Works matching IS 03615235 AND DT 2015 AND VI 44 AND IP 9
1
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2990, doi. 10.1007/s11664-015-3703-y
- Zhang, J.;
- Umana-Membreno, G.A.;
- Gu, R.;
- Lei, W.;
- Antoszewski, J.;
- Dell, J.M.;
- Faraone, L.
- Article
2
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3002, doi. 10.1007/s11664-015-3713-9
- Wenisch, J.;
- Schirmacher, W.;
- Wollrab, R.;
- Eich, D.;
- Hanna, S.;
- Breiter, R.;
- Lutz, H.;
- Figgemeier, H.
- Article
3
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3007, doi. 10.1007/s11664-015-3714-8
- Article
4
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2969, doi. 10.1007/s11664-015-3717-5
- Article
5
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3013, doi. 10.1007/s11664-015-3733-5
- Uruno, Aya;
- Usui, Ayaka;
- Inoue, Tomohiro;
- Takeda, Yuji;
- Kobayashi, Masakazu
- Article
6
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2955, doi. 10.1007/s11664-015-3737-1
- Article
7
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2977, doi. 10.1007/s11664-015-3740-6
- Fulk, C.;
- Radford, W.;
- Buell, D.;
- Bangs, J.;
- Rybnicek, K.
- Article
8
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3018, doi. 10.1007/s11664-015-3742-4
- Hossain, A.;
- Bolotnikov, A.;
- Camarda, G.;
- Cui, Y.;
- Gul, R.;
- Kim, K.-H.;
- Roy, U.;
- Tong, X.;
- Yang, G.;
- James, R.
- Article
9
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3023, doi. 10.1007/s11664-015-3743-3
- Banerjee, Sneha;
- Dahal, Rajendra;
- Bhat, Ishwara
- Article
10
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3030, doi. 10.1007/s11664-015-3745-1
- Article
11
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3036, doi. 10.1007/s11664-015-3756-y
- Ting, David;
- Soibel, Alexander;
- Höglund, Linda;
- Gunapala, Sarath
- Article
12
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3044, doi. 10.1007/s11664-015-3764-y
- Akhavan, Nima;
- Jolley, Gregory;
- Umana-Membreno, Gilberto;
- Antoszewski, Jarek;
- Faraone, Lorenzo
- Article
13
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3056, doi. 10.1007/s11664-015-3767-8
- Vallone, Marco;
- Mandurrino, Marco;
- Goano, Michele;
- Bertazzi, Francesco;
- Ghione, Giovanni;
- Schirmacher, Wilhelm;
- Hanna, Stefan;
- Figgemeier, Heinrich
- Article
14
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3064, doi. 10.1007/s11664-015-3769-6
- Suarez, E.;
- Chan, P.-Y.;
- Gogna, M.;
- Ayers, J.E.;
- Heller, E.;
- Jain, F.
- Article
15
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3069, doi. 10.1007/s11664-015-3821-6
- Gravrand, O.;
- Boulard, F.;
- Ferron, A.;
- Ballet, Ph.;
- Hassis, W.
- Article
16
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3076, doi. 10.1007/s11664-015-3822-5
- Jacobs, R.;
- Jaime Vasquez, M.;
- Lennon, C.;
- Nozaki, C.;
- Almeida, L.;
- Pellegrino, J.;
- Arias, J.;
- Taylor, C.;
- Wissman, B.
- Article
17
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3082, doi. 10.1007/s11664-015-3823-4
- Benson, J.;
- Bubulac, L.;
- Jaime-Vasquez, M.;
- Lennon, C.;
- Smith, P.;
- Jacobs, R.;
- Markunas, J.;
- Almeida, L.;
- Stoltz, A.;
- Arias, J.;
- Wijewarnasuriya, P.;
- Peterson, J.;
- Reddy, M.;
- Vilela, M.;
- Johnson, S.;
- Lofgreen, D.;
- Yulius, A.;
- Carmody, M.;
- Hirsch, R.;
- Fiala, J.
