Works matching IS 03615235 AND DT 2018 AND VI 47 AND IP 6
1
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3370, doi. 10.1007/s11664-018-6292-8
- Yamaguchi, Hiroyuki;
- Aizawa, Kengo;
- Chonan, Yasunori;
- Komiyama, Takao;
- Aoyama, Takashi;
- Sakai, Eiichi;
- Qiu, Jianhui;
- Sato, Naoki
- Article
2
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3171, doi. 10.1007/s11664-018-6272-z
- Konopko, L. A.;
- Nikolaeva, A. A.;
- Kobylianskaya, A. K.;
- Huber, T. E.
- Article
3
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3376, doi. 10.1007/s11664-018-6247-0
- Zhang, Zheng;
- Chen, Zijian;
- Liu, Hongwu;
- Yue, Hao;
- Chen, Dongbo;
- Qin, Delei
- Article
4
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3350, doi. 10.1007/s11664-018-6218-5
- Peng, Zhi;
- He, Danqi;
- Mu, Xin;
- Zhou, Hongyu;
- Li, Cuncheng;
- Ma, Shifang;
- Ji, Pengxia;
- Hou, Weikang;
- Wei, Ping;
- Zhu, Wanting;
- Nie, Xiaolei;
- Zhao, Wenyu
- Article
5
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3189, doi. 10.1007/s11664-018-6205-x
- Lashkevych, Igor;
- Velázquez, J. E.;
- Titov, Oleg Yu.;
- Gurevich, Yuri G.
- Article
6
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3230, doi. 10.1007/s11664-018-6186-9
- Mallick, Md. Mofasser;
- Vitta, Satish
- Article
7
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3282, doi. 10.1007/s11664-018-6181-1
- Semeniuk, V.;
- Protsenko, D.
- Article
8
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3193, doi. 10.1007/s11664-018-6175-z
- Laux, Edith;
- Uhl, Stefanie;
- Jeandupeux, Laure;
- López, Pilar Pérez;
- Sanglard, Pauline;
- Vanoli, Ennio;
- Marti, Roger;
- Keppner, Herbert
- Article
9
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3164, doi. 10.1007/s11664-018-6116-x
- Kohri, Hitoshi;
- Yagasaki, Takayoshi
- Article
10
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3273, doi. 10.1007/s11664-018-6115-y
- Osakabe, Yuki;
- Tatsumi, Shota;
- Kotsubo, Yuichi;
- Iwanaga, Junpei;
- Yamasoto, Keita;
- Munetoh, Shinji;
- Furukimi, Osamu;
- Nakashima, Kunihiko
- Article
11
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3260, doi. 10.1007/s11664-018-6103-2
- Muthusamy, Omprakash;
- Nishino, Shunsuke;
- Ghodke, Swapnil;
- Inukai, Manabu;
- Sobota, Robert;
- Adachi, Masahiro;
- Kiyama, Makato;
- Yamamoto, Yoshiyuki;
- Takeuchi, Tsunehiro;
- Santhanakrishnan, Harish;
- Ikeda, Hiroya;
- Hayakawa, Yasuhiro
- Article
12
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3307, doi. 10.1007/s11664-018-6095-y
- Thielen, Moritz;
- Kara, Gökhan;
- Unkovic, Ivana;
- Majoe, Dennis;
- Hierold, Christofer
- Article
13
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3358, doi. 10.1007/s11664-018-6094-z
- Wilbrecht, Sebastian;
- Beitelschmidt, Michael
- Article
14
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3177, doi. 10.1007/s11664-018-6086-z
- Sakuma, Tasuku;
- Nishino, Shunsuke;
- Miyata, Masanobu;
- Koyano, Mikio
- Article
15
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3238, doi. 10.1007/s11664-018-6073-4
- Lu, Baiyi;
- Meng, Xiangning;
- Zhu, Miaoyong;
- Suzuki, Ryosuke O.
- Article
16
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3198, doi. 10.1007/s11664-018-6061-8
- Sassi, S.;
- Candolfi, C.;
- Dauscher, A.;
- Lenoir, B.
- Article
17
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3314, doi. 10.1007/s11664-017-6057-9
- Vasilevskiy, D.;
- Keshavarz, M. K.;
- Simard, J.-M.;
- Masut, R. A.;
- Turenne, S.;
- Snyder, G. J.
- Article
18
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3288, doi. 10.1007/s11664-017-6055-y
- Oki, Sae;
- Natsui, Shungo;
- Suzuki, Ryosuke O.
- Article
19
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3254, doi. 10.1007/s11664-017-6020-9
- Miyata, Masanobu;
- Ozaki, Taisuke;
- Takeuchi, Tsunehiro;
- Nishino, Shunsuke;
- Inukai, Manabu;
- Koyano, Mikio
- Article
20
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3298, doi. 10.1007/s11664-017-6019-2
- Xiao, Longjie;
- He, Tianming;
- Mei, Binyu;
- Wang, Yiping;
- Wang, Zongsong;
- Tan, Gangfeng
- Article
21
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3248, doi. 10.1007/s11664-017-6013-8
- Chen, Jun-Liang;
- Liu, Chengyan;
- Miao, Lei;
- Gao, Jie;
- Zheng, Yan-yan;
- Wang, Xiaoyang;
- Lu, Jiacai;
- Shu, Mingzheng
- Article
22
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3113, doi. 10.1007/s11664-017-6007-6
- Hiroi, Satoshi;
- Choi, Seongho;
- Nishino, Shunsuke;
- Seo, Okkyun;
- Chen, Yanna;
- Sakata, Osami;
- Takeuchi, Tsunehiro
- Article
23
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3330, doi. 10.1007/s11664-017-6006-7
- Wang, Yiping;
- Tang, Yulin;
- Deng, Yadong;
- Su, Chuqi
- Article
24
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3277, doi. 10.1007/s11664-017-6005-8
- Pshenay-Severin, D. A.;
- Ivanov, Yu. V.;
- Burkov, A. T.;
- Novikov, S. V.;
- Zaitsev, V. K.;
- Reith, H.
