Works matching IS 03615235 AND DT 2019 AND VI 48 AND IP 3
1
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1724, doi. 10.1007/s11664-019-06927-y
- Zhang, Li;
- Huang, Yang;
- Dai, Chaohua;
- Liang, Qingman;
- Yang, Peng;
- Yang, Haihua;
- Yan, Jianhui
- Article
2
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1669, doi. 10.1007/s11664-018-06920-x
- Do, V. Nam;
- Le, H. Anh;
- Vu, V. Thieu
- Article
3
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1679, doi. 10.1007/s11664-018-06919-4
- Fuchi, Shingo;
- Sato, Takayoshi;
- Idei, Mikiya;
- Akiyama, Yuuki;
- Nanai, Yasushi
- Article
4
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1553, doi. 10.1007/s11664-018-06918-5
- Calderón-Ayala, G.;
- Cortez-Valadez, M.;
- Acosta-Elías, M.;
- Mani-Gonzalez, P. G.;
- Zayas, Ma. E.;
- Castillo, S. J.;
- Flores-Acosta, M.
- Article
5
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1686, doi. 10.1007/s11664-018-06916-7
- Abdel-Aal, Seham K.;
- Abdel-Rahman, Ahmed S.
- Article
6
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1511, doi. 10.1007/s11664-018-06914-9
- Fan, Libing;
- Ma, Qianli;
- Tian, Jiao;
- Li, Dan;
- Xi, Xue;
- Dong, Xiangting;
- Yu, Wensheng;
- Wang, Jinxian;
- Liu, Guixia
- Article
7
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1480, doi. 10.1007/s11664-018-06913-w
- Article
8
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1522, doi. 10.1007/s11664-018-06912-x
- Arunkumar, Ammasi;
- Anbarasan, Ponnusamy Munusamy
- Article
9
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1634, doi. 10.1007/s11664-018-06911-y
- Patel, Pratik D.;
- Shinde, Satyam;
- Gupta, Sanjay D.;
- Jha, Prafulla K.
- Article
10
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1531, doi. 10.1007/s11664-018-06910-z
- Zhu, Jia;
- Zhou, Wentao;
- Zhou, Yazhou;
- Cheng, Xiaonong;
- Yang, Juan
- Article
11
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1353, doi. 10.1007/s11664-018-06909-6
- Thanh, Tran Dang;
- Yen, Pham Duc Huyen;
- Hau, Kieu Xuan;
- Dung, Nguyen Thi;
- Nhan, Le Vi;
- Huong, Le Thi;
- Bau, Le Viet;
- Thu, Le Thi Anh;
- Cong, Bach Thanh;
- Nghia, Nguyen Xuan;
- Khiem, Le Hong;
- Yu, Seong Cho
- Article
12
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1590, doi. 10.1007/s11664-018-06908-7
- Qureshi, Nilam;
- Harpale, Kashmira;
- Shinde, Manish;
- Vutova, Katia;
- More, Mahendra;
- Kim, Taesung;
- Amalnerkar, Dinesh
- Article
13
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1704, doi. 10.1007/s11664-018-06901-0
- Konishi, Kumiko;
- Fujita, Ryusei;
- Shima, Akio
- Article
14
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1540, doi. 10.1007/s11664-018-06900-1
- Yan, Changzeng;
- Raghavan, Chinnambedu Murugesan;
- Ji, Chao;
- Sun, Rong;
- Wong, Ching-Ping
- Article
15
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1562, doi. 10.1007/s11664-018-06899-5
- Himuro, Takahiro;
- Tsukamoto, Shota;
- Saito, Yoji
- Article
16
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1506, doi. 10.1007/s11664-018-06898-6
- Chen, Dan;
- Luo, Fa;
- Zhou, Wancheng;
- Zhu, Dongmei
- Article
17
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1694, doi. 10.1007/s11664-018-06897-7
- RameshKumar, Raji;
- Ramachandran, Tholkappiyan;
- Natarajan, Karthikeyan;
- Muralidharan, Munisamy;
- Hamed, Fathalla;
- Kurapati, Vishista
- Article
18
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1599, doi. 10.1007/s11664-018-06895-9
- Zhao, Chuan-Zhen;
- Li, Xiang-Tan;
- Sun, Xiao-Dong;
- Wang, Sha-Sha;
- Wang, Jun
- Article
19
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1545, doi. 10.1007/s11664-018-06894-w
- Kripal, Ram;
- Vaish, Garima;
- Tripathi, Upendra Mani
- Article
20
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1643, doi. 10.1007/s11664-018-06893-x
- Queiroz, M. N.;
- Dantas, N. F.;
- Brito, D. R. N.;
- Barboza, M. J.;
- Steimacher, A.;
- Pedrochi, F.
