Works matching IS 03615235 AND DT 2016 AND VI 45 AND IP 3
1
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1227, doi. 10.1007/s11664-015-3952-9
- Song, Kwon-Min;
- Shin, Dong-Kil;
- Kim, Il-Ho
- Article
2
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1234, doi. 10.1007/s11664-015-3967-2
- Shin, Dong-Kil;
- Kim, Il-Ho
- Article
3
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1240, doi. 10.1007/s11664-015-3973-4
- Fu, Liangwei;
- Yang, Junyou;
- Jiang, Qinghui;
- Xiao, Ye;
- Luo, Yubo;
- Zhang, Dan;
- Zhou, Zhiwei
- Article
4
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1245, doi. 10.1007/s11664-015-3976-1
- Lee, Woo-Man;
- Shin, Dong-Kil;
- Kim, Il-Ho
- Article
5
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1251, doi. 10.1007/s11664-015-3984-1
- Joo, Gyeong-Seok;
- Shin, Dong-Kil;
- Kim, Il-Ho
- Article
6
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1257, doi. 10.1007/s11664-015-3986-z
- Article
7
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1260, doi. 10.1007/s11664-015-3988-x
- Ashby, Shane;
- Bian, Tiezheng;
- Guélou, Gabin;
- Powell, Anthony;
- Chao, Yimin
- Article
8
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1266, doi. 10.1007/s11664-015-3991-2
- Xiao, Ye;
- Yang, Junyou;
- Jiang, Qinghui;
- Fu, Liangwei;
- Luo, Yubo;
- Zhang, Dan;
- Zhou, Zhiwei
- Article
9
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1271, doi. 10.1007/s11664-015-3997-9
- Guo, Lijie;
- Zhang, Yumeng;
- Zheng, Yong;
- Yao, Wei;
- Wang, Guiwen;
- Wang, Guoyu;
- Zhou, Xiaoyuan
- Article
10
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1278, doi. 10.1007/s11664-015-3998-8
- Article
11
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1284, doi. 10.1007/s11664-015-3999-7
- Mikami, M.;
- Inukai, M.;
- Miyazaki, H.;
- Nishino, Y.
- Article
12
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1290, doi. 10.1007/s11664-015-4000-5
- Gao, Jie;
- Liu, Chengyan;
- Miao, Lei;
- Wang, Xiaoyang;
- Chen, Yu
- Article
13
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1296, doi. 10.1007/s11664-015-4003-2
- Vizel, Roi;
- Bargig, Tal;
- Beeri, Ofer;
- Gelbstein, Yaniv
- Article
14
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1301, doi. 10.1007/s11664-015-4014-z
- Article
15
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1309, doi. 10.1007/s11664-015-4015-y
- Man, E.;
- Sera, D.;
- Mathe, L.;
- Schaltz, E.;
- Rosendahl, L.
- Article
16
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1316, doi. 10.1007/s11664-015-4018-8
- Sanduleac, Ionel;
- Casian, Anatolie
- Article
17
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1321, doi. 10.1007/s11664-015-4022-z
- Sakamoto, Tatsuya;
- Taguchi, Yutaka;
- Kutsuwa, Takeshi;
- Ichimi, Kiyohide;
- Kasatani, Shinichi;
- Inada, Minoru
- Article
18
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1328, doi. 10.1007/s11664-015-4027-7
- Liu, Xing;
- Zhao, Wen-yu;
- Zhou, Hong-yu;
- Mu, Xin;
- He, Dan-qi;
- Zhu, Wan-ting;
- Wei, Ping;
- Wu, Han;
- Zhang, Qing-jie
- Article
19
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1336, doi. 10.1007/s11664-015-4028-6
- KoleŻyński, Andrzej;
- Szczypka, Wojciech
- Article
20
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1346, doi. 10.1007/s11664-015-4029-5
- Carr, Winston;
- Morelli, Donald
- Article
21
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1351, doi. 10.1007/s11664-015-4032-x
- Levinsky, P.;
- Vaney, J.-B.;
- Candolfi, C.;
- Dauscher, A.;
- Lenoir, B.;
- Hejtmánek, J.
- Article
22
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1358, doi. 10.1007/s11664-015-4034-8
- Oki, Sae;
- Ito, Keita;
- Natsui, Shungo;
- Suzuki, Ryosuke
- Article
23
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1365, doi. 10.1007/s11664-015-4036-6
- Hamada, Haruki;
- Kikuchi, Yuta;
- Hayashi, Kei;
- Miyazaki, Yuzuru
- Article
24
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1369, doi. 10.1007/s11664-015-4037-5
- Kruszewski, M.J.;
- Zybała, R.;
- Ciupiński, Ł.;
- Chmielewski, M.;
- Adamczyk-Cieślak, B.;
- Michalski, A.;
- Rajska, M.;
- Kurzydłowski, K.J.
- Article
25
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1377, doi. 10.1007/s11664-015-4039-3
- Fujimoto, Yuta;
- Uenuma, Mutsunori;
- Ishikawa, Yasuaki;
- Uraoka, Yukiharu
- Article
26
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1382, doi. 10.1007/s11664-015-4041-9
- Mena, Joaquin;
- Rausch, Elisabeth;
- Ouardi, Siham;
- Gruhn, Thomas;
- Fecher, Gerhard;
- Schoberth, Heiko;
- Emmerich, Heike;
- Felser, Claudia
- Article
27
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1389, doi. 10.1007/s11664-015-4045-5
- Qu, Sanyin;
- Yao, Qin;
- Shi, Wei;
- Wang, Liming;
- Chen, Lidong
- Article
28
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1397, doi. 10.1007/s11664-015-4046-4
- Sesselmann, A.;
- Skomedal, G.;
- Middleton, H.;
- Müller, E.
