Works matching IS 03615235 AND DT 2023 AND VI 52 AND IP 6
1
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4139, doi. 10.1007/s11664-023-10411-z
- Article
2
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4117, doi. 10.1007/s11664-023-10406-w
- Pichon, Thibault;
- Mouzali, Salima;
- Boulade, Olivier;
- Lusson, Alain;
- Badano, Giacomo;
- Santailler, Jean-Louis;
- Rochat, Névine;
- Gravrand, Olivier;
- Limousin, Olivier
- Article
3
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4213, doi. 10.1007/s11664-023-10405-x
- Banerjee, Priyanka;
- Mukhopadhyay, K.;
- Pal, Apurba;
- Dey, P.
- Article
4
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4226, doi. 10.1007/s11664-023-10404-y
- Saquib, Mohammad;
- Shiraj, Shazneen;
- Nayak, Ramakrishna;
- Nirmale, Aditya;
- Selvakumar, M.
- Article
5
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3921, doi. 10.1007/s11664-023-10399-6
- Abdullah, Omed Gh.;
- Mustafa, Bakhan S.;
- Bdewi, Shahbaa F.;
- Ahmed, Hawzhin T.;
- Mohamad, Azhin H.;
- Suhail, Mahdi H.
- Article
6
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4202, doi. 10.1007/s11664-023-10398-7
- Zhang, Yating;
- He, Pei;
- Zhang, Nana;
- Zhuo, Dongxian;
- Wang, Xue;
- Wang, Xiaobo;
- Kong, Zhenghan;
- Hu, Yanping
- Article
7
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4149, doi. 10.1007/s11664-023-10396-9
- Aman, Salma;
- Ahmad, Naseeb;
- Almutairi, Badriah S.;
- Tahir, Muhammad Bilal;
- Ali, H. Elhosiny
- Article
8
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4011, doi. 10.1007/s11664-023-10393-y
- Rahman, Raja Altaf U.;
- Mala, Nazir Ahmad;
- Rather, Mehraj ud Din;
- Rather, Gowher Hameed;
- Parray, Ishfaq Ahmad;
- Shahzadi, Asma;
- Saqib, Sonabar;
- Husain, Shahid;
- Want, Basharat
- Article
9
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4000, doi. 10.1007/s11664-023-10390-1
- Wang, Yi-Wun;
- Liang, Hua-Tui;
- Chang, Kai-Chia;
- Wu, Guo-Wei;
- Tseng, Tzu-Ting;
- Chen, Yi
- Article
10
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4106, doi. 10.1007/s11664-023-10388-9
- Li, Zhirong;
- Zhong, Min;
- Zang, Liangyun;
- Ye, Haiyan
- Article
11
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3947, doi. 10.1007/s11664-023-10387-w
- Qian, Haoran;
- Lu, Jingmin;
- Ge, Lei;
- Zhang, Zhongcheng;
- Zhang, Jian;
- Xu, Zezhong;
- Wang, Shufen;
- Yu, Tingting;
- Lu, Hongdian;
- Hu, Kunhong;
- Li, Minghua;
- Xie, Jinsong
- Article
12
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3914, doi. 10.1007/s11664-023-10386-x
- Jeong, Yonghee;
- Kim, Hyunjin;
- Oh, Jungyeop;
- Choi, Sung-Yool;
- Park, Hamin
- Article
13
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4179, doi. 10.1007/s11664-023-10385-y
- Xing, Fang-Fei;
- Huang, Xin-Yi;
- He, Yi-Xin;
- Zeng, Dan-Dan;
- Chen, Xiao-Pan;
- Lu, Li-Xue;
- Su, Jing;
- Lv, Xiao-Yan;
- Long, Yun-Fei;
- Wen, Yan-Xuan
- Article
14
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3963, doi. 10.1007/s11664-023-10384-z
- Pavithra, S.;
- Kumar, P. Senthil;
- Kathirvel, V.;
- Rajesh, S.;
- Sakunthala, A.
- Article
15
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4239, doi. 10.1007/s11664-023-10383-0
- Roy, S.;
- Tripathy, N.;
- Pradhan, D.;
- Sahu, P. K.;
- Kar, J. P.
