Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6192, doi. 10.1007/s11664-016-4719-7
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2016 AND VI 45 AND IP 12
Results: 41
1
2
Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6200, doi. 10.1007/s11664-016-4763-3
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- Publication type:
- Article
3
Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6102, doi. 10.1007/s11664-016-4773-1
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- Publication type:
- Article
4
Growth of ErAs Nanoparticles by Pulsed Laser Ablation in an Inert Environment.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6247, doi. 10.1007/s11664-016-4775-z
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- Publication type:
- Article
5
Phase Equilibria of the Fe-Ni-Sn Ternary System at 270°C.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6208, doi. 10.1007/s11664-016-4787-8
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- Publication type:
- Article
6
Influence of Li Addition to Zn-Al Alloys on Cu Substrate During Spreading Test and After Aging Treatment.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6067, doi. 10.1007/s11664-016-4815-8
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- Publication type:
- Article
7
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7
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- Publication type:
- Article
8
Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6150, doi. 10.1007/s11664-016-4837-2
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- Publication type:
- Article
9
Thin-Film Photoluminescent Properties and the Atomistic Model of MgTiO as a Non-rare Earth Matrix Material for Red-Emitting Phosphor.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6214, doi. 10.1007/s11664-016-4846-1
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- Publication type:
- Article
10
Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6233, doi. 10.1007/s11664-016-4848-z
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- Publication type:
- Article
11
In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6163, doi. 10.1007/s11664-016-4874-x
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- Publication type:
- Article
12
Effect of Ligament Morphology on Electrical Conductivity of Porous Silver.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6113, doi. 10.1007/s11664-016-4879-5
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- Publication type:
- Article
13
LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6171, doi. 10.1007/s11664-016-4885-7
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- Publication type:
- Article
14
Effect of Silicon Carbide Nanoparticles on the Grain Boundary Segregation and Thermoelectric Properties of Bismuth Doped MgSiGe.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6052, doi. 10.1007/s11664-016-4892-8
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- Publication type:
- Article
15
Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6177, doi. 10.1007/s11664-016-4902-x
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- Publication type:
- Article
16
Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6184, doi. 10.1007/s11664-016-4908-4
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- Publication type:
- Article
17
Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6095, doi. 10.1007/s11664-016-4929-z
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- Publication type:
- Article
18
Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6079, doi. 10.1007/s11664-016-4941-3
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- Publication type:
- Article
19
Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6086, doi. 10.1007/s11664-016-4965-8
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- Publication type:
- Article
20
Optical and Electrical Study of Defects in GaN In Situ Doped with Eu Ion Grown by OMVPE.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6355, doi. 10.1007/s11664-016-4983-6
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- Publication type:
- Article
21
Molecular Beam Epitaxy Growth of High Crystalline Quality LiNbO.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6292, doi. 10.1007/s11664-016-4986-3
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- Publication type:
- Article
22
Thin Film Transistors Using Wafer-Scale Low-Temperature MOCVD WSe.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6280, doi. 10.1007/s11664-016-4987-2
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- Publication type:
- Article
23
Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6123, doi. 10.1007/s11664-016-5000-9
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- Publication type:
- Article
24
Ultra-low Contact Resistivity of PtHf Silicide Utilizing Dopant Segregation Process.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6323, doi. 10.1007/s11664-016-5002-7
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- Publication type:
- Article
25
Effect of O Fraction in the Sputter Gas on the Electrical Properties of Amorphous In-Zn-O and the Thin Film Transistor Performance.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6310, doi. 10.1007/s11664-016-5008-1
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- Publication type:
- Article
26
Enhanced Thermoelectric Properties of p-type BiSbTe Thermoelectric Materials by Mechanical Alloying and Spark Plasma Sintering.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6059, doi. 10.1007/s11664-016-5011-6
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- Publication type:
- Article
27
Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6222, doi. 10.1007/s11664-016-5012-5
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- Publication type:
- Article
28
Improved High-Energy Response of AlGaAs/GaAs Solar Cells Using a Low-Cost Technology.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6317, doi. 10.1007/s11664-016-5015-2
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- Publication type:
- Article
29
Fourier Transform Infrared Spectroscopy Measurements of Multi-phonon and Free-Carrier Absorption in ZnO.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6329, doi. 10.1007/s11664-016-5023-2
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- Publication type:
- Article
30
Effects of Substrate and Post-Growth Treatments on the Microstructure and Properties of ZnO Thin Films Prepared by Atomic Layer Deposition.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6337, doi. 10.1007/s11664-016-5025-0
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- Publication type:
- Article
31
Study of High-Quality GeSn Alloys Grown by Chemical Vapor Deposition towards Mid-Infrared Applications.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6251, doi. 10.1007/s11664-016-5028-x
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- Publication type:
- Article
32
Growth and Implementation of Carbon-Doped AlGaN Layers for Enhancement-Mode HEMTs on 200 mm Si Substrates.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6346, doi. 10.1007/s11664-016-5029-9
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- Publication type:
- Article
33
Growth and Characterization of Single Crystalline InN Grown on GaN by RF Sputtering for Robust Schottky Contacts.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6305, doi. 10.1007/s11664-016-5030-3
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- Publication type:
- Article
34
Structural and Optical Characteristics of GeSn Quantum Wells for Silicon-Based Mid-Infrared Optoelectronic Applications.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6265, doi. 10.1007/s11664-016-5031-2
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- Publication type:
- Article
35
Investigation of Surface Defects in AlInSb Metamorphic Buffer (MB) Grown on GaSb.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6258, doi. 10.1007/s11664-016-5032-1
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- Publication type:
- Article
36
Influence of Carbon in Metalorganic Chemical Vapor Deposition of Few-Layer WSe Thin Films.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6273, doi. 10.1007/s11664-016-5033-0
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- Publication type:
- Article
37
Pd and Au Contacts to SnS: Thermodynamic Predictions and Annealing Study.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6300, doi. 10.1007/s11664-016-5042-z
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- Publication type:
- Article
38
The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6130, doi. 10.1007/s11664-016-5044-x
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- Publication type:
- Article
39
MgO/CuO Superlattices: Growth of Epitaxial Two-Dimensional Nanostructures.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6285, doi. 10.1007/s11664-016-5049-5
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- Publication type:
- Article
40
Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn- xTi Solder and Cu.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6137, doi. 10.1007/s11664-016-5109-x
- By:
- Publication type:
- Article
41
Efficient and Robust Thermoelectric Power Generation Device Using Hot-Pressed Metal Contacts on Nanostructured Half-Heusler Alloys.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6047, doi. 10.1007/s11664-016-4692-1
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- Publication type:
- Article