Works matching IS 03615235 AND DT 2018 AND VI 47 AND IP 1
1
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 35, doi. 10.1007/s11664-017-5685-4
- Chen, Wei-Jhen;
- Lee, Yue-Lin;
- Wu, Ti-Yuan;
- Chen, Tzu-Ching;
- Hsu, Chih-Hui;
- Lin, Ming-Tzer
- Article
2
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 9, doi. 10.1007/s11664-017-5722-3
- Park, Donghyun;
- Shin, Soo;
- Oh, Tae
- Article
3
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 212, doi. 10.1007/s11664-017-5735-y
- Article
4
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 251, doi. 10.1007/s11664-017-5740-1
- Yuan, Zhengyong;
- Jiang, Qiang;
- Feng, Chuanqi;
- Chen, Xiao;
- Guo, Zaiping
- Article
5
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 662, doi. 10.1007/s11664-017-5741-0
- Yang, Li;
- Liu, Haixiang;
- Zhang, Yaocheng
- Article
6
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 205, doi. 10.1007/s11664-017-5745-9
- Li, J.;
- Yang, N.;
- Li, S.;
- Li, Y.;
- Liu, F.;
- Ao, W.
- Article
7
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 173, doi. 10.1007/s11664-017-5750-z
- Kujofsa, Tedi;
- Ayers, John
- Article
8
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 233, doi. 10.1007/s11664-017-5751-y
- Kiran, Raj;
- Kumar, Anuruddh;
- Chauhan, Vishal;
- Kumar, Rajeev;
- Vaish, Rahul
- Article
9
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 167, doi. 10.1007/s11664-017-5752-x
- Pat, Suat;
- Özen, Soner;
- Korkmaz, Şadan
- Article
10
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 77, doi. 10.1007/s11664-017-5754-8
- Tang, Y.;
- Lin, E.;
- Wang, J.;
- Lin, Y.;
- Hu, Y.;
- Hsu, Y.;
- Liu, C.
- Article
11
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 242, doi. 10.1007/s11664-017-5755-7
- El-Asfoury, Mohamed;
- Nasr, Mohamed;
- Nakamura, Koichi;
- Abdel-Moneim, Ahmed
- Article
12
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 292, doi. 10.1007/s11664-017-5756-6
- Bateer, Buhe;
- Zhang, Jianjao;
- Zhang, Hongchen;
- Zhang, Xiaochen;
- Wang, Chunyan;
- Qi, Haiqun
- Article
13
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 261, doi. 10.1007/s11664-017-5757-5
- Wang, Wei;
- Yang, Lili;
- Wang, Nan;
- Zhang, Haifeng;
- Jia, Yanping
- Article
14
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 329, doi. 10.1007/s11664-017-5758-4
- Batır, G.;
- Arık, Mustafa;
- Caldıran, Zakir;
- Turut, Abdulmecit;
- Aydogan, Sakir
- Article
15
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 225, doi. 10.1007/s11664-017-5759-3
- Maurya, Ishwar;
- Singh, Shalini;
- Neetu;
- Gupta, Arun;
- Srivastava, Pankaj;
- Bahadur, Lal
- Article
16
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 285, doi. 10.1007/s11664-017-5760-x
- Liu, Xiao;
- Yuan, Changlai;
- Luo, Fenghua;
- Liu, Xinyu;
- Zhen, Yuanlei;
- Liu, Fei;
- Chen, Guohua;
- Zhou, Changrong
- Article
17
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 196, doi. 10.1007/s11664-017-5761-9
- Chibani, S.;
- Arbouche, O.;
- Zemouli, M.;
- Amara, K.;
- Benallou, Y.;
- Azzaz, Y.;
- Belgoumène, B.;
- Bentayeb, A.;
- Ameri, M.
- Article
18
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 272, doi. 10.1007/s11664-017-5762-8
- Alp, Irem;
- Ciftci, Yasemin
- Article
19
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 84, doi. 10.1007/s11664-017-5763-7
- Li, Z.;
- Belyakov, S.;
- Xian, J.;
- Gourlay, C.
- Article
20
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 312, doi. 10.1007/s11664-017-5765-5
- Babu, G.;
- Shajan, X.;
- Alwin, S.;
- Ramasubbu, V.;
- Balerao, Gopal
- Article
21
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 299, doi. 10.1007/s11664-017-5766-4
- Benyahia, D.;
- Kubiszyn, Ł.;
- Michalczewski, K.;
- Kębłowski, A.;
- Martyniuk, P.;
- Piotrowski, J.;
- Rogalski, A.
- Article
22
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 415, doi. 10.1007/s11664-017-5767-3
- El-Menyawy, E.;
- Darwish, A.
- Article
23
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 385, doi. 10.1007/s11664-017-5768-2
- Wei, Qiang;
- Wu, Shengli;
- Wei, Kongting;
- Li, Jie;
- Hu, Wenbo;
- Zhang, Jintao
- Article
24
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 347, doi. 10.1007/s11664-017-5769-1
- Li, Xiang;
- Xiong, Jian;
- Luo, Yuan;
- Luo, Yongmei
- Article
25
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 323, doi. 10.1007/s11664-017-5770-8
- Article
26
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 337, doi. 10.1007/s11664-017-5771-7
- Gao, Kezheng;
- Niu, Qingyuan;
- Tang, Qiheng;
- Guo, Yaqing;
- Wang, Lizhen
- Article
27
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 394, doi. 10.1007/s11664-017-5772-6
- Kumar, Anuruddh;
- Chauhan, Aditya;
- Vaish, Rahul;
- Kumar, Rajeev;
- Jain, Satish
- Article
28
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 359, doi. 10.1007/s11664-017-5773-5
- Chang, C.;
- Wadekar, P.;
- Guo, S.;
- Cheng, Y.;
- Chou, M.;
- Huang, H.;
- Hsieh, W.;
- Lai, W.;
- Chen, Q.;
- Tu, L.
