Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 7

Results: 40

Structural, Magnetic, and Reflection Loss Characteristics of Ni/Co/Sn-Substituted Strontium Ferrite/Functionalized MWCNT Nanocomposites.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2573, doi. 10.1007/s11664-014-3120-7

By:

Mousavinia, Mohammad;
Ghasemi, Ali;
Paimozd, Ebrahim

Publication type:

Article

Different Directions of Switching of Chromium Oxide Thin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2747, doi. 10.1007/s11664-014-3193-3

By:

Pham, Ngoc;
Nguyen, Do;
Dao, Bang;
Ta, Kieu;
Tran, Vinh;
Nguyen, Van;
Kim, Sang;
Maenosono, Shinya;
Phan, Thang

Publication type:

Article

Preparation and Characterization of Silica-Coated CaCuTiO.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2607, doi. 10.1007/s11664-014-3156-8

By:

Wang, Mao-Hua;
Zhang, Bo;
Zhou, Fu

Publication type:

Article

CIGS Thin Films for Cd-Free Solar Cells by One-Step Sputtering Process.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2658, doi. 10.1007/s11664-014-3108-3

By:

Xiang, Jun;
Huang, Xing;
Lin, Gengqi;
Tang, Jiang;
Ju, Chen;
Miao, Xiangshui

Publication type:

Article

Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2540, doi. 10.1007/s11664-014-3224-0

By:

Ito, Kazuhiro;
Hamasaka, Keiji;
Kohama, Kazuyuki;
Shirai, Yasuharu;
Murakami, Masanori

Publication type:

Article

A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2759, doi. 10.1007/s11664-014-3159-5

By:

Lin, Jin;
Zhang, Haiyan;
Hong, Haoqun;
Liu, Hui;
Zhang, Xiubin

Publication type:

Article

Dielectric and Impedance Spectroscopy of Barium Bismuth Vanadate Ferroelectrics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2621, doi. 10.1007/s11664-014-3231-1

By:

Sutar, B.;
Choudhary, R.;
Das, Piyush

Publication type:

Article

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2467, doi. 10.1007/s11664-014-3113-6

By:

Ji, Hongjun;
Wang, Qiang;
Li, Mingyu;
Wang, Chunqing

Publication type:

Article

Strain Distribution Across HVPE GaN Layer Grown on Large Square-Patterned Template Studied by Micro-Raman Scattering.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2715, doi. 10.1007/s11664-014-3225-z

By:

Sui, Yanping;
Wang, Bin;
Zhao, Zhide;
Xu, Wei;
Li, Xiaoliang;
Yu, Guanghui;
Wang, Xinzhong

Publication type:

Article

Effect of Sn Content on Structure and Properties Near the Morphotropic Phase Boundary in a PbSnO-PbZrO-PbTiO Ternary System.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2614, doi. 10.1007/s11664-014-3199-x

By:

Xing, Zhuo;
Jin, Li;
Feng, Yujun;
Wei, Xiaoyong

Publication type:

Article

Thin Film Deposition of Semiconducting Ni-Co Oxide Spinel with Adequate Electrical and Optical Properties for Energy Application.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2584, doi. 10.1007/s11664-014-3144-z

By:

Tsai, Shu-Yi;
Fung, Kuan-Zong;
Wei, Chao-Nan;
Bor, Hui-Yun

Publication type:

Article

The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2521, doi. 10.1007/s11664-014-3176-4

By:

Darbandi, Payam;
Bieler, Thomas;
Pourboghrat, Farhang;
Lee, Tae-kyu

Publication type:

Article

Composites of Core/Shell-Structured Copper-Phthalocyanine-Decorated TiO Particles Embedded in Poly(Arylene Ether Nitrile) Matrix with Enhanced Dielectric Properties.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2597, doi. 10.1007/s11664-014-3154-x

By:

Pu, Zejun;
Tong, Lifen;
Long, Ya;
Yang, Wei;
Huang, Xu;
Liu, Xiaobo

Publication type:

Article

Hydrothermal Synthesis of SrMoO:Eu, Sm Phosphors and Their Enhanced Luminescent Properties Through Energy Transfer.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2588, doi. 10.1007/s11664-014-3152-z

By:

