Works matching IS 03615235 AND DT 2015 AND VI 44 AND IP 3
Results: 31
Printability and Electrical Conductivity of UV Curable MWCNT Ink.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 778, doi. 10.1007/s11664-014-3468-8
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- Article
Optimization of UV LED-Curable Ink for Reverse-Offset Roll-to-Plate (RO-R2P) Printing.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 784, doi. 10.1007/s11664-014-3506-6
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Measurement of 3D Printed Structure Using a Peak Detection Method in Dispersive Interferometry.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 792, doi. 10.1007/s11664-014-3524-4
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Characterization of LiF/CuO-Codoped BaTiO for Embedded Capacitors.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 797, doi. 10.1007/s11664-014-3526-2
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Reliable and Fault-Tolerant Software-Defined Network Operations Scheme for Remote 3D Printing.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 804, doi. 10.1007/s11664-014-3548-9
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Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 842, doi. 10.1007/s11664-014-3551-1
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Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 886, doi. 10.1007/s11664-014-3571-x
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Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 895, doi. 10.1007/s11664-014-3572-9
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Interfacial Reactions in Sn/Ni- xW Couples.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 909, doi. 10.1007/s11664-014-3573-8
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Investigation of Optical Nonlinearities in Bi-Doped Se-Te Chalcogenide Thin Films.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 916, doi. 10.1007/s11664-014-3577-4
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Growth of Wide-Bandgap Nanocrystalline Silicon Carbide Films by HWCVD: Influence of Filament Temperature on Structural and Optoelectronic Properties.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 922, doi. 10.1007/s11664-014-3580-9
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3D Model Data Generation and Conversion for 3D Printers.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 815, doi. 10.1007/s11664-014-3584-5
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Synthesis of 3D Printable Cu-Ag Core-Shell Materials: Kinetics of CuO Film Removal.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 823, doi. 10.1007/s11664-014-3588-1
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Solder-Graphite Network Composite Sheets as High-Performance Thermal Interface Materials.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 929, doi. 10.1007/s11664-014-3589-0
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Synthesis and Characterization of Melt-Spun Metastable AlGe.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 948, doi. 10.1007/s11664-014-3592-5
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Use of Spherical Instrumented Indentation to Evaluate the Tensile Properties of 3D Combined Structures.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 831, doi. 10.1007/s11664-014-3593-4
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Synchronization of Quantum Dot Lasers with an Optoelectronic Feedback Circuit.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 953, doi. 10.1007/s11664-014-3594-3
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- Article
Improved Performance of Dye-Sensitized Solar Cells Fabricated from a Coumarin NKX-2700 Dye-Sensitized TiO/MgO Core-Shell Photoanode with an HfO Blocking Layer and a Quasi-Solid-State Electrolyte.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 967, doi. 10.1007/s11664-014-3595-2
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Characteristic of Nano-Cu Film Prepared by Energy Filtrating Magnetron Sputtering Technique and Its Optical Property.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 977, doi. 10.1007/s11664-014-3596-1
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Fabrication of 3D Printed Metal Structures by Use of High-Viscosity Cu Paste and a Screw Extruder.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 836, doi. 10.1007/s11664-014-3601-8
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Surface Sensing and Optical Behavior of Al-Based Silver Chalcopyrites.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 984, doi. 10.1007/s11664-014-3603-6
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Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 991, doi. 10.1007/s11664-014-3604-5
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Electrical Characteristics of GaN-Based Light-Emitting Diodes on Patterned Sapphire Substrates.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 999, doi. 10.1007/s11664-014-3605-4
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Mechanical, Dielectric, and Microwave-Absorption Properties of Alumina Ceramic Containing Dispersed TiSiC.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 867, doi. 10.1007/s11664-014-3607-2
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Photoinduced p-Type Conductivity in n-Type ZnO.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 1003, doi. 10.1007/s11664-014-3608-1
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Influence of pH Value on the Properties of NHFe(OH)- (PO)·2HO Precursor and LiFePO/C Composite.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 1008, doi. 10.1007/s11664-014-3613-4
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Characteristics and Charge Storage of Silicon Quantum Dots Embedded in Silicon Nitride Film.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 1015, doi. 10.1007/s11664-014-3614-3
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Effect of Substrate Temperature on the Properties of Sprayed WO Thin Films Using Peroxotungstic Acid and Ammonium Tungstate: A Comparative Study.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 874, doi. 10.1007/s11664-014-3618-z
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Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn-Co/Co/Sn- Co/Ni Couples.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 1021, doi. 10.1007/s11664-014-3620-5
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Synthesis and Luminescence Properties of Eu Doped High Temperature Form of BiMoO.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 1028, doi. 10.1007/s11664-014-3621-4
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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 771, doi. 10.1007/s11664-014-3425-6
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