- Article
25
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3203, doi. 10.1007/s11664-017-5989-4
- Linseis, V.;
- Völklein, F.;
- Reith, H.;
- Woias, P.;
- Nielsch, K.
- Article
26
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3267, doi. 10.1007/s11664-017-5981-z
- Nishino, Shunsuke;
- Ekino, Satoshi;
- Inukai, Manabu;
- Omprakash, Muthusamy;
- Adachi, Masahiro;
- Kiyama, Makoto;
- Yamamoto, Yoshiyuki;
- Takeuchi, Tsunehiro
- Article
27
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3077, doi. 10.1007/s11664-017-5977-8
- Acosta, E.;
- Wight, N. M.;
- Smirnov, V.;
- Buckman, J.;
- Bennett, N. S.
- Article
28
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3119, doi. 10.1007/s11664-017-5961-3
- Kim, Hyo-Seob;
- Dharmaiah, Peyala;
- Hong, Soon-Jik
- Article
29
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3218, doi. 10.1007/s11664-017-5960-4
- Su, Chuqi;
- Dong, Wenbin;
- Deng, Yadong;
- Wang, Yiping;
- Liu, Xun
- Article
30
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3320, doi. 10.1007/s11664-017-5959-x
- Zhu, D. C.;
- Su, C. Q.;
- Deng, Y. D.;
- Wang, Y. P.;
- Liu, X.
- Article
31
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3099, doi. 10.1007/s11664-017-5958-y
- Chen, Bo;
- Li, Yi;
- Sun, Zhen-Ya
- Article
32
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3127, doi. 10.1007/s11664-017-5934-6
- Karri, Naveen K.;
- Mo, Changki
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3159, doi. 10.1007/s11664-017-5933-7
- Seo, Seung-Ho;
- Kim, Suk Jun;
- Lee, Soonil;
- Seo, Won-Seon;
- Kim, Il-Ho;
- Choi, Soon-Mok
- Article
34
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3184, doi. 10.1007/s11664-017-5932-8
- Lan, Rui;
- Endo, Rie;
- Kuwahara, Masashi;
- Kobayashi, Yoshinao;
- Susa, Masahiro
- Article
35
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3210, doi. 10.1007/s11664-017-5930-x
- She, Wuchang;
- Liu, Qiwen;
- Mei, Hai;
- Zhai, Pengcheng;
- Li, Jun;
- Liu, Lisheng
- Article
36
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3105, doi. 10.1007/s11664-017-5929-3
- Fujii, Yosuke;
- Kosuga, Atsuko
- Article
37
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3091, doi. 10.1007/s11664-017-5913-y
- Ramakrishnan, Anbalagan;
- Raman, Sankar;
- Chen, Li-Chyong;
- Chen, Kuei-Hsien
- Article
38
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3344, doi. 10.1007/s11664-017-5908-8
- Hu, Wenhua;
- Zhou, Hongyu;
- Mu, Xin;
- He, Danqi;
- Ji, Pengxia;
- Hou, Weikang;
- Wei, Ping;
- Zhu, Wanting;
- Nie, Xiaolei;
- Zhao, Wenyu
- Article
39
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3152, doi. 10.1007/s11664-017-5907-9
- Cha, Ye-Eun;
- Shin, Dong-Kil;
- Kim, Il-Ho
- Article
40
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3061, doi. 10.1007/s11664-017-5891-0
- Wang, Hongtao;
- Duan, Bo;
- Bai, Guanghui;
- Li, Jialiang;
- Yu, Yue;
- Yang, Houjiang;
- Chen, Gang;
- Zhai, Pengcheng
- Article
41
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3067, doi. 10.1007/s11664-017-5875-0
- Article
42
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3085, doi. 10.1007/s11664-017-5870-5
- Linker, Thomas M.;
- Lee, Glenn S.;
- Beekman, Matt
- Article
43
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3143, doi. 10.1007/s11664-017-5869-y
- Shin, Dong-Kil;
- Jang, Kyung-Wook;
- Choi, Soon-Mok;
- Lee, Soonil;
- Seo, Won-Seon;
- Kim, Il-Ho
- Article
44
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3338, doi. 10.1007/s11664-017-5842-9
- He, Danqi;
- Mu, Xin;
- Zhou, Hongyu;
- Li, Cuncheng;
- Ma, Shifang;
- Ji, Pengxia;
- Hou, Weikang;
- Wei, Ping;
- Zhu, Wanting;
- Nie, Xiaolei;
- Zhao, Wenyu
- Article
45
- Journal of Electronic Materials, 2018, v. 47, n. 6, p. 3136, doi. 10.1007/s11664-017-5840-y
- Article