Works matching IS 03615235 AND DT 2015 AND VI 44 AND IP 7
Results: 42
Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2211, doi. 10.1007/s11664-015-3667-y
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- Article
Effects of Gd-Substitutions on the Microstructure, Electrical and Electromagnetic Behavior of M-Type Hexagonal Ferrites.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2221, doi. 10.1007/s11664-015-3671-2
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- Article
On the Manipulation of Ferroelectric and Ferroelastic Domains at the Nanoscale.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2230, doi. 10.1007/s11664-015-3674-z
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- Article
Microwave-Assisted Synthesis of High Dielectric Constant CaCuTiO from Sol-Gel Precursor.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2243, doi. 10.1007/s11664-015-3680-1
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- Article
Hysteresis Phenomenon in Heat-Voltage Curves of Polypyrrole-Coated Electrospun Nanofibrous and Regular Fibrous Mats.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2250, doi. 10.1007/s11664-015-3681-0
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- Article
Al-Ge Diffusion Bonding for Hermetic Sealing Application.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y
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- Article
AC Hopping Conductance in Nanocomposite Films with Ferromagnetic Alloy Nanoparticles in a PbZrTiO Matrix.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2260, doi. 10.1007/s11664-015-3685-9
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- Article
Superior Dielectric Performance of Engineering Thermoplastic as a Result of In situ Embedding of Nanoscale Mixed-Phase Molybdenum Oxide.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2269, doi. 10.1007/s11664-015-3686-8
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- Article
Orientation-Dependent Properties of CoFeO-BiNdTiO Bilayer Multiferroic Films Prepared by a Sol-Gel Method.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2348, doi. 10.1007/s11664-015-3689-5
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- Article
High Dielectric Constants of Composites of Fiber-Like Copper Phthalocyanine-Coated Graphene Oxide Embedded in Poly(arylene Ether Nitriles).
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2378, doi. 10.1007/s11664-015-3698-4
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- Article
Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2396, doi. 10.1007/s11664-015-3715-7
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- Article
Synthesis and Properties of Single Domain Strontium Hexa-ferrite Ultrafine Powders via a Surfactant-Assisted Co-precipitation Method.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2276, doi. 10.1007/s11664-015-3716-6
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- Article
Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2406, doi. 10.1007/s11664-015-3718-4
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- Article
Increase of Piezoelectric Constant and Thermal Durability of Polypropylene Electret by Introducing SiO and Kaolin Filler and Creating a Cellular Structure.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2283, doi. 10.1007/s11664-015-3719-3
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- Article
Size-Controllable Synthesis of FeO Nanospheres for Electromagnetic Wave Absorber.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2292, doi. 10.1007/s11664-015-3725-5
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- Article
Measurement of Dielectric Properties of Ultrafine BaTiO Using an Organic-Inorganic Composite Method.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2300, doi. 10.1007/s11664-015-3729-1
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- Article
Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2414, doi. 10.1007/s11664-015-3741-5
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- Article
Erratum to: Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment.
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- 2015
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- Erratum
Tuning Magnetic Behavior of Nanoscale Cobalt Sulfide and Its Nanocomposite with an Engineering Thermoplastic.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2308, doi. 10.1007/s11664-015-3753-1
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- Article
Low-Temperature Sintering and Microwave Dielectric Properties of ZnSiO Ceramic Added with Crystalline Zinc Borate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2312, doi. 10.1007/s11664-015-3762-0
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- Article
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2458, doi. 10.1007/s11664-015-3781-x
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- Article
Dielectric Behavior and Magnetic Properties of Mn-Substituted Ni-Zn Ferrites.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2369, doi. 10.1007/s11664-015-3770-0
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- Article
Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2432, doi. 10.1007/s11664-015-3772-y
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- Article
Creep Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2440, doi. 10.1007/s11664-015-3773-x
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- Article
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2450, doi. 10.1007/s11664-015-3774-9
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- Article
Phase Equilibria of the Sn-Ni-Si Ternary System and Interfacial Reactions in Sn-(Cu)/Ni-Si Couples.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2422, doi. 10.1007/s11664-015-3765-x
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- Article
CH/Ar/H/SF Plasma Etching for Surface Oxide Removal of Indium Bumps.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2467, doi. 10.1007/s11664-015-3786-5
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- Article
Enhanced Dielectric Properties and High-Temperature Microwave Absorption Performance of Zn-Doped AlO Ceramic.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2353, doi. 10.1007/s11664-015-3787-4
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- Article
Dielectric and Electrical Properties of BiFeO-LiTaO Systems.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2359, doi. 10.1007/s11664-015-3789-2
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- Article
Ferroelectric and Magnetodielectric Properties of Cobalt-Doped SrBaNbO Ceramics.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2321, doi. 10.1007/s11664-015-3792-7
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- Article
Investigation of the Absorption Properties of the Alloys Fe-Ni and Fe-Ni-Cr Prepared by Mechanical Alloying.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2331, doi. 10.1007/s11664-015-3793-6
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- Article
Influence of BaTiO Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2473, doi. 10.1007/s11664-015-3796-3
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- Article
Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2479, doi. 10.1007/s11664-015-3798-1
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- Article
Effects of BiO, TiO, and BiTiO Seeding Layers on the Structural and Electrical Properties of BiLaTiO Thin Films Grown by a Sol-Gel Method.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2340, doi. 10.1007/s11664-015-3800-y
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- Article
Preventing Electrical Shorts in Parallel-Plate Capacitors with Single-Printed Dielectric Layer.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2488, doi. 10.1007/s11664-015-3805-6
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- Article
Study of Optical and Electrical Properties of InS:Sn Films Deposited by Spray Pyrolysis.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2536, doi. 10.1007/s11664-015-3806-5
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- Article
Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2497, doi. 10.1007/s11664-015-3807-4
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- Publication type:
- Article
The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2507, doi. 10.1007/s11664-015-3812-7
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- Article
Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2514, doi. 10.1007/s11664-015-3813-6
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- Publication type:
- Article
Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2522, doi. 10.1007/s11664-015-3815-4
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- Article
Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2529, doi. 10.1007/s11664-015-3839-9
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- Publication type:
- Article
Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2544, doi. 10.1007/s11664-015-3631-x
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- Publication type:
- Article