Works matching IS 03615235 AND DT 2024 AND VI 53 AND IP 3

Results: 45

Optimization of Non-fullerene Organic Photovoltaics Through Interface Engineering with Graphene Oxide: A Numerical Simulation.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1539, doi. 10.1007/s11664-023-10911-y

By:

Fauji, Najmudin;
Kardiman;
Efelina, Vita;
Hakim, Muhammad Fahmi;
Suci, Farradina Choria;
Hanifi, Rizal;
Gusniar, Iwan Nugraha;
Widianto, Eri

Publication type:

Article

Enhanced Electrochemical Performance of Low-Content Graphene Oxide in Porous Co3O4 Microsheets for Dual Applications of Lithium-Ion Battery Anode and Lithium-Ion Capacitor.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1517, doi. 10.1007/s11664-023-10903-y

By:

Lakshmi Sagar, G.;
Brijesh, K.;
Mukesh, P.;
Amudha, A.;
Bhat, Karthik S.;
Nagaraja, H. S.

Publication type:

Article

Carbon Nitride Supported Ultra-fine Bismuth Sulfide Based Supercapacitor for Low Frequency Oscillator Application.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1498, doi. 10.1007/s11664-023-10901-0

By:

Kumari, Pooja;
Perla, Venkata K.;
Ghosh, Sarit K.;
Saha, Chandan;
Kommu, Parameshwar;
Mallick, Kaushik

Publication type:

Article

Theoretical Studies on Structural, Electronic, Piezoelectric, and Optical Properties of Janus Sc2CXY (X ≠ Y, X/Y = F, Cl, Br, and I) MXenes.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1606, doi. 10.1007/s11664-023-10899-5

By:

Wang, Yanzong;
Hu, Nan;
Zhang, Qinfang;
Ma, Yihan;
Huang, Rui;
Gao, Benling;
Li, Zhongwen

Publication type:

Article

Single-Layer Terahertz Tri-band Bandpass Filter Employing High-Temperature Superconducting Metamaterial.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1642, doi. 10.1007/s11664-023-10898-6

By:

Cai, Xianshun;
Xiao, Zhongyin;
Liu, Yulong;
Wang, Xinwen;
Cheng, Pei

Publication type:

Article

Machine Learning Algorithms in Photovoltaics: Evaluating Accuracy and Computational Cost Across Datasets of Different Generations, Sizes, and Complexities.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1530, doi. 10.1007/s11664-023-10897-7

By:

Al-Saban, Omar;
Alkadi, Muath;
Qaid, Saif M. H.;
Ahmed, Abdullah Ahmed Ali;
Abdellatif, Sameh O.

Publication type:

Article

Performance Improvement of Photodetectors Based on ZIF-8 Nanostructures on Porous Silicon Substrate.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1577, doi. 10.1007/s11664-023-10892-y

By:

Ghafari, Shadi;
Kazemzad, Mahmood;
Naderi, Nima;
Eshraghi, Mohamad Javad

Publication type:

Article

Highly Efficient 3D–2D Perovskite Tandem Solar Cells: A Combined Ray Tracing and Transfer Matrix-Based Simulation Study.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1508, doi. 10.1007/s11664-023-10890-0

By:

Gohri, Shivani;
Madan, Jaya;
Pandey, Rahul

Publication type:

Article

Topological Insulator TlBiSe2/GaN Vertical Heterojunction Diode for High Responsive Broadband UV to Near-Infrared Photodetector.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1561, doi. 10.1007/s11664-023-10889-7

By:

Maurya, Gyanendra Kumar;
Gautam, Vidushi;
Ahmad, Faizan;
Singh, Roshani;
Verma, Sandeep;
Kandpal, Kavindra;
Kumar, Rachana;
Kumar, Mahesh;
Tiwari, Akhilesh;
Kumar, Pramod

Publication type:

Article

Optimizing Heat-Treated Al-BDC@TiO2 to Improve the Electrochemical Properties of Lithium-Sulfur Batteries.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1133, doi. 10.1007/s11664-023-10888-8

By:

Xue, Kaiyu;
Chen, Liping;
Wu, Dingding;
Bai, Yang;
Wang, Juan

Publication type:

Article

An Improved Z-Shaped Dual-Material-Gate DM-SDZ-TFET Biosensor for Label-Free Detection.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1445, doi. 10.1007/s11664-023-10887-9

By:

Bitra, Jayalakshmi;
Komanapalli, Gurumurthy

Publication type:

Article

Metamaterial Wave Absorber for Harvesting Electromagnetic Energy with Dispersion Characteristics Using Palm Oil Frond Graphitic Carbon.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1617, doi. 10.1007/s11664-023-10886-w

By:

Ullah, Mohammad;
Jahan, Mst Ishrat;
Misnon, Izan Izwan;
Ahmad, Hamzah;
Manickavasakam, Karnan;
Jose, Rajan

Publication type:

Article

Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1399, doi. 10.1007/s11664-023-10885-x

By:

Chavali, S.;
Ganti, S. S.;
Liao, H.;
Subbarayan, G.;
Dutta, I.;
Dayananda, M.