- Article
29
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1408, doi. 10.1007/s11664-015-4049-1
- Nesarajah, Marco;
- Frey, Georg
- Article
30
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1412, doi. 10.1007/s11664-015-4050-8
- Ren, Fei;
- Menchhofer, Paul;
- Kiggans, James;
- Wang, Hsin
- Article
31
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1419, doi. 10.1007/s11664-015-4055-3
- Ohorodniichuk, V.;
- Dauscher, A.;
- Masschelein, Ph.;
- Candolfi, C.;
- Baranek, Ph.;
- Dalicieux, P.;
- Lenoir, B.
- Article
32
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1425, doi. 10.1007/s11664-015-4058-0
- Chen, Song;
- Cai, Kefeng;
- Shen, Shirley
- Article
33
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1433, doi. 10.1007/s11664-015-4059-z
- Frobenius, Fabian;
- Gaiser, Gerd;
- Rusche, Ulrich;
- Weller, Bernd
- Article
34
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1441, doi. 10.1007/s11664-015-4061-5
- Cai, Zhengwei;
- Guo, Lijie;
- Xu, Xiaolong;
- Yan, Yanci;
- Peng, Kunling;
- Wang, Guiwen;
- Wang, Guoyu;
- Zhou, Xiaoyuan
- Article
35
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1447, doi. 10.1007/s11664-015-4063-3
- Vaney, J.-B.;
- Carreaud, J.;
- Delaizir, G.;
- Morin, C.;
- Monnier, J.;
- Alleno, E.;
- Piarristeguy, A.;
- Pradel, A.;
- Gonçalves, A.P.;
- Lopes, E.B.;
- Candolfi, C.;
- Dauscher, A.;
- Lenoir, B.
- Article
36
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1453, doi. 10.1007/s11664-015-4069-x
- Li, Weijian;
- Zhou, Chenyi;
- Li, Liangliang
- Article
37
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1459, doi. 10.1007/s11664-015-4070-4
- Dreßler, Christian;
- Löhnert, Romy;
- Gonzalez-Julian, Jesus;
- Guillon, Olivier;
- Töpfer, Jörg;
- Teichert, Steffen
- Article
38
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1464, doi. 10.1007/s11664-015-4077-x
- Su, C.;
- Huang, C.;
- Deng, Y.;
- Wang, Y.;
- Chu, P.;
- Zheng, S.
- Article
39
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1473, doi. 10.1007/s11664-015-4082-0
- Lubieniecki, Michał;
- Roemer, Jakub;
- Martowicz, Adam;
- Wojciechowski, Krzysztof;
- Uhl, Tadeusz
- Article
40
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1478, doi. 10.1007/s11664-015-4083-z
- Omoto, Tatsuro;
- Kanaya, Hiroki;
- Ishibashi, Hiroki;
- Kubota, Yoshiki;
- Kifune, Kouichi;
- Kosuga, Atsuko
- Article
41
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1484, doi. 10.1007/s11664-015-4085-x
- Chen, Ming;
- Tan, Gangfeng;
- Guo, Xuexun;
- Deng, Yadong;
- Zhang, Hongguang;
- Yang, Kai
- Article
42
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1502, doi. 10.1007/s11664-015-4088-7
- Pelz, U.;
- Jaklin, J.;
- Rostek, R.;
- Thoma, F.;
- Kröner, M.;
- Woias, P.
- Article
43
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1508, doi. 10.1007/s11664-015-4089-6
- Graff, Ayelet;
- Amouyal, Yaron
- Article
44
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1517, doi. 10.1007/s11664-015-4090-0
- MusiaŁ, M.;
- Borcuch, M.;
- Wojciechowski, K.
- Article
45
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1523, doi. 10.1007/s11664-015-4094-9
- Kitagawa, Hiroyuki;
- Mimura, Naoki;
- Takimura, Kodai;
- Morito, Shigekazu;
- Kikuchi, Kotaro
- Article
46
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1529, doi. 10.1007/s11664-015-4095-8
- Du, H.;
- Wang, Y.;
- Yuan, X.;
- Deng, Y.;
- Su, C.
- Article
47
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1540, doi. 10.1007/s11664-015-4101-1
- Vasilevskiy, D.;
- Simard, J.-M.;
- Caillat, T.;
- Masut, R.;
- Turenne, S.
- Article
48
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1548, doi. 10.1007/s11664-015-4102-0
- Wyzga, P.;
- Wojciechowski, K.
- Article
49
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1555, doi. 10.1007/s11664-015-4113-x
- Komine, Takashi;
- Aono, Tomosuke;
- Nabatame, Yuta;
- Murata, Masayuki;
- Hasegawa, Yasuhiro
- Article
50
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1561, doi. 10.1007/s11664-015-4114-9
- Ohorodniichuk, V.;
- Candolfi, C.;
- Masschelein, Ph.;
- Baranek, Ph.;
- Dalicieux, P.;
- Dauscher, A.;
- Lenoir, B.
- Article