Works matching IS 03615235 AND DT 2015 AND VI 44 AND IP 7

Results: 42

Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2211, doi. 10.1007/s11664-015-3667-y

By:

Takizawa, Yoshihiro;
Chung, D.

Publication type:

Article

Effects of Gd-Substitutions on the Microstructure, Electrical and Electromagnetic Behavior of M-Type Hexagonal Ferrites.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2221, doi. 10.1007/s11664-015-3671-2

By:

Ahmad, Ishtiaq;
Ahmad, Mahmood;
Ali, Ihsan;
Kanwal, M.;
Awan, M.;
Mustafa, Ghulam;
Ahmad, Mukhtar

Publication type:

Article

On the Manipulation of Ferroelectric and Ferroelastic Domains at the Nanoscale.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2230, doi. 10.1007/s11664-015-3674-z

By:

Durkan, Colm;
Garcia-Melendrez, Jose;
Ding, Long

Publication type:

Article

Microwave-Assisted Synthesis of High Dielectric Constant CaCuTiO from Sol-Gel Precursor.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2243, doi. 10.1007/s11664-015-3680-1

By:

Ouyang, Xin;
Cao, Peng;
Huang, Saifang;
Zhang, Weijun;
Huang, Zhaohui;
Gao, Wei

Publication type:

Article

Hysteresis Phenomenon in Heat-Voltage Curves of Polypyrrole-Coated Electrospun Nanofibrous and Regular Fibrous Mats.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2250, doi. 10.1007/s11664-015-3681-0

By:

Oroumei, Azam;
Tavanai, Hossein;
Morshed, Mohammad

Publication type:

Article

Al-Ge Diffusion Bonding for Hermetic Sealing Application.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y

By:

Chidambaram, Vivek;
Wickramanayaka, Sunil

Publication type:

Article

AC Hopping Conductance in Nanocomposite Films with Ferromagnetic Alloy Nanoparticles in a PbZrTiO Matrix.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2260, doi. 10.1007/s11664-015-3685-9

By:

Koltunowicz, T.N.;
Zukowski, P.;
Boiko, O.;
Saad, A.;
Fedotova, J.A.;
Fedotov, A.K.;
Larkin, A.V.;
Kasiuk, J.

Publication type:

Article

Superior Dielectric Performance of Engineering Thermoplastic as a Result of In situ Embedding of Nanoscale Mixed-Phase Molybdenum Oxide.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2269, doi. 10.1007/s11664-015-3686-8

By:

Qureshi, Nilam;
Shinde, Manish;
Ratheesh, R.;
Bhalerao, Anand;
Kale, Bharat;
Mulik, Uttam;
Amalnerkar, Dinesh

Publication type:

Article

Orientation-Dependent Properties of CoFeO-BiNdTiO Bilayer Multiferroic Films Prepared by a Sol-Gel Method.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2348, doi. 10.1007/s11664-015-3689-5

By:

Zhang, Fuwei;
Yang, Feng;
Dong, Cuifang;
Liu, Xiaotong;
Nan, Huilin;
Wang, Yingying;
Zong, Zhihao;
Tang, Minghua

Publication type:

Article

High Dielectric Constants of Composites of Fiber-Like Copper Phthalocyanine-Coated Graphene Oxide Embedded in Poly(arylene Ether Nitriles).

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2378, doi. 10.1007/s11664-015-3698-4

By:

Li, Jingwei;
Pu, Zejun;
Wang, Zicheng;
Long, Ya;
Jia, Kun;
Liu, Xiaobo

Publication type:

Article

Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2396, doi. 10.1007/s11664-015-3715-7

By:

Zhang, H.;
Zhang, X.

