Works matching IS 03769429 AND DT 2003 AND VI 119 AND IP 4
Results: 19
Channel cracking in thin films on substrates of finite thickness.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 299, doi. 10.1023/A:1024962825938
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Channel cracking during thermal cycling of thin film multi-layers.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 325, doi. 10.1023/A:1024915510009
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In situ TEM observations of fracture in nanolaminated metallic thin films.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 351, doi. 10.1023/A:1024967510917
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Flow and fracture of free-standing Ag and Cu thin films and Ag/Cu multilayers.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 359, doi. 10.1023/A:1024971611826
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- Article
Co-planar crack interaction in cleaved mica.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 365, doi. 10.1023/A:1024975728664
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Length scales for the fracture of nanostructures.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 387, doi. 10.1023/A:1024927812734
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Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 407, doi. 10.1023/A:1024979829573
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Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 421, doi. 10.1023/A:1024931913643
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Fiducial mark and CTOA estimates of thin film adhesion.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 431, doi. 10.1023/A:1024983930481
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Measurement of the noibium/sapphire interface toughness via delamination.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 000, doi. 10.1023/A:1024936014552
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High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 449, doi. 10.1023/A:1024988031390
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Adhesion of polymer thin-films and patterned lines.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 475, doi. 10.1023/A:1024940132299
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CTOD for the through-the-thickness crack in a plate of arbitrary thickness.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. L99, doi. 10.1023/A:1024909018990
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- Article
Indentation induced film fracture in hard film – soft substrate systems.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 339, doi. 10.1023/A:1024979030155
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Eshelby's formula for an ellipsoidal elastic inclusion in anisotropic poroelasticity and thermoelasticity.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. L79, doi. 10.1023/A:1024907500335
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Path-independent integrals and crack extension force for functionally graded materials.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. L83, doi. 10.1023/A:1024900717173
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Stress concentration around a strongly oblate spheroidal cavity in a transversely isotropic medium.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. L91, doi. 10.1023/A:1024952702152
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Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. 487, doi. 10.1023/A:1024944316369
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Micromechanics modeling of plastic yielding in a solid containing mode III cohesive cracks.
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- International Journal of Fracture, 2003, v. 119, n. 4, p. L105, doi. 10.1023/A:1024961003969
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