- Article
18
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3092, doi. 10.1007/s11664-015-3824-3
- Sullivan, William;
- Beck, Jeffrey;
- Scritchfield, Richard;
- Skokan, Mark;
- Mitra, Pradip;
- Sun, Xiaoli;
- Abshire, James;
- Carpenter, Darren;
- Lane, Barry
- Article
19
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3102, doi. 10.1007/s11664-015-3825-2
- Schaake, Christopher;
- Strong, Roger;
- Kinch, Mike;
- Harris, Fred;
- Robertson, Lance;
- Zhao, Jun;
- Aqariden, Fikri
- Article
20
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3108, doi. 10.1007/s11664-015-3827-0
- Jain, F.;
- Chan, P.-Y.;
- Lingalugari, M.;
- Kondo, J.;
- Suarez, E.;
- Gogna, P.;
- Chandy, J.;
- Heller, E.
- Article
21
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3116, doi. 10.1007/s11664-015-3828-z
- Markowska, A.;
- Witkowska-Baran, M.;
- Kochanowska, D.;
- Mycielski, A.
- Article
22
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3118, doi. 10.1007/s11664-015-3829-y
- Su, Peng-Yu;
- Dahal, Rajendra;
- Wang, Gwo-Ching;
- Zhang, Shengbai;
- Lu, Toh-Ming;
- Bhat, Ishwara
- Article
23
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3124, doi. 10.1007/s11664-015-3830-5
- Bilgilisoy, E.;
- Özden, S.;
- Bakali, E.;
- Karakaya, M.;
- Selamet, Y.
- Article
24
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3134, doi. 10.1007/s11664-015-3831-4
- Wichman, A.R.;
- Pinkie, B.;
- Bellotti, E.
- Article
25
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3144, doi. 10.1007/s11664-015-3851-0
- Baier, N.;
- Cervera, C.;
- Gravrand, O.;
- Mollard, L.;
- Lobre, C.;
- Destefanis, G.;
- Bourgeois, G.;
- Zanatta, J.P.;
- Boulade, O.;
- Moreau, V.
- Article
26
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3151, doi. 10.1007/s11664-015-3852-z
- Bommena, R.;
- Ketharanathan, S.;
- Wijewarnasuriya, P.;
- Dhar, N.;
- Kodama, R.;
- Zhao, J.;
- Buurma, C.;
- Bergeson, J.;
- Aqariden, F.;
- Velicu, S.
- Article
27
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3157, doi. 10.1007/s11664-015-3857-7
- Berthoz, J.;
- Grille, R.;
- Rubaldo, L.;
- Gravrand, O.;
- Kerlain, A.;
- Pere-Laperne, N.;
- Martineau, L.;
- Chabuel, F.;
- Leclercq, D.
- Article
28
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3163, doi. 10.1007/s11664-015-3858-6
- Pawluczyk, J.;
- Piotrowski, J.;
- Pusz, W.;
- Koźniewski, A.;
- Orman, Z.;
- Gawron, W.;
- Piotrowski, A.
- Article
29
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3174, doi. 10.1007/s11664-015-3864-8
- Witkowska-Baran, M.;
- Kochanowska, D.;
- Mycielski, A.;
- Szadkowski, A.;
- Juchniewicz, M.;
- Kamińska, E.
- Article
30
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3180, doi. 10.1007/s11664-015-3876-4
- Lei, W.;
- Gu, R. J.;
- Antoszewski, J.;
- Dell, J.;
- Neusser, G.;
- Sieger, M.;
- Mizaikoff, B.;
- Faraone, L.
- Article
31
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3194, doi. 10.1007/s11664-015-3881-7
- Egarievwe, Stephen;
- Hossain, Anwar;
- Okwechime, Ifechukwude;
- Gul, Rubi;
- James, Ralph
- Article
32
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3202, doi. 10.1007/s11664-015-3913-3
- Farrell, S.;
- Barnes, T.;
- Metzger, W.;
- Park, J.;
- Kodama, R.;
- Sivananthan, S.
- Article
33
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3188, doi. 10.1007/s11664-015-3895-1
- Kondo, J.;
- Lingalugari, M.;
- Chan, P.-Y.;
- Heller, E.;
- Jain, F.
- Article
34
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 3207, doi. 10.1007/s11664-015-3926-y
- Duff, Martine;
- Washington, Aaron;
- Teague, Lucile;
- Wright, Jonathan;
- Burger, Arnold;
- Groza, Michael;
- Buliga, Vladimir
- Article
35
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2953, doi. 10.1007/s11664-015-3955-6
- Article
36
- Journal of Electronic Materials, 2015, v. 44, n. 9, p. 2981, doi. 10.1007/s11664-015-3701-0
- Pinkie, Benjamin;
- Wichman, Adam;
- Bellotti, Enrico
- Article