- Article
29
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 96, doi. 10.1007/s11664-017-5774-4
- Wang, Yan;
- Han, Jing;
- Wang, Yishu;
- Ma, Limin;
- Guo, Fu
- Article
30
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 305, doi. 10.1007/s11664-017-5775-3
- Sarkar, Biplab;
- Reddy, Pramod;
- Klump, Andrew;
- Kaess, Felix;
- Rounds, Robert;
- Kirste, Ronny;
- Mita, Seiji;
- Kohn, Erhard;
- Collazo, Ramon;
- Sitar, Zlatko
- Article
31
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 353, doi. 10.1007/s11664-017-5776-2
- Harb, Mohamed;
- Ebrahim, Shaker;
- Soliman, Moataz;
- Shabana, Mahmoud
- Article
32
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 27, doi. 10.1007/s11664-017-5777-1
- Tseng, Yu-Chen;
- Lee, Hsuan;
- Hau, Nga;
- Feng, Shien-Ping;
- Chen, Chih-Ming
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 368, doi. 10.1007/s11664-017-5779-z
- Huang, Ting-Chia;
- Smet, Vanessa;
- Kawamoto, Satomi;
- Pulugurtha, Markondeya;
- Tummala, Rao
- Article
34
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 402, doi. 10.1007/s11664-017-5780-6
- Bayatpour, Sareh;
- Isik, Dilek;
- Santato, Clara
- Article
35
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 409, doi. 10.1007/s11664-017-5781-5
- Qu, Xiao;
- Yao, Da-Chuan;
- Liu, Jin-Ran;
- Wang, Mao-Hua;
- Zhang, Han-Ping
- Article
36
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 378, doi. 10.1007/s11664-017-5782-4
- Abdellatif, M.;
- Azab, A.;
- Moustafa, A.
- Article
37
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 542, doi. 10.1007/s11664-017-5783-3
- Chen, Jianqiang;
- Li, Yufeng;
- Miao, Weiliang;
- Mai, Chengle;
- Li, Mingyu
- Article
38
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 436, doi. 10.1007/s11664-017-5785-1
- Khandy, Shakeel;
- Islam, Ishtihadah;
- Ganai, Zahid;
- Gupta, Dinesh;
- Parrey, Khursheed
- Article
39
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 457, doi. 10.1007/s11664-017-5786-0
- Kanjilal, Anwesha;
- Kumar, Praveen
- Article
40
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 162, doi. 10.1007/s11664-017-5787-z
- Ryu, Sungyeon;
- Kim, Seong;
- Choi, Byung
- Article
41
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 18, doi. 10.1007/s11664-017-5788-y
- O, M.;
- Suzuki, T.;
- Kajihara, M.
- Article
42
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 422, doi. 10.1007/s11664-017-5790-4
- Hou, Zhaohui;
- Chen, Zhengu;
- Jing, Mingjun;
- Yang, Hang;
- Li, Gangyong;
- Zhou, Minjie
- Article
43
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 49, doi. 10.1007/s11664-017-5791-3
- Gancarz, Tomasz;
- Bobrowski, Piotr;
- Pawlak, Sylwia;
- Schell, Norbert;
- Chulist, Robert;
- Janik, Katarzyna
- Article
44
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 430, doi. 10.1007/s11664-017-5792-2
- Lee, Byung-Suk;
- Yoon, Jeong-Won
- Article
45
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 449, doi. 10.1007/s11664-017-5793-1
- Berber, Mohamed;
- Doumi, Bendouma;
- Mokaddem, Allel;
- Mogulkoc, Yesim;
- Sayede, Adlane;
- Tadjer, Abdelkader
- Article
46
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 493, doi. 10.1007/s11664-017-5794-0
- Arunmetha, S.;
- Vinoth, M.;
- Srither, S.;
- Karthik, A.;
- Sridharpanday, M.;
- Suriyaprabha, R.;
- Manivasakan, P.;
- Rajendran, V.
- Article
47
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 443, doi. 10.1007/s11664-017-5795-z
- Li, X.;
- Lv, M.;
- Huang, X.;
- Zhu, W.;
- Wang, K.;
- Fan, Y.;
- Tao, S.;
- Pan, A.;
- Wang, S.;
- Guo, D.;
- Li, P.
- Article
48
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 470, doi. 10.1007/s11664-017-5796-y
- Ike, Innocent;
- Sigalas, Iakovos;
- Iyuke, Sunny
- Article
49
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 744, doi. 10.1007/s11664-017-5797-x
- Wang, Dagui;
- Yan, Bing;
- Song, Caixiong;
- Ye, Ting;
- Wang, Yongqian
- Article
50
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 620, doi. 10.1007/s11664-017-5798-9
- Bykkam, Satish;
- Kalagadda, Bikshalu;
- Kalagadda, Venkateswara;
- Ahmadipour, Mohsen;
- Chakra, Ch.;
- Rajendar, V.
- Article