Works matching IS 03615235 AND DT 2018 AND VI 47 AND IP 1
Results: 107
Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 35, doi. 10.1007/s11664-017-5685-4
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Stretchable Characteristics of Thin Au Film on Polydimethylsiloxane Substrate with Parylene Intermediate Layer for Stretchable Electronic Packaging.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 9, doi. 10.1007/s11664-017-5722-3
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Thermodynamic Description of the Quaternary Ag-Bi-Cu-Sn System.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 212, doi. 10.1007/s11664-017-5735-y
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Synthesis and Performance of Tungsten Disulfide/Carbon (WS/C) Composite as Anode Material.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 251, doi. 10.1007/s11664-017-5740-1
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Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 662, doi. 10.1007/s11664-017-5741-0
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Enhancement of Thermoelectric Properties in SnTe with (Ag, In) Co-Doping.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 205, doi. 10.1007/s11664-017-5745-9
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Electric Circuit Model Analogy for Equilibrium Lattice Relaxation in Semiconductor Heterostructures.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 173, doi. 10.1007/s11664-017-5750-z
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Finite Element Study on Performance of Piezoelectric Bimorph Cantilevers Using Porous/Ceramic 0-3 Polymer Composites.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 233, doi. 10.1007/s11664-017-5751-y
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A Rapid Method for Deposition of Sn-Doped GaN Thin Films on Glass and Polyethylene Terephthalate Substrates.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 167, doi. 10.1007/s11664-017-5752-x
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Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 77, doi. 10.1007/s11664-017-5754-8
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Structural and Thermoelectric Properties of BiSb Prepared by Non-equal Channel Angular Extrusion.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 242, doi. 10.1007/s11664-017-5755-7
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Easily Dispersible NiFeO/RGO Composite for Microwave Absorption Properties in the X-Band.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 292, doi. 10.1007/s11664-017-5756-6
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Design of a Thermoelectric Material Using the CALPHAD Technique: Thermodynamic Reassessment of the Al-Sb-Zn System.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 261, doi. 10.1007/s11664-017-5757-5
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Synthesis and Characterization of Reduced Graphene Oxide/Rhodamine 101 (rGO-Rh101) Nanocomposites and Their Heterojunction Performance in rGO-Rh101/ p-Si Device Configuration.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 329, doi. 10.1007/s11664-017-5758-4
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Dye-Sensitized Solar Cells Employing Extracts from Four Cassia Flowers as Natural Sensitizers: Studies on Dye Ingredient Effect on Photovoltaic Performance.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 225, doi. 10.1007/s11664-017-5759-3
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Effect of A-Site Non-stoichiometry on Structure and Microwave Dielectric Properties of Ca(LiNdBiNa)TiO Ceramics.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 285, doi. 10.1007/s11664-017-5760-x
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Ab Initio Prediction of the Structural, Electronic, Elastic, and Thermoelectric Properties of Half-Heusler Ternary Compounds TiIrX (X = As and Sb).