Publication type:

Article

Synthesis and Properties of Single Domain Strontium Hexa-ferrite Ultrafine Powders via a Surfactant-Assisted Co-precipitation Method.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2276, doi. 10.1007/s11664-015-3716-6

By:

Liu, Junliang;
Chen, Xiulei;
Yan, Leiming;
Wang, Shengyun;
Zhang, Ming

Publication type:

Article

Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2406, doi. 10.1007/s11664-015-3718-4

By:

Lee, Seung-Woo;
Lee, Tae-Hyung;
Park, Ji-Won;
Kim, Hyun-Joong

Publication type:

Article

Increase of Piezoelectric Constant and Thermal Durability of Polypropylene Electret by Introducing SiO and Kaolin Filler and Creating a Cellular Structure.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2283, doi. 10.1007/s11664-015-3719-3

By:

Klimiec, E.;
Królikowski, B.;
Machnik, M.;
Zaraska, W.;
Dzwonkowski, J.

Publication type:

Article

Size-Controllable Synthesis of FeO Nanospheres for Electromagnetic Wave Absorber.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2292, doi. 10.1007/s11664-015-3725-5

By:

Wang, Yanping;
Sun, Danping;
Liu, Gongzong;
Wang, Yujiao;
Jiang, Wei

Publication type:

Article

Measurement of Dielectric Properties of Ultrafine BaTiO Using an Organic-Inorganic Composite Method.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2300, doi. 10.1007/s11664-015-3729-1

By:

Bao, Jie;
Wang, Weiwang;
Li, Shengtao;
Liu, Johan

Publication type:

Article

Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2414, doi. 10.1007/s11664-015-3741-5

By:

Nguyen, Van;
Kim, Ho-Kyung

Publication type:

Article

Erratum to: Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment.

Published in:

2015

By:

Matin, M.A.;
Oishi, K.;
Katsuta, A.;
Akai, D.;
Sawada, K.;
Ishida, M.

Publication type:

Erratum

Tuning Magnetic Behavior of Nanoscale Cobalt Sulfide and Its Nanocomposite with an Engineering Thermoplastic.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2308, doi. 10.1007/s11664-015-3753-1

By:

Rumale, Narendra;
Arbuj, Sudhir;
Umarji, Govind;
Shinde, Manish;
Mulik, Uttam;
Joy, Pattayil;
Amalnerkar, Dinesh

Publication type:

Article

Low-Temperature Sintering and Microwave Dielectric Properties of ZnSiO Ceramic Added with Crystalline Zinc Borate.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2312, doi. 10.1007/s11664-015-3762-0

By:

Chaware, Varsha;
Deshmukh, Ravindra;
Sarode, Chetan;
Gokhale, Suresh;
Phatak, Girish

Publication type:

Article

Phase Equilibria of the Sn-Ni-Si Ternary System and Interfacial Reactions in Sn-(Cu)/Ni-Si Couples.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2422, doi. 10.1007/s11664-015-3765-x

By:

Fang, Gu;
Chen, Chih-chi

Publication type:

Article

Dielectric Behavior and Magnetic Properties of Mn-Substituted Ni-Zn Ferrites.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2369, doi. 10.1007/s11664-015-3770-0

By:

Irfan, Muhammad;
Niaz, N.;
Ali, Irshad;
Nasir, S.;
Shakoor, Abdul;
Aziz, Abdul;
Karamat, Nazia;
Khalid, N.

Publication type:

Article

Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2432, doi. 10.1007/s11664-015-3772-y

By:

Xiong, Sang;
Sun, Jianlin;
Xu, Yang;
Yan, Xundong

Publication type:

Article

Creep Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2440, doi. 10.1007/s11664-015-3773-x

By:

Tang, Y.;
Li, G.;
Luo, S.;
Wang, K.;
Zhou, B.

Publication type:

Article

Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2450, doi. 10.1007/s11664-015-3774-9

By:

Liu, Yang;
Sun, Fenglian;
Luo, Liangliang;
Yuan, Cadmus;
Zhang, Guoqi

Publication type:

Article

Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2458, doi. 10.1007/s11664-015-3781-x

By:

Ko, Yong-Ho;
Kim, Min-Su;
Bang, Junghwan;
Kim, Taek-Soo;
Lee, Chang-Woo

Publication type:

Article

CH/Ar/H/SF Plasma Etching for Surface Oxide Removal of Indium Bumps.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2467, doi. 10.1007/s11664-015-3786-5

By:

Huang, Yue;
Lin, Chun;
Ye, Zhen-Hua;
Liao, Qing-Jun;
Ding, Rui-Jun

Publication type:

Article

Enhanced Dielectric Properties and High-Temperature Microwave Absorption Performance of Zn-Doped AlO Ceramic.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2353, doi. 10.1007/s11664-015-3787-4

By:

Wang, Yuan;
Luo, Fa;
Wei, Ping;
Zhou, Wancheng;
Zhu, Dongmei

Publication type:

Article

Dielectric and Electrical Properties of BiFeO-LiTaO Systems.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2359, doi. 10.1007/s11664-015-3789-2

By:

Mohanty, Suchismita;
Choudhary, R.N.P.