- Article
21
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1604, doi. 10.1007/s11664-018-06892-y
- Dalvand, Ramazanali;
- Mahmud, Shahrom;
- Seeni, Azman
- Article
22
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1612, doi. 10.1007/s11664-018-06890-0
- Makled, Mahmoud H.;
- Sheha, E.
- Article
23
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1754, doi. 10.1007/s11664-018-06889-7
- Mitra, Kunal;
- Mahapatra, S.;
- Dasgupta, T.
- Article
24
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1652, doi. 10.1007/s11664-018-06888-8
- Xiao, Mi;
- Wei, Yanshuang;
- Zhang, Ping
- Article
25
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1363, doi. 10.1007/s11664-018-06886-w
- Shiu, Deng-Shiang;
- Hong, Yun;
- Su, Chin-Han;
- Lai, Kao-Fan;
- Wu, Jong-Ching;
- Lin, Lin;
- Kao, Yee-Mou;
- Horng, Lance
- Article
26
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1568, doi. 10.1007/s11664-018-06885-x
- Fares, Chaker;
- Ren, F.;
- Lambers, Eric;
- Hays, David C.;
- Gila, B. P.;
- Pearton, S. J.
- Article
27
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1498, doi. 10.1007/s11664-018-06884-y
- Singh, Vijay;
- Singh, N.;
- Pathak, M. S.;
- Natarajan, V.
- Article
28
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1746, doi. 10.1007/s11664-018-06882-0
- Park, Hyun-Joon;
- Lee, Choong-Jae;
- Min, Kyung Deuk;
- Jung, Seung-Boo
- Article
29
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1617, doi. 10.1007/s11664-018-06881-1
- Sachdeva, Smiti;
- Agarwal, Ajay;
- Agarwal, Ravinder
- Article
30
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1714, doi. 10.1007/s11664-018-06875-z
- Moharana, Srikanta;
- Chopkar, Manoj Kumar;
- Mahaling, Ram Naresh
- Article
31
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1766, doi. 10.1007/s11664-018-06874-0
- Nakayama, M.;
- O, M.;
- Kajihara, M.
- Article
32
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1446, doi. 10.1007/s11664-018-06873-1
- Bau, Le Viet;
- An, Nguyen Manh;
- Le Thi, Nguyen;
- Giang, Le Thi;
- Thanh, Tran Dang;
- Phong, Pham Thanh;
- Yu, Seong-Cho
- Article
33
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1777, doi. 10.1007/s11664-018-06871-3
- Ogawa, Fumio;
- Hiyoshi, Noritake;
- Konishi, Yutaka;
- Itoh, Takamoto
- Article
34
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1730, doi. 10.1007/s11664-018-06870-4
- Somia;
- Mehmood, Shahid;
- Ali, Zahid;
- Khan, Imad;
- Khan, Fawad;
- Ahmad, Iftikhar
- Article
35
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1574, doi. 10.1007/s11664-018-06868-y
- He, Yu;
- Pan, Shunkang;
- Cheng, Lichun;
- Luo, Jialiang;
- Yu, Jingjing
- Article
36
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1758, doi. 10.1007/s11664-018-06865-1
- Xu, Ruisheng;
- Liu, Yang;
- Zhang, Hao;
- Li, Zhao;
- Sun, Fenglian;
- Zhang, Guoqi
- Article
37
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1582, doi. 10.1007/s11664-018-06864-2
- Wang, Wenxin;
- Ren, Yuyan;
- Li, Yingmin
- Article
38
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1629, doi. 10.1007/s11664-018-06863-3
- Krishnakumar, D. N.;
- Rajesh, Narayana Perumal
- Article
39
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1660, doi. 10.1007/s11664-018-06853-5
- Alsultany, Forat H.;
- Majdi, Hasan Sh.;
- Abd, Husnen R.;
- Hassan, Z.;
- Ahmed, Naser M.
