Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 6
1
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1689, doi. 10.1007/s11664-013-2834-2
- Jantrasee, Sakwiboon;
- Pinitsoontorn, Supree;
- Moontragoon, Pairot
- Article
2
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2072, doi. 10.1007/s11664-013-2959-3
- Kanno, Tsutomu;
- Takahashi, Kouhei;
- Sakai, Akihiro;
- Tamaki, Hiromasa;
- Kusada, Hideo;
- Yamada, Yuka
- Article
3
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1875, doi. 10.1007/s11664-013-2895-2
- Ponnambalam, V.;
- Morelli, Donald
- Article
4
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2011, doi. 10.1007/s11664-013-2937-9
- Kinemuchi, Yoshiaki;
- Mimura, Ken-ichi;
- Towata, Atsuya;
- Kato, Kazumi
- Article
5
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1639, doi. 10.1007/s11664-013-2820-8
- Xia, Xugui;
- Qiu, Pengfei;
- Huang, Xiangyang;
- Wan, Shun;
- Qiu, Yuting;
- Li, Xiaoya;
- Chen, Lidong
- Article
6
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2384, doi. 10.1007/s11664-014-3076-7
- Article
7
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1983, doi. 10.1007/s11664-013-2931-2
- Article
8
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2134, doi. 10.1007/s11664-014-2990-z
- Klein Altstedde, Mirko;
- Rinderknecht, Frank;
- Friedrich, Horst
- Article
9
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2174, doi. 10.1007/s11664-014-3000-1
- Nakamura, Shigeyuki;
- Mori, Yoshihisa;
- Takarabe, Ken'ichi
- Article
10
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1837, doi. 10.1007/s11664-013-2885-4
- Yang, Xu-qiu;
- Zhai, Peng-cheng;
- Cai, Chang;
- Liu, Li-sheng;
- Zhang, Qing-jie
- Article
11
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1662, doi. 10.1007/s11664-013-2824-4
- Ding, Shijie;
- Duan, Bo;
- Xu, Chenglong;
- Li, Yao;
- Liu, Lisheng;
- Zhai, Pengcheng
- Article
12
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1857, doi. 10.1007/s11664-013-2888-1
- Wagner-Reetz, M.;
- Cardoso-Gil, R.;
- Grin, Yu.
- Article
13
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1782, doi. 10.1007/s11664-013-2864-9
- Kaur, Harjeet;
- Sharma, Lalit;
- Singh, Simrjit;
- Sivaiah, Bathula;
- Reddy, G.;
- Senguttuvan, T.
- Article
14
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2165, doi. 10.1007/s11664-014-2995-7
- Yang, Heng;
- Miao, Lei;
- Zhang, Ming;
- Ohno, Kaoru;
- Zhou, Jian;
- Gu, Hui;
- Shen, Yang;
- Lin, Hong
- Article
15
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2348, doi. 10.1007/s11664-014-3063-z
- Baranowski, Lauryn;
- Warren, Emily;
- Toberer, Eric
- Article
16
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2239, doi. 10.1007/s11664-014-3019-3
- Keshavarz, Mohsen;
- Vasilevskiy, Dimitri;
- Masut, Remo;
- Turenne, Sylvain
- Article
17
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1620, doi. 10.1007/s11664-013-2814-6
- Sakamoto, Tatsuya;
- Iida, Tsutomu;
- Ohno, Yota;
- Ishikawa, Masashi;
- Kogo, Yasuo;
- Hirayama, Naomi;
- Arai, Koya;
- Nakamura, Takashi;
- Nishio, Keishi;
- Takanashi, Yoshifumi
- Article
18
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2337, doi. 10.1007/s11664-014-3059-8
- Huang, Gia-Yeh;
- Hsu, Cheng-Ting;
- Yao, Da-Jeng
- Article
19
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2218, doi. 10.1007/s11664-014-3015-7
- Liu, X.;
- Yu, C.;
- Chen, S.;
- Wang, Y.;
- Su, C.
- Article
20
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2405, doi. 10.1007/s11664-014-3094-5
- Kuroki, Takashi;
- Kabeya, Kazuhisa;
- Makino, Kazuya;
- Kajihara, Takeshi;
- Kaibe, Hiromasa;
- Hachiuma, Hirokuni;
- Matsuno, Hidetoshi;
- Fujibayashi, Akio
- Article
21
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1608, doi. 10.1007/s11664-013-2806-6
- Gupta, Rahul;
- McCarty, Robin;
- Sharp, Jeff
- Article
22
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1630, doi. 10.1007/s11664-013-2819-1
- Bali, Ashoka;
- Kim, Il-Ho;
- Rogl, Peter;
- Mallik, Ramesh
- Article
23
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1554, doi. 10.1007/s11664-013-2791-9
- Lertsatitthanakorn, C.;
- Tipsaenprom, W.;
- Rungsiyopas, M.
- Article
24
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1815, doi. 10.1007/s11664-013-2881-8
- Deng, Y.;
- Liu, X.;
- Chen, S.;
- Xing, H.;
- Su, C.
- Article
25
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2452, doi. 10.1007/s11664-014-3157-7
- Article
26
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2362, doi. 10.1007/s11664-014-3065-x
- Uhlig, Christian;
- Guenes, Ekrem;
- Schulze, Anne;
- Elm, Matthias;
- Klar, Peter;
- Schlecht, Sabine
- Article
27
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1972, doi. 10.1007/s11664-013-2929-9
- Bartsch, Th.;
- Sonnenberg, D.;
- Strelow, Ch.;
- Heyn, Ch.;
- Hansen, W.