Li, Linlin;
Leng, Zhihua;
Zi, Wenwen;
Gan, Shucai

Publication type:

Article

Thermoelectric Properties of Magnesium Silicide Deposited by Use of an Atmospheric Plasma Thermal Spray.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2723, doi. 10.1007/s11664-014-3103-8

By:

Fu, Gaosheng;
Zuo, Lei;
Longtin, Jon;
Nie, Chao;
Chen, Yikai;
Tewolde, Mahder;
Sampath, Sanjay

Publication type:

Article

Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental Studies.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2738, doi. 10.1007/s11664-014-3172-8

By:

Lu, Yushan;
Wang, Jun;
Liu, Yueming;
Xing, Xueling

Publication type:

Article

Dielectric Properties of Polypropylene-Based Nanocomposites with Ionic Liquid-Functionalized Multiwalled Carbon Nanotubes.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2754, doi. 10.1007/s11664-014-3195-1

By:

Xu, Pei;
Gui, Haoguan;
Hu, Yadong;
Bahader, Ali;
Ding, Yunsheng

Publication type:

Article

Erratum to: Quantitative Auger Electron Spectroscopy Analysis of HgCdTe.

Published in:

2014

By:

Gaucher, A.;
Martinez, E.;
Baylet, J.;
Cardinaud, C.

Publication type:

Erratum

All-Inkjet-Printed Bottom-Gate Thin-Film Transistors Using UV Curable Dielectric for Well-Defined Source-Drain Electrodes.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2631, doi. 10.1007/s11664-014-3143-0

By:

Castro, H.;
Sowade, E.;
Rocha, J.;
Alpuim, P.;
Lanceros-Méndez, S.;
Baumann, R.

Publication type:

Article

A Method to Identify Steady Creep Strain from Indentation Creep Using a New Reference Area of Indentation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2530, doi. 10.1007/s11664-014-3196-0

By:

Takita, Atsuko;
Sasaki, Katsuhiko;
Ohguchi, Ken-ichi

Publication type:

Article

Effect of Annealing Ambient on the Electrical and Optical Properties of Aluminum-Doped ZnO Films Produced via a Sol-Gel Process.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2644, doi. 10.1007/s11664-014-3114-5

By:

Ho, Yung-Shou;
Chen, Yi-Siou;
Wu, Cheng-Heng

Publication type:

Article

Synthesis of Nanosize Quasispherical MgFeO and Study of Electrochemical Properties as Anode of Lithium Ion Batteries.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2553, doi. 10.1007/s11664-014-3117-2

By:

Liu, Haowen;
Liu, Hefen

Publication type:

Article

Effect of Alcohol-Assisted Annealing on the Quality of Silicon Oxide Thin Film.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2683, doi. 10.1007/s11664-014-3133-2

By:

Ito, Takuya;
Ota, Yasuyuki;
Shiomori, Koichiro;
Nishioka, Kensuke

Publication type:

Article

Study of Undercooling and Recalescence During Solidification of SnPbAg and SnAgCu Solders in Real Electronic Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2479, doi. 10.1007/s11664-014-3121-6

By:

Rudajevová, A.;
Dušek, K.

Publication type:

Article

Effect of Sintering Temperature on the Properties of Fused Silica Ceramics Prepared by Gelcasting.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2566, doi. 10.1007/s11664-014-3112-7

By:

Wan, Wei;
Huang, Chun-e;
Yang, Jian;
Zeng, Jinzhen;
Qiu, Tai

Publication type:

Article

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2498, doi. 10.1007/s11664-014-3131-4

By:

Chidambaram, Vivek;
Bangtao, Chen;
Lip, Gan;
Rhee Min Woo, Daniel

Publication type:

Article

Processing and Thermal Conductivity of Lead Telluride Microwires.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2731, doi. 10.1007/s11664-014-3111-8

By:

Bhatta, Rudra;
Annamalai, Sezhian;
Brandys, Marek;
Pegg, Ian;
Dutta, Biprodas

Publication type:

Article

Synthesis of CuZnSnS Nanoparticles for Applications as Counter Electrodes of CdS Quantum Dot-Sensitized Solar Cells.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2709, doi. 10.1007/s11664-014-3200-8

By:

Gu, Xiuquan;
Zhang, Shuang;
Qiang, Yinghuai;
Zhao, Yulong;
Zhu, Lei

Publication type:

Article

Relationships Between Strain and Recombination in Intermediate Growth Stages of GaN.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2667, doi. 10.1007/s11664-014-3115-4

By:

Arnatkevičiūtė, A.;
Reklaitis, I.;
Kadys, A.;
Malinauskas, T.;
Stanionytė, S.;
Juška, G.;
Rzheutski, M.;
Tomašiūnas, R.