- Article
40
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1395, doi. 10.1007/s11664-018-06848-2
- Qian, Hui-Dong;
- Si, Ping-Zhan;
- Park, Jihoon;
- Cho, Kyung Mox;
- Choi, Chul-Jin
- Article
41
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1492, doi. 10.1007/s11664-018-06847-3
- Anh Nguyen, T. N.;
- Fedotova, J.;
- Kasiuk, J.;
- Wu, W.-B.;
- Przewoźnik, J.;
- Kapusta, C.;
- Kupreeva, O.;
- Lazarouk, S.;
- Thuy Trinh, T. H.;
- Tung Do, K.;
- Manh Do, H.;
- Lam Vu, D.;
- Åkerman, J.
- Article
42
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1412, doi. 10.1007/s11664-018-06843-7
- Yanai, Takeshi;
- Honda, Junya;
- Hamamura, Ryo;
- Omagari, Yuya;
- Furutani, Seiya;
- Yamada, Hirohisa;
- Fujita, Naoyuki;
- Morimura, Takao;
- Nakano, Masaki;
- Fukunaga, Hirotoshi
- Article
43
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1342, doi. 10.1007/s11664-018-6835-z
- Muroga, Sho;
- Endo, Yasushi;
- Tanaka, Motoshi
- Article
44
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1416, doi. 10.1007/s11664-018-6825-1
- Li, X.;
- Wu, C.-H.;
- Lee, Y.-J.;
- Huang, Y.-L.;
- Huang, C.-L.;
- Tsai, J.-L.;
- Wu, T.-H.;
- Chen, T.;
- van Lierop, J.;
- Lin, K.-W.
- Article
45
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1421, doi. 10.1007/s11664-018-6814-4
- Liu, Huai-Cong;
- Lee, Ho-Joon;
- Lee, Ju
- Article
46
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1386, doi. 10.1007/s11664-018-6812-6
- Liu, Huai-Cong;
- Seol, Hyun-Soo;
- Kim, Jun-Yong;
- Lee, Ju
- Article
47
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1400, doi. 10.1007/s11664-018-6809-1
- Shi, Y.;
- Wei, J.;
- Deng, Z.;
- Shao, Z.;
- Jian, L.
- Article
48
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1319, doi. 10.1007/s11664-018-6808-2
- Hayashi, Kohei;
- Pradipto, Abdul-Muizz;
- Nozaki, Kohei;
- Akiyama, Toru;
- Ito, Tomonori;
- Oguchi, Tamio;
- Nakamura, Kohji
- Article
49
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1472, doi. 10.1007/s11664-018-6804-6
- Article
50
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1347, doi. 10.1007/s11664-018-6788-2
- Jin, Mi-Jin;
- Kim, Shin-Ik;
- Moon, Seon Young;
- Choe, Daeseong;
- Park, Jungmin;
- Modepalli, Vijayakumar;
- Jo, Junhyeon;
- Oh, Inseon;
- Baek, Seung-Hyub;
- Yoo, Jung-Woo
- Article