Publication type:

Article

Ferroelectric and Magnetodielectric Properties of Cobalt-Doped SrBaNbO Ceramics.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2321, doi. 10.1007/s11664-015-3792-7

By:

Kshirsagar, S.;
Tarale, A.;
Jigajeni, S.;
Salunkhe, D.;
Kulkarni, S.;
Joshi, P.

Publication type:

Article

Investigation of the Absorption Properties of the Alloys Fe-Ni and Fe-Ni-Cr Prepared by Mechanical Alloying.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2331, doi. 10.1007/s11664-015-3793-6

By:

Shuchao, Gu;
Yuping, Duan;
Peng, Duan;
Song, Wang;
Guoping, Qiu;
Yuzhe, Liu

Publication type:

Article

Influence of BaTiO Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2473, doi. 10.1007/s11664-015-3796-3

By:

Yang, Li;
Dai, Jun;
Zhang, Yaocheng;
Jing, Yanfeng;
Ge, Jinguo;
Liu, Haixiang

Publication type:

Article

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2479, doi. 10.1007/s11664-015-3798-1

By:

Chen, Wenjun;
Deng, Dunying;
Cheng, Yuanrong;
Xiao, Fei

Publication type:

Article

Effects of BiO, TiO, and BiTiO Seeding Layers on the Structural and Electrical Properties of BiLaTiO Thin Films Grown by a Sol-Gel Method.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2340, doi. 10.1007/s11664-015-3800-y

By:

Pei, Ling;
Hu, Ni;
Deng, Gang;
Bie, Yeguang;
Chen, Yiwan;
Li, Meiya

Publication type:

Article

Preventing Electrical Shorts in Parallel-Plate Capacitors with Single-Printed Dielectric Layer.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2488, doi. 10.1007/s11664-015-3805-6

By:

Horvat, Maša;
Vidmar, Tjaša;
Maček, Marijan;
Klanjšek Gunde, Marta

Publication type:

Article

Study of Optical and Electrical Properties of InS:Sn Films Deposited by Spray Pyrolysis.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2536, doi. 10.1007/s11664-015-3806-5

By:

Kraini, M.;
Bouguila, N.;
Halidou, I.;
Moadhen, A.;
Vázquez-Vázquez, C.;
López-Quintela, M.A.;
Alaya, S.

Publication type:

Article

Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2497, doi. 10.1007/s11664-015-3807-4

By:

Chen, Pei-Chi;
Su, Yen-Fu;
Yang, Shin-Yueh;
Liang, Steven;
Chiang, Kuo-Ning

Publication type:

Article

The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2507, doi. 10.1007/s11664-015-3812-7

By:

Ismail, Roslina;
Omar, Ghazali;
Jalar, Azman;
Majlis, Burhanuddin

Publication type:

Article

Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2514, doi. 10.1007/s11664-015-3813-6

By:

Mehdi, S.M.;
Cho, K.H.;
Kang, C.N.;
Choi, K.H.

Publication type:

Article

Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2522, doi. 10.1007/s11664-015-3815-4

By:

Chen, Ailian;
Chen, Yang;
Ding, Jianning

Publication type:

Article

Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2529, doi. 10.1007/s11664-015-3839-9

By:

Yang, Chih-Jie;
Huang, Chun-Lung;
Liao, Chien-Neng

Publication type:

Article

Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2544, doi. 10.1007/s11664-015-3631-x

By:

Matin, M.A.;
Oishi, K.;
Katsuta, A.;
Akai, D.;
Sawada, K.;
Ishida, M.

Publication type:

Article