Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 5
Results: 21
Cruciform Pattern of NiZn Formed in Interfacial Reactions Between Ni and Sn-Zn Solders.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1362, doi. 10.1007/s11664-014-3098-1
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Quasi-ideal Nonlinear Electrical Behavior of Polycrystalline SnO Ceramic Varistors Doped with SiO.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1411, doi. 10.1007/s11664-014-3035-3
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Molds and Resists Studies for Nanoimprint Lithography of Electrodes in Low-Voltage Polymer Thin-Film Transistors.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1317, doi. 10.1007/s11664-014-3071-z
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Properties of ZnO Thin Films Codoped with Lithium and Phosphorus.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1370, doi. 10.1007/s11664-014-3074-9
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Improved Calculation of the Electronic and Optical Properties of Tetragonal Barium Titanate.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1443, doi. 10.1007/s11664-014-3096-3
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Influences of Te-Rich and Cd-Rich Precipitates of CdZnTe Substrates on the Surface Defects of HgCdTe Liquid-Phase Epitaxy Materials.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1397, doi. 10.1007/s11664-014-3110-9
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- Article
Self-Rectifying Effect in Resistive Switching Memory Using Amorphous InGaZnO.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1384, doi. 10.1007/s11664-014-3083-8
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Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu- xAg Solder Alloys.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1347, doi. 10.1007/s11664-014-3087-4
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Effect of MnO Addition on the Electrical Properties of PNZST Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1460, doi. 10.1007/s11664-014-3106-5
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Thickness Dependence Study of Electron Beam Evaporated LBMO Manganite Thin Films for Bolometer Applications.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1436, doi. 10.1007/s11664-014-3092-7
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Diffuse Phase Transition and Electrical Conductivity of Pb(CaNb)O.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1403, doi. 10.1007/s11664-014-2979-7
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- Article
Shear Strength of Eutectic Sn-Bi Lead-Free Solders After Corrosion Testing and Thermal Aging.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1335, doi. 10.1007/s11664-014-3085-6
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Properties and Applications of Varistor-Transistor Hybrid Devices.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1307, doi. 10.1007/s11664-014-3067-8
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Enhanced Thermoelectric Properties of Hole-Doped BiBaSrCoO Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1432, doi. 10.1007/s11664-014-3086-5
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Synthesis and Field Emission Properties of Helical GaN Nanowires.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1379, doi. 10.1007/s11664-014-3079-4
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The Effects of Ta Substitution and K/Na Ratio Variation on the Microstructure and Properties of (K,Na)NbO-Based Lead Free Piezoelectric Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1424, doi. 10.1007/s11664-014-3082-9
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Photovoltaic Characterization and Electrochemical Impedance Spectroscopy Analysis of Dye-Sensitized Solar Cells Based on Composite TiO-MWCNT Photoelectrodes.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1450, doi. 10.1007/s11664-014-3102-9
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Synthesis and Microwave Dielectric Properties of SrLaPrTiO (0 ≤ x ≤ 4) Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1419, doi. 10.1007/s11664-014-3069-6
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Fabrication of High-Temperature-Stable Thermoelectric Generator Modules Based on Nanocrystalline Silicon.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1389, doi. 10.1007/s11664-014-3093-6
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Factors Affecting the Morphology of Pb-Based