Publication type:

Article

Effect of Thermal Annealing on the Characteristics of Phosphorus-Implanted ZnO Crystals.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2688, doi. 10.1007/s11664-014-3136-z

By:

Jeong, T.;
Yu, J.;
Mo, H.;
Kim, T.;
Lim, K.;
Youn, C.;
Hong, K.;
Kim, H.

Publication type:

Article

Defects and Resistive Switching of Zinc Oxide Nanorods with Copper Addition Grown by Hydrothermal Method.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2676, doi. 10.1007/s11664-014-3116-3

By:

Lai, Yunfeng;
Wang, Yuzhu;
Cheng, Shuying;
Yu, Jinling

Publication type:

Article

Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint Formation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2510, doi. 10.1007/s11664-014-3151-0

By:

Park, M.;
Gibbons, S.;
Arróyave, R.

Publication type:

Article

Selective Growth of CdTe on Nano-patterned CdS via Close-Space Sublimation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2651, doi. 10.1007/s11664-014-3104-7

By:

Aguirre, Brandon;
Zubia, David;
Ordonez, Rafael;
Anwar, Farhana;
Prieto, Heber;
Sanchez, Carlos;
Salazar, Maria;
Pimentel, Alejandro.;
Michael, Joseph;
Zhou, Xiaowang;
Mcclure, John;
Nielson, Gregory;
Cruz-Campa, Jose

Publication type:

Article

Development of 3.7 % Efficient CuZnSnSe Solar Cells by Selenizing Cu-Zn-Sn Films Deposited by DC Sputtering on TiN-Protected Mo/Glass Substrates.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2694, doi. 10.1007/s11664-014-3137-y

By:

Kuo, Dong-Hau;
Hsu, Jin-Tung

Publication type:

Article

Energy Harvesting from Ambient Vibrations with Arbitrary In-Plane Motion Directions Using a Magnetostrictive/Piezoelectric Laminate Composite Transducer.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2559, doi. 10.1007/s11664-014-3056-y

By:

Yang, Jin;
Wen, Yumei;
Li, Ping;
Yue, Xihai;
Yu, Qiangmo

Publication type:

Article

Liquidus Projections of Sn-Co-Ni and Sn-Rich Sn-Ag-Co-Ni Systems.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2487, doi. 10.1007/s11664-014-3130-5

By:

Chen, Sinn-wen;
Chen, Tung-Kai;
Hsu, Chia-ming;
Chang, Jui-shen;
Pan, Kevin

Publication type:

Article

Influence of Cd-rich Annealing on Defects in Te-rich CdZnTe Materials.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2702, doi. 10.1007/s11664-014-3140-3

By:

Sheng, Fengfeng;
Yang, Jianrong;
Sun, Shiwen;
Zhou, Changhe;
Yu, Huixian

Publication type:

Article

Microwave Synthesis and Characterization of the Series CoFeSb High Temperature Thermoelectric Materials.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2637, doi. 10.1007/s11664-014-3197-z

By:

Ioannidou, A.;
Rull, M.;
Martin-Gonzalez, M.;
Moure, A.;
Jacquot, A.;
Niarchos, D.

Publication type:

Article

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2459, doi. 10.1007/s11664-014-3202-6

By:

Khazaka, R.;
Mendizabal, L.;
Henry, D.

Publication type:

Article

Monodisperse and 1D Cross-Linked Multi-branched Cu @ Ni Core-Shell Particles Synthesized by Chemical Reduction.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2548, doi. 10.1007/s11664-014-3201-7

By:

Hu, Hailong;
Zhang, Dian;
Yu, Weiming;
Sugawara, Katsuyasu;
Guo, Tailiang

Publication type:

Article