Works matching IS 03615235 AND DT 2018 AND VI 47 AND IP 9
1
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5113, doi. 10.1007/s11664-018-6502-4
- Konin, K. P.;
- Gudymenko, O. Yo.;
- Klad’ko, V. P.;
- Lytvynenko, O. O.;
- Morozovs’ka, D. V.
- Article
2
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5109, doi. 10.1007/s11664-018-6476-2
- Sun, Yongqiang;
- Feng, Gan;
- Kang, Junyong;
- Zhang, Jianhui;
- Qian, Weining
- Article
3
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5614, doi. 10.1007/s11664-018-6474-4
- Zahran, H. Y.;
- Abd El-Rehim, A. F.;
- AlFaify, S.
- Article
4
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5607, doi. 10.1007/s11664-018-6468-2
- Ng, Zi-Neng;
- Chan, Kah-Yoong;
- Muslimin, Shahruddin;
- Knipp, Dietmar
- Article
5
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5595, doi. 10.1007/s11664-018-6467-3
- Singh, Budhi;
- Sharma, Akanksha;
- Ghosh, Subhasis
- Article
6
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5632, doi. 10.1007/s11664-018-6466-4
- Spurney, Robert Grant;
- Sharma, Himani;
- Pulugurtha, Markondeya Raj;
- Tummala, Rao;
- Lollis, Naomi;
- Weaver, Mitch;
- Gandhi, Saumya;
- Romig, Matt;
- Brumm, Holger
- Article
7
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5556, doi. 10.1007/s11664-018-6465-5
- Dias, Bianca V.;
- Tractz, Gideã T.;
- Viomar, Aline;
- Maia, Guilherme A. R.;
- da Cunha, Maico T.;
- Rodrigues, Paulo R. P.
- Article
8
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5572, doi. 10.1007/s11664-018-6463-7
- Huang, Xiutao;
- Lu, Conghui;
- Wang, Shengming;
- Rong, Cancan;
- Chen, Junfeng;
- Liu, Minghai
- Article
9
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5601, doi. 10.1007/s11664-018-6460-x
- Article
10
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5548, doi. 10.1007/s11664-018-6457-5
- Balaji, G.;
- Rathinam, A.;
- Vadivel, S.
- Article
11
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5564, doi. 10.1007/s11664-018-6455-7
- Wang, Jin;
- Cheng, Bo;
- Qiu, Hua;
- Qi, Shuhua
- Article
12
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5640, doi. 10.1007/s11664-018-6452-x
- Magisetty, RaviPrakash;
- Shukla, Anuj;
- Kandasubramanian, Balasubramanian
- Article
13
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5118, doi. 10.1007/s11664-018-6451-y
- Liu, Bin;
- Zhu, Lingzhi;
- Han, Enshan;
- Xu, Han
- Article
14
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5582, doi. 10.1007/s11664-018-6450-z
- Xu, Panpan;
- Wang, Mingwen;
- Yang, Shuai;
- Wang, Yupeng;
- Hao, Wentao;
- Sun, Li;
- Cao, Ensi;
- Zhang, Yongjia
- Article
15
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5525, doi. 10.1007/s11664-018-6449-5
- Vu, Tuan V.;
- Lavrentyev, A. A.;
- Gabrelian, B. V.;
- Parasyuk, O. V.;
- Khyzhun, O. Y.
- Article
16
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5588, doi. 10.1007/s11664-018-6448-6
- Liu, Shengfa;
- Xiong, Wenyong;
- Xiong, Jieran;
- Tan, Guanghua;
- Hu, Zhebing;
- Chen, Chen;
- Huang, Shangyu
- Article
17
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5498, doi. 10.1007/s11664-018-6445-9
- Xu, Weiwei;
- Wang, Jianwei;
- Laref, Amel;
- Yang, Juan;
- Wu, Xiaozhi;
- Wang, Rui
- Article
18
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5458, doi. 10.1007/s11664-018-6444-x
- Gupta, Prabhasini;
- Mahapatra, P. K.;
- Choudhary, R. N. P.
- Article
19
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5509, doi. 10.1007/s11664-018-6443-y
- Wang, Wenzhao;
- Chen, Xiaoxiao;
- Zeng, Xiangbin;
- Wu, Shaoxiong;
- Zeng, Yang;
- Hu, Yishuo;
- Xu, Sue;
- Zhou, Guangtong;
- Cui, Hongxing
- Article
20
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5518, doi. 10.1007/s11664-018-6442-z
- Fan, Y. B.;
- Wang, J.;
- Li, J.;
- Yin, H. Y.;
- Hu, H. Y.;
- Yang, Z. Y.;
- Wei, X.;
- Huang, Y. Q.;
- Ren, X. M.
- Article
21
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5422, doi. 10.1007/s11664-018-6441-0
- Concha-Balderrama, A.;
- Martinez-Rodriguez, H. A.;
- Rojas-George, G.;
- Esparza-Ponce, H. E.;
- Orozco-Carmona, V.;
- Pizá-Ruiz, P.;
- Bocanegra-Bernal, M. H.;
- Reyes-Rojas, A.
- Article
22
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5410, doi. 10.1007/s11664-018-6439-7
- Article
23
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5396, doi. 10.1007/s11664-018-6438-8
- Prabeesh, P.;
- Vysakh, K. V.;
- Selvam, I. Packia;
- Potty, S. N.
- Article
24
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5386, doi. 10.1007/s11664-018-6437-9
- Khan, Z. R.;
- Shkir, Mohd.;
- Ganesh, V.;
- AlFaify, S.;
- Yahia, I. S.;
- Zahran, H. Y.
