Works matching IS 03615235 AND DT 2015 AND VI 44 AND IP 2
Results: 20
Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 733, doi. 10.1007/s11664-014-3516-4
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Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 744, doi. 10.1007/s11664-014-3528-0
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Conductive ZnO:Zn Composites for High-Rate Sputtering Deposition of ZnO Thin Films.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 682, doi. 10.1007/s11664-014-3529-z
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Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low- k Chip.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 688, doi. 10.1007/s11664-014-3532-4
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Electrically Conductive Silver Paste Obtained by Use of Silver Neodecanoate as Precursor.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 720, doi. 10.1007/s11664-014-3533-3
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High-Temperature Piezoelectrics with Large Piezoelectric Coefficients.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 613, doi. 10.1007/s11664-014-3534-2
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The Effect of Multivalley Bandstructure on Thermoelectric Properties of AlGaAs.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 636, doi. 10.1007/s11664-014-3535-1
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Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 725, doi. 10.1007/s11664-014-3537-z
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Three-Layer Zn/Al/Zn Clad Solder for Die Attachment.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 751, doi. 10.1007/s11664-014-3538-y
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Structural Properties of Ultrasonically Sprayed Al-Doped ZnO (AZO) Thin Films: Effect of ZnO Buffer Layer on AZO.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 699, doi. 10.1007/s11664-014-3541-3
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Thermoelectric Properties of Cobalt Antimony Thin Films Deposited on Flexible Substrates by Radio Frequency Magnetron Sputtering.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 630, doi. 10.1007/s11664-014-3546-y
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Forming Free Bipolar ReRAM of Ag/a-IGZO/Pt with Improved Resistive Switching Uniformity Through Controlling Oxygen Partial Pressure.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 645, doi. 10.1007/s11664-014-3547-x
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Structural, Magnetic, and Microwave-Absorption Properties of Nanocrystalline Ca(MnSn)FeO Ferrites.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 715, doi. 10.1007/s11664-014-3552-0
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Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 761, doi. 10.1007/s11664-014-3553-z
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Effect of an AlO/TiO Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 651, doi. 10.1007/s11664-014-3554-y
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Enhancement of the Luminescence of ZnO Nanorod Arrays by SILAR Coating with a CdS Nanocrystalline Shell Layer.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 706, doi. 10.1007/s11664-014-3555-x
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Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 623, doi. 10.1007/s11664-014-3558-7
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Thermal Conductivity of Magnetically Aligned Graphene-Polymer Composites with FeO-Decorated Graphene Nanosheets.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 658, doi. 10.1007/s11664-014-3561-z
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Rectifying Performance and Negative Differential Resistance Behavior of Doping Atoms Effect in Polyphenyls.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 667, doi. 10.1007/s11664-014-3563-x
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Low-Temperature Growth of Inverted Hexagonal ZnS/CdS Quantum Dots: Functional and Luminescence Properties.
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- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 675, doi. 10.1007/s11664-014-3567-6
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