- Article
16
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4020, doi. 10.1007/s11664-023-10382-1
- Haji, H. F.;
- Numan, N.;
- Madiba, I. G.;
- Mabakachaba, B.;
- Mtshali, C.;
- Khumalo, Z.;
- Kotsedi, L.;
- Mlyuka, N.;
- Samiji, M.;
- Maaza, M.
- Article
17
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4169, doi. 10.1007/s11664-023-10381-2
- Zhao, Jun-Ren;
- Chen, Yu-Jen;
- Hung, Fei-Yi
- Article
18
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4080, doi. 10.1007/s11664-023-10380-3
- Nishizawa, Koichiro;
- Matsumoto, Ayumu;
- Nakagawa, Yasuyuki;
- Sakuma, Hitoshi;
- Goto, Seiki;
- Fukumuro, Naoki;
- Yae, Shinji
- Article
19
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3807, doi. 10.1007/s11664-023-10379-w
- An, C. W.;
- Zhang, Q. K.;
- Song, Z. L.
- Article
20
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3892, doi. 10.1007/s11664-023-10378-x
- Bai, Zhiyuan;
- Chai, Song;
- Zhao, Chenchen;
- Wang, Liwei
- Article
21
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3563, doi. 10.1007/s11664-023-10377-y
- Rani, Sanju;
- Suganthi, K.;
- Roy, Somnath C.
- Article
22
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3841, doi. 10.1007/s11664-023-10376-z
- Bai, Gailing;
- Yang, Xiaobo;
- Jia, Shuai;
- Lv, Yanyan;
- Tong, Xili
- Article
23
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3983, doi. 10.1007/s11664-023-10375-0
- Bej, Debabrata;
- Chattaraj, Nilanjan;
- Mahapatra, Rajat;
- Mondal, Manas Kumar;
- Ghosh, Chiranjib
- Article
24
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3868, doi. 10.1007/s11664-023-10374-1
- Qin, Xizi;
- Liu, Hao;
- Hu, Junda;
- Huang, Jiajun;
- Yang, Feng;
- Sun, Bai;
- Zhao, Yong;
- Xu, Min;
- Duan, Xuru;
- Huang, Mei;
- Zhang, Yong
- Article
25
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3831, doi. 10.1007/s11664-023-10373-2
- Mariappan, R.;
- Priya, R.;
- Jayaprakash, R. N.
- Article
26
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4070, doi. 10.1007/s11664-023-10372-3
- Khan, Jahanzeb;
- Nayan, Nafarizal;
- Kiani, Ghaffer Iqbal;
- Hussaini, Mohammed Abdullah
- Article
27
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4091, doi. 10.1007/s11664-023-10370-5
- Article
28
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3931, doi. 10.1007/s11664-023-10369-y
- Djali, F.;
- Ouahrani, T.;
- Hiadsi, S.;
- Boufatah, M. R.
- Article
29
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4030, doi. 10.1007/s11664-023-10368-z
- Tang, Yinggang;
- Li, Hui;
- Sheng, Jiazheng;
- Sun, Bin;
- Wang, Jian;
- Zhang, Chupeng;
- Zhang, Daode;
- Huang, Yicang
- Article
30
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4057, doi. 10.1007/s11664-023-10364-3
- Gamal, R.;
- Sheha, E.;
- El Kholy, M. M.
- Article
31
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3991, doi. 10.1007/s11664-023-10362-5
- Du, Xiangxiang;
- Liu, Shujun;
- Xu, Qin;
- Shi, Xuejun
- Article
32
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4037, doi. 10.1007/s11664-023-10360-7
- Do, Minh Huy;
- Nhiem, Ly Tan
- Article
33
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3818, doi. 10.1007/s11664-023-10359-0
- Zzaman, M.;
- Dawn, R.;
- Franklin, J. B.;
- Kumari, A.;
- Ghosh, A.;
- Sahoo, S. K.;
- Verma, V. K.;
- Shahid, R.;
- Goutam, U. K.;
- Kumar, K.;
- Meena, R.;
- Kandasami, A.;
- Singh, V. R.