- Article
25
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5417, doi. 10.1007/s11664-018-6436-x
- Guo, Tao;
- Zhang, Xuejiao;
- Sun, Bai;
- Mao, Shuangsuo;
- Zhu, Shouhui;
- Zheng, Pingping;
- Xia, Yudong;
- Yu, Zhou
- Article
26
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5443, doi. 10.1007/s11664-018-6435-y
- Parthibavarman, M.;
- Sharmila, V.;
- Sathishkumar, P.;
- Gaikwad, Sucheta Abhay
- Article
27
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5488, doi. 10.1007/s11664-018-6434-z
- Article
28
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5477, doi. 10.1007/s11664-018-6433-0
- Chandel, Tarun;
- Thakur, Vikas;
- Halaszova, Sona;
- Prochazka, Michal;
- Haško, Daniel;
- Velic, Dusan;
- Poolla, Rajaram
- Article
29
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5625, doi. 10.1007/s11664-018-6432-1
- Ji, Xiaoliang;
- An, Rong;
- Wang, Chunqing;
- Cai, Chongyang
- Article
30
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5433, doi. 10.1007/s11664-018-6430-3
- Moroz, Mykola;
- Tesfaye, Fiseha;
- Demchenko, Pavlo;
- Prokhorenko, Myroslava;
- Lindberg, Daniel;
- Reshetnyak, Oleksandr;
- Hupa, Leena
- Article
31
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5378, doi. 10.1007/s11664-018-6429-9
- Hou, Hsuan-Chao;
- Banadaki, Yaser M.;
- Basu, Srismrita;
- Sharifi, Safura
- Article
32
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5403, doi. 10.1007/s11664-018-6428-x
- Noma, Hirokazu;
- Kamibayashi, Takumi;
- Kuwae, Hiroyuki;
- Suzuki, Naoya;
- Nonaka, Toshihisa;
- Shoji, Shuichi;
- Mizuno, Jun
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5452, doi. 10.1007/s11664-018-6427-y
- Karimizadeh, Narges;
- Babamoradi, Mohsen;
- Azimirad, Rouhollah;
- Khajeh, Mostafa
- Article
34
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5352, doi. 10.1007/s11664-018-6423-2
- Yang, Chen;
- Liu, Guodong;
- Yan, Lirong
- Article
35
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5537, doi. 10.1007/s11664-018-6422-3
- Flores-García, E.;
- González-García, P.;
- González-Hernández, J.;
- Ramírez-Bon, R.
- Article
36
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5344, doi. 10.1007/s11664-018-6421-4
- Li, Guiqiang;
- Zhao, Xudong;
- Jin, Yi;
- Chen, Xiao;
- Ji, Jie;
- Shittu, Samson
- Article
37
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5370, doi. 10.1007/s11664-018-6420-5
- Kanwal, M.;
- Ahmad, I.;
- Meydan, T.;
- Cuenca, J. A.;
- Williams, P. I.;
- Farid, M. T.;
- Murtaza, G.
- Article
38
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 4937, doi. 10.1007/s11664-018-6419-y
- Baniecki, John;
- Shahedipour-Sandvik, F.
- Article
39
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5133, doi. 10.1007/s11664-018-6418-z
- Zhu, Dongbin;
- Wu, Minqiang
- Article
40
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5302, doi. 10.1007/s11664-018-6417-0
- Aldbea, Ftema W.;
- Yusrianto, Efil;
- Ibrahim, N. B.
- Article
41
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5359, doi. 10.1007/s11664-018-6416-1
- Yao, ZiFeng;
- Zheng, GanHong;
- Zhang, ZhanJun;
- Dai, ZhenXiang;
- Zhang, LingYun;
- Ma, YongQing
- Article
42
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5105, doi. 10.1007/s11664-018-6415-2
- Konin, K. P.;
- Goltvyansky, Yu. V.;
- Karachevtseva, L. A.;
- Karas, M. I.;
- Morozovs’ka, D. V.
- Article
43
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5099, doi. 10.1007/s11664-018-6414-3
- Das, H.;
- Sunkari, S.;
- Naas, H.
- Article
44
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5092, doi. 10.1007/s11664-018-6413-4
- Xie, Meng;
- Yu, Xuegong;
- Wu, Yichao;
- Yang, Deren
- Article
45
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5291, doi. 10.1007/s11664-018-6412-5
- Xia, Minghao;
- Huang, Lingling;
- Zhang, Yubo;
- Wang, Yongqian
- Article
46
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5259, doi. 10.1007/s11664-018-6411-6
- Mourya, Satyendra;
- Jaiswal, Jyoti;
- Malik, Gaurav;
- Kumar, Brijesh;
- Chandra, Ramesh
- Article
47
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5310, doi. 10.1007/s11664-018-6410-7
- Lamba, Ravita;
- Manikandan, S.;
- Kaushik, S. C.
- Article
48
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5321, doi. 10.1007/s11664-018-6409-0
- Shah, Muhammad Tariq;
- Balouch, Aamna;
- Panah, Pirah;
- Rajar, Kausar;
- Mahar, Ali Muhammad;
- Khan, Abdullah;
- Jagirani, Muhammad Saqaf;
- Khan, Humaira
- Article
49
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5283, doi. 10.1007/s11664-018-6408-1
- Ziane, Abderrezzaq;
- Amrani, Mohammed;
- Benamara, Zineb;
- Rabehi, Abdelaziz
- Article
50
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5275, doi. 10.1007/s11664-018-6406-3
- Baig, Faisal;
- Khattak, Yousaf Hameed;
- Marí, Bernabé;
- Beg, Saira;
- Ahmed, Abrar;
- Khan, Khurram
- Article