- Article
28
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1703, doi. 10.1007/s11664-013-2848-9
- Gelbstein, Yaniv;
- Tunbridge, Jonathan;
- Dixon, Richard;
- Reece, Mike;
- Ning, Huanpo;
- Gilchrist, Robert;
- Summers, Richard;
- Agote, Iñigo;
- Lagos, Miguel;
- Simpson, Kevin;
- Rouaud, Cedric;
- Feulner, Peter;
- Rivera, Sergio;
- Torrecillas, Ramon;
- Husband, Mark;
- Crossley, Julian;
- Robinson, Ivan
- Article
29
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1842, doi. 10.1007/s11664-013-2886-3
- Yang, Xu-qiu;
- Zhai, Peng-cheng;
- Liu, Li-sheng;
- Chen, Gang;
- Zhang, Qing-jie
- Article
30
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1865, doi. 10.1007/s11664-013-2892-5
- Hong, Qin-Gang;
- Chang, Li-Shin;
- Hsieh, Huey-Lin
- Article
31
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1922, doi. 10.1007/s11664-013-2910-7
- Mikami, M.;
- Mizoshiri, M.;
- Ozaki, K.;
- Takazawa, H.;
- Yamamoto, A.;
- Terazawa, Y.;
- Takeuchi, T.
- Article
32
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1959, doi. 10.1007/s11664-013-2926-z
- Kambe, Mitsuru;
- Jinushi, Takahiro;
- Ishijima, Zenzo
- Article
33
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2301, doi. 10.1007/s11664-014-3048-y
- Fiameni, S.;
- Famengo, A.;
- Agresti, F.;
- Boldrini, S.;
- Battiston, S.;
- Saleemi, M.;
- Johnsson, M.;
- Toprak, M.;
- Fabrizio, M.
- Article
34
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2040, doi. 10.1007/s11664-013-2945-9
- Lertsatitthanakorn, C.;
- Soponronnarit, S.;
- Jamradloedluk, J.;
- Rungsiyopas, M.;
- Sarachitti, R.
- Article
35
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2000, doi. 10.1007/s11664-013-2934-z
- Kim, Kwang-Chon;
- Baek, Seung-Hyub;
- Kim, Hyun;
- Hyun, Dow-Bin;
- Kim, Seong;
- Kim, Jin-Sang
- Article
36
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1847, doi. 10.1007/s11664-013-2887-2
- Anno, Hiroaki;
- Shirataki, Ritsuko
- Article
37
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1916, doi. 10.1007/s11664-013-2909-0
- Chen, Yuexing;
- Du, Baoli;
- Kajisa, Kousuke;
- Takabatake, Toshiro
- Article
38
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2371, doi. 10.1007/s11664-014-3072-y
- Tsujii, Naohito;
- Mori, Takao;
- Isoda, Yukihiro
- Article
39
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1539, doi. 10.1007/s11664-013-2777-7
- Article
40
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1809, doi. 10.1007/s11664-013-2880-9
- Elefsiniotis, A.;
- Becker, Th.;
- Schmid, U.
- Article
41
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1870, doi. 10.1007/s11664-013-2894-3
- Putri, Yulia;
- Wan, Chunlei;
- Dang, Feng;
- Mori, Takao;
- Ozawa, Yuto;
- Norimatsu, Wataru;
- Kusunoki, Michiko;
- Koumoto, Kunihito
- Article
42
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1790, doi. 10.1007/s11664-013-2865-8
- Gao, Peng;
- Berkun, Isil;
- Schmidt, Robert;
- Luzenski, Matthew;
- Lu, Xu;
- Bordon Sarac, Patricia;
- Case, Eldon;
- Hogan, Timothy
- Article
43
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2420, doi. 10.1007/s11664-014-3101-x
- Novikov, S.;
- Burkov, A.;
- Schumann, J.
- Article
44
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2151, doi. 10.1007/s11664-014-2993-9
- Nishino, Shunsuke;
- Koyano, Mikio;
- Suekuni, Koichiro;
- Ohdaira, Keisuke
- Article
45
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2262, doi. 10.1007/s11664-014-3038-0
- Nagami, Yuki;
- Matsuoka, Kenji;
- Akao, Takahiro;
- Onda, Tetsuhiko;
- Hayashi, Takahiro;
- Chen, Zhong-Chun
- Article
46
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1674, doi. 10.1007/s11664-013-2832-4
- Falkenbach, Oliver;
- Hartung, David;
- Klar, Peter;
- Koch, Guenter;
- Schlecht, Sabine
- Article
47
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1733, doi. 10.1007/s11664-013-2852-0
- Kato, Kunihisa;
- Hatasako, Yoshika;
- Kashiwagi, Makoto;
- Hagino, Harutoshi;
- Adachi, Chihaya;
- Miyazaki, Koji
- Article
48
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1896, doi. 10.1007/s11664-013-2898-z
- Neophytou, Neophytos;
- Zianni, Xanthippi;
- Kosina, Hans;
- Frabboni, Stefano;
- Lorenzi, Bruno;
- Narducci, Dario
- Article
49
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 2444, doi. 10.1007/s11664-014-3150-1
- Dilhac, Jean-Marie;
- Monthéard, Romain;
- Bafleur, Marise;
- Boitier, Vincent;
- Durand-Estèbe, Paul;
- Tounsi, Patrick
- Article
50
- Journal of Electronic Materials, 2014, v. 43, n. 6, p. 1712, doi. 10.1007/s11664-013-2849-8
- Tan, G.;
- Wang, S.;
- Tang, X.
- Article