Thermal loading of a thin layer with circular debonding over a substrate.
- Published in:
- International Journal of Fracture, 1998, v. 91, n. 3, p. 217, doi. 10.1023/A:1007441514577
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- Publication type:
- Article
Works matching IS 03769429 AND DT 1998 AND VI 91 AND IP 3
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