Publication type:

Article

Investigation of Quaternary BF-0.32PT-0.05BZ-xPNN Piezoelectric Ceramics with High Transduction Coefficient.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1590, doi. 10.1007/s11664-023-10884-y

By:

Du, Jiacheng;
Jia, Fanhao;
Wang, Yongchen;
Tian, Congcong;
Chen, Jianguo;
Ren, Wei;
Zhao, Hui;
Wang, Yan;
Cheng, Jinrong

Publication type:

Article

A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1414, doi. 10.1007/s11664-023-10881-1

By:

Hu, Yuhua;
Zhang, Yan;
Bao, Zuguo;
Wu, Jing;
Li, Jie;
Wu, Jie;
Huang, Min

Publication type:

Article

Activated Green Resources from Black Tiger Shrimp Shells to Produce O-N-P Self-Co-Doped Carbon Nanofiber for High-Performance Supercapacitor.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1487, doi. 10.1007/s11664-023-10880-2

By:

Farma, Rakhmawati;
Valensia, Indira;
Apriyani, Irma;
Deraman, Mohamad;
Awitdrus;
Taer, Erman

Publication type:

Article

The Sensitizing Effect of Enhanced NO2 Gas Sensing at Near-Room Temperature Using Pd-Decorated VO2 Nanowires.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1461, doi. 10.1007/s11664-023-10878-w

By:

Liu, Shuai;
Xue, Jiale;
Liu, Yinggang;
Cui, Yan;
Qiu, Jie;
Xu, Ruojun;
Chen, Guoxiang

Publication type:

Article

Electron–Phonon Coupling and Carrier Relaxation Times in Gallium Antimonide Under Strain.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1161, doi. 10.1007/s11664-023-10877-x

By:

Tandon, Nandan;
Albrecht, J. D.;
Badescu, S. C.

Publication type:

Article

Study of Entropy Production of Magnetoelectric Multiferroic Materials.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1600, doi. 10.1007/s11664-023-10876-y

By:

Ruiz, María Sol;
Razzitte, Adrián

Publication type:

Article

Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1299, doi. 10.1007/s11664-023-10875-z

By:

Flores, Javier;
Panta, Sitaram;
Hadian, Faramarz;
Cotts, Eric

Publication type:

Article

Dual Capacitive Behavior of Hollow Porous Gold Nanoparticle/Multi-Walled Carbon Nanotube Composite Films as Anode and Cathode Electrode Materials for Supercapacitors.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1476, doi. 10.1007/s11664-023-10874-0

By:

Bahar, Necmiye;
Ekinci, Duygu

Publication type:

Article

X-Ray Diffraction Studies of l-Isoleucine Under Shocked Conditions.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1634, doi. 10.1007/s11664-023-10873-1

By:

Sahaya Jude Dhas, S.;
Sivakumar, A.;
Dai, Lidong;
Suresh Kumar, Raju;
Almansour, Abdulrahman I.;
Martin Britto Dhas, S. A.

Publication type:

Article

Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1374, doi. 10.1007/s11664-023-10870-4

By:

Agyakwa, Pearl A.;
Robertson, Stuart;
Dai, Jingru;
Mouawad, Bassem;
Zhou, Zhaoxia;
Liu, Changqing;
Johnson, C. Mark

Publication type:

Article

Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1284, doi. 10.1007/s11664-023-10866-0

By:

Fowler, Hannah N.;
Puttur Lakshminarayana, Sukshitha Achar;
Lai, Sean Yenyu;
Tay, Sui Xiong;
Masaeng, Aleena;
Subbarayan, Ganesh;
Blendell, John E.;
Handwerker, Carol A.

Publication type:

Article

The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1264, doi. 10.1007/s11664-023-10865-1

By:

Wang, Yu-Chieh;
Ouyang, Fan-Yi

Publication type:

Article

The Effects of Core–Shell-Structured SiO2@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1272, doi. 10.1007/s11664-023-10864-2

By:

Jiang, H.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Study of Cu-Zn Spinel Ferrites on Europium Substitution for High-Frequency Applications.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1685, doi. 10.1007/s11664-023-10858-0

By:

Ahmad, Ashfaq;
Khan, Hassan M.;
Imran, Mohammad;
Assiri, Mohammad A.;
Sadiq, Imran;
Ahmad, Naveed;
Hajana, Muhammad Iqbal;
El Ghoul, J.;
Alrub, Sharif Abu;
Elqahtani, Zainab Mufarreh

Publication type:

Article

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3

By:

Lee, Jing Rou;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Ishak, Mohammad Hafifi Hafiz;
Kamarudin, Roslan;
Ani, F. Che

Publication type:

Article

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1192, doi. 10.1007/s11664-023-10853-5

By:

Liang, Shuibao;
Jiang, Han;
Huang, Jiaqiang

Publication type:

