sánchez, J.M.;
Martínez-Esnaola, J.M.

Publication type:

Article

Fiducial mark and CTOA estimates of thin film adhesion.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 431, doi. 10.1023/A:1024983930481

By:

Volinsky, Alex A.;
Moody, Neville R.;
Gerberich, William W.

Publication type:

Article

Measurement of the noibium/sapphire interface toughness via delamination.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 000, doi. 10.1023/A:1024936014552

By:

Je, H.;
Was, G.S.;
Thouless, M.D.

Publication type:

Article

High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 449, doi. 10.1023/A:1024988031390

By:

Muhlstein, C.L.;
Ritchie, R.O.

Publication type:

Article

Adhesion of polymer thin-films and patterned lines.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 475, doi. 10.1023/A:1024940132299

By:

Litteken, Christopher S.;
Dauskardt, Reinhold H.

Publication type:

Article

CTOD for the through-the-thickness crack in a plate of arbitrary thickness.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. L99, doi. 10.1023/A:1024909018990

By:

Kotousov, Andrei

Publication type:

Article

Indentation induced film fracture in hard film – soft substrate systems.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 339, doi. 10.1023/A:1024979030155

By:

Bahr, D.F.;
Woodcock, C.L.;
Pang, M.;
Weaver, K.D.;
Moody, N.R.

Publication type:

Article

Eshelby's formula for an ellipsoidal elastic inclusion in anisotropic poroelasticity and thermoelasticity.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. L79, doi. 10.1023/A:1024907500335

By:

Levin, Valery M.;
Alvarez-Tostado, Juan M.

Publication type:

Article

Path-independent integrals and crack extension force for functionally graded materials.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. L83, doi. 10.1023/A:1024900717173

By:

Shi Weichen

Publication type:

Article

Stress concentration around a strongly oblate spheroidal cavity in a transversely isotropic medium.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. L91, doi. 10.1023/A:1024952702152

By:

Chun-Ron Chiang

Publication type:

Article

Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. 487, doi. 10.1023/A:1024944316369

By:

Vella, J.B.;
Adhihetty, I.S.;
Junker, K.;
Volinsky, A.A.

Publication type:

Article

Micromechanics modeling of plastic yielding in a solid containing mode III cohesive cracks.

Published in:

International Journal of Fracture, 2003, v. 119, n. 4, p. L105, doi. 10.1023/A:1024961003969

By:

Shaofan Li;
Morgan, Elise F.

Publication type:

Article