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 196, doi. 10.1007/s11664-017-5761-9
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Physical Properties of Superhard Diamond-Like BC from a First-Principles Study.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 272, doi. 10.1007/s11664-017-5762-8
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The Influence of Primary CuSn Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 84, doi. 10.1007/s11664-017-5763-7
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Effect of Reaction Period on Stoichiometry, Phase Purity, and Morphology of Hydrothermally Synthesized CuNiSnS Nanopowder.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 312, doi. 10.1007/s11664-017-5765-5
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Interfacial Misfit Array Technique for GaSb Growth on GaAs (001) Substrate by Molecular Beam Epitaxy.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 299, doi. 10.1007/s11664-017-5766-4
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Dependence of Optical Properties of Safranin-T Films on Post-deposition Annealing Temperature.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 415, doi. 10.1007/s11664-017-5767-3
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Preparation of MgO/Au Multilayer Composite Films and Related Studies on Secondary Electron Emission Effect.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 385, doi. 10.1007/s11664-017-5768-2
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Electrochemical Properties of RuO Electrodes as a Function of Thin Film Thickness.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 347, doi. 10.1007/s11664-017-5769-1
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Ultra-Thin Dual-Band Polarization-Insensitive and Wide-Angle Perfect Metamaterial Absorber Based on a Single Circular Sector Resonator Structure.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 323, doi. 10.1007/s11664-017-5770-8
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Graphene-Like 2D Porous Carbon Nanosheets Derived from Cornstalk Pith for Energy Storage Materials.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 337, doi. 10.1007/s11664-017-5771-7
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Structural Optimization for Wideband Flexoelectric Energy Harvester Using Bulk Paraelectric BaSrTiO.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 394, doi. 10.1007/s11664-017-5772-6
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Controlling Surface Morphology and Circumventing Secondary Phase Formation in Non-polar m-GaN by Tuning Nitrogen Activity.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 359, doi. 10.1007/s11664-017-5773-5
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Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 96, doi. 10.1007/s11664-017-5774-4
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On Ni/Au Alloyed Contacts to Mg-Doped GaN.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 305, doi. 10.1007/s11664-017-5775-3
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Fabrication of Organic Transistors Using Nanomaterials for Sensing Applications.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 353, doi. 10.1007/s11664-017-5776-2
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Electrodeposition of Ni on BiTe and Interfacial Reaction Between Sn and Ni-Coated BiTe.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 27, doi. 10.1007/s11664-017-5777-1
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Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 368, doi. 10.1007/s11664-017-5779-z
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Films of Transition Metal Complexes Including Ionic Liquids: Dramatic Effects of Processing Parameters and Substrate on the Film Morphology.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 402, doi. 10.1007/s11664-017-5780-6
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Synthesis of SiO-Coated Core-Shell ZnO Composites for Preparing High-Voltage Varistors.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 409, doi. 10.1007/s11664-017-5781-5
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Dielectric Spectroscopy of Localized Electrical Charges in Ferrite Thin Film.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 378, doi. 10.1007/s11664-017-5782-4
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Bonding Cu to AlO with Bi-B-Zn Oxide Glass Via Oxidation-Reduction Reaction.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 542, doi. 10.1007/s11664-017-5783-3
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High-Temperature and High-Pressure Study of Electronic and Thermal Properties of PbTaO and SnAlO Metal Perovskites by Density Functional Theory Calculations.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 436, doi. 10.1007/s11664-017-5785-1
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Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 457, doi. 10.1007/s11664-017-5786-0
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Resistive Switching of TaO-Based Self-Rectifying Vertical-Type Resistive Switching Memory.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 162, doi. 10.1007/s11664-017-5787-z
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Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 18, doi. 10.1007/s11664-017-5788-y
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RGO-RGONRs-ZnSnO Composite with Three-Dimensional Hierarchical Structure for Use in Lithium-Ion Batteries.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 422, doi. 10.1007/s11664-017-5790-4
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Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 49, doi. 10.1007/s11664-017-5791-3
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Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 430, doi. 10.1007/s11664-017-5792-2
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First-Principle Predictions of Electronic Properties and Half-Metallic Ferromagnetism in Vanadium-Doped Rock-Salt SrO.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 449, doi. 10.1007/s11664-017-5793-1
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Study on Production of Silicon Nanoparticles from Quartz Sand for Hybrid Solar Cell Applications.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 493, doi. 10.1007/s11664-017-5794-0
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Characterization and Ultraviolet Photodetection Application of the SmO/ n-Si Heterojunction.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 443, doi. 10.1007/s11664-017-5795-z
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The Effects of Self-Discharge on the Performance of Asymmetric/Hybrid Electrochemical Capacitors with Redox-Active Electrolytes: Insights from Modeling and Simulation.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 470, doi. 10.1007/s11664-017-5796-y
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Synthesis of Hierarchical Self-Assembled CuO and Their Structure-Enhanced Photocatalytic Performance.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 744, doi. 10.1007/s11664-017-5797-x
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Effect of Few-Layered Graphene-Based CdO Nanocomposite-Enhanced Power Conversion Efficiency of Dye-Sensitized Solar Cell.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 620, doi. 10.1007/s11664-017-5798-9
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