Article

Incomplete Ionization-Dependent Carrier Mobility in Silicon-on-Insulator n-p-n Double-Gate Tunnel Field-Effect Transistors.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1142, doi. 10.1007/s11664-023-10852-6

By:

Pathak, Priyam;
Deb, Deepjyoti;
Nath, Dwipayan;
Das, Prachuryya Subash;
Choudhury, Hirakjyoti;
Goswami, Rupam

Publication type:

Article

Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1255, doi. 10.1007/s11664-023-10851-7

By:

Halim, Khairul Anwar Abdul;
Salleh, M. A. A. Mohd;
Badrul, Farah;
Osman, Azlin Fazlina;
Omar, Mohd Firdaus;
Suhaimi, Anis Syazwani;
Zakaria, Muhammad Salihin

Publication type:

Article

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1223, doi. 10.1007/s11664-023-10850-8

By:

Hao, Qichao;
Tan, Xin F.;
McDonald, Stuart D.;
Sweatman, Keith;
Akaiwa, Tetsuya;
Nogita, Kazuhiro

Publication type:

Article

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1183, doi. 10.1007/s11664-023-10849-1

By:

Tan, Xin F.;
Hao, Qichao;
Zhou, Jiye;
McDonald, Stuart D.;
Sweatman, Keith;
Nogita, Kazuhiro

Publication type:

Article

In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1239, doi. 10.1007/s11664-023-10847-3

By:

Nave, G.;
McCluskey, P.

Publication type:

Article

Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1214, doi. 10.1007/s11664-023-10845-5

By:

Lee, Tae-kyu;
Yang, Hanry;
Dutta, Indranath

Publication type:

Article

Wetting Characteristics of Aluminum Droplets Before and After Embedding Carbon Atoms on the Surface of Heterologous Silicon Carbide.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1333, doi. 10.1007/s11664-023-10838-4

By:

Lv, Yi;
Shen, ShiLong;
Liao, Feng;
Liu, Sheng

Publication type:

Article

Rice Husk Ash: Effective Reinforcement for Epoxy-Based Composites for Electronic Applications.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1344, doi. 10.1007/s11664-023-10835-7

By:

Darekar, V. S.;
Kulthe, M. G.;
Goyal, A.;
Goyal, R. K.

Publication type:

Article

Design and Analysis of Self-Hexplexing Antenna Using SIW Hexagonal Cavity.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1651, doi. 10.1007/s11664-023-10831-x

By:

Kumar, Harsh;
Srivastava, Garima;
Kumar, Sachin

Publication type:

Article

Optimization of Deposition Conditions of SrZrS3 Perovskite Thin Films Grown by Chemical Bath Deposition.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1551, doi. 10.1007/s11664-023-10825-9

By:

Fatima, Areej;
Iqbal, Shahid;
Fazal, Tanzeela;
Ismail, Bushra;
Shah, Mazloom;
Ayub, Ambreen;
Mahmood, Qaiser;
Awwad, Nasser S.;
Ibrahium, Hala A.;
Al-Fawzan, Foziah F.;
Elkaeed, Eslam B.

Publication type:

Article

Superior Impact Ionization Rate in Deep Gate LDMOS Devices to Improve the Figure of Merit and Lattice Temperature.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1425, doi. 10.1007/s11664-023-10824-w

By:

Rezaei, Fateme;
Orouji, Ali A.;
Abbasi, Abdollah

Publication type:

Article

Design and Substrate Material-Based Analysis of a Sriyantra/Srichakra-Shaped Fractal Wideband Monopole Antenna for S-, C-, X-, and Ku-band Communication Applications.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1660, doi. 10.1007/s11664-023-10823-x

By:

Ghali, Srinivasa Rao;
Madhav, B. T. P.;
Alathbah, Moath;
Pardhasaradhi, P.;
Prasad, Nagandla

Publication type:

Article

Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1313, doi. 10.1007/s11664-023-10822-y

By:

Yang, Guang;
Lee, Ee Lynn;
Yang, Kai;
Wu, Fengshun;
Zhou, Longzao;
Ding, Liguo;
Li, Kewei;
Li, Xuemin

Publication type:

Article

Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1360, doi. 10.1007/s11664-023-10785-0

By:

Fan, Yinxiang;
Yan, Haidong;
Li, Junye;
Lv, Guoping;
Liu, Yuncan;
Zhang, Yakun;
Liu, Chaohui

Publication type:

Article

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3

By:

Lee, Jing Rou;
Chong, Mun Xi;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Mohd Salleh, Mohd Arif Anuar;
Mohd Arif Zainol, Mohd Remy Rozainy;
Ani, F. Che

Publication type:

Article

Electrical Performance of a Dual-Band Composite Radome.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1436, doi. 10.1007/s11664-023-10679-1

By:

Chen, Ruizhe;
Tan, Tian;
Liu, Zelin;
Xu, Yonggang;
Hou, Xinyu

Publication type:

Article