- Article
34
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3903, doi. 10.1007/s11664-023-10358-1
- Deng, Zhongyang;
- Zou, Guisheng;
- Zhang, Hongqiang;
- Jia, Qiang;
- Wang, Wengan;
- Wu, Ying;
- Zhanwen, A.;
- Feng, Bin;
- Liu, Lei
- Article
35
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4191, doi. 10.1007/s11664-023-10357-2
- Mimouni, K.;
- Mokdad, N.;
- Beladjal, K.;
- Kadri, A.;
- Zitouni, K.
- Article
36
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4162, doi. 10.1007/s11664-023-10356-3
- Fan, Zhen;
- Sun, Zhixin;
- Wang, Ai;
- Yin, Yaohui;
- Jin, Guangyong;
- Xin, Chao
- Article
37
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3526, doi. 10.1007/s11664-023-10355-4
- Wang, Jiaxuan;
- Wang, Lei;
- Li, Zhao;
- Bi, Jiaying;
- Shi, Qiong;
- Song, Haiyang
- Article
38
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4045, doi. 10.1007/s11664-023-10354-5
- Sivanandan, Vibhu T.;
- Prasad, Arun S.
- Article
39
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3797, doi. 10.1007/s11664-023-10352-7
- Yukthesh Venkat, S.;
- Roohan Farooq Lala, S.;
- Singh, Akhand Pratap;
- Srivastava, Chandan
- Article
40
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3613, doi. 10.1007/s11664-023-10351-8
- Alharbi, Seham R.;
- Qasrawi, A. F.
- Article
41
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3729, doi. 10.1007/s11664-023-10350-9
- Qu, Kaige;
- Wang, Shuyue;
- He, Wenwei;
- Yin, Haoyong;
- Gong, Jianying;
- Wang, Ling;
- Wu, Shengji
- Article
42
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3859, doi. 10.1007/s11664-023-10349-2
- Wang, Lu;
- Huang, Xianli;
- Lv, Jun;
- Wang, Jianbo;
- Cao, Min;
- Wang, Tao;
- He, Jianping
- Article
43
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3591, doi. 10.1007/s11664-023-10347-4
- Shaaban, Kh. S.;
- Alotaibi, B. M.;
- Yousef, El Sayed
- Article
44
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3749, doi. 10.1007/s11664-023-10346-5
- Hegde, Ganesh Shridhar;
- Prabhu, A. N.;
- Putran, Suchitra;
- Rao, Ashok;
- Gurukrishna, K.;
- Shanubhogue, U. Deepika
- Article
45
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3509, doi. 10.1007/s11664-023-10344-7
- Yuan, Yuanliang;
- Wang, Xin;
- Jiang, Jicheng;
- Guo, Can;
- Wang, Donghuang;
- Zhou, Aijun
- Article
46
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3759, doi. 10.1007/s11664-023-10342-9
- Sridhar, Ch.;
- Sahu, Neha;
- Seo, Young-Soo;
- Rabani, I.;
- Turpu, G. R.;
- Tigga, Shalinta;
- Padmaja, G.
- Article
47
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3848, doi. 10.1007/s11664-023-10341-w
- Gecil Evangeline, T.;
- Raja Annamalai, A.;
- Ctibor, Pavel
- Article
48
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x
- Njoku, Jude E.;
- Amalu, Emeka H.;
- Ekere, Ndy;
- Mallik, Sabuj;
- Ekpu, Mathias;
- Ogbodo, Eugene A.
- Article
49
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3774, doi. 10.1007/s11664-023-10338-5
- Ammasi, Arunkumar;
- Iruthayaraj, Ragavan;
- Munusamy, Anbarasan Ponnusamy;
- Shkir, Mohd;
- Vellingiri, Balasubramani;
- Minnam Reddy, Vasudeva Reddy;
- Kim, Woo Kyoung
- Article
50
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3517, doi. 10.1007/s11664-023-10337-6
- He, Linxuan;
- Ruan, Lingfeng;
- Yao, Weilin;
- Cai, Chen;
- Chen, Zihang;
- Chang, Xinhao;
- Shi, Juntao;
- Liu, Tiancun;
- Shen, Shenghui;
- Yao, Zhujun;
- Yang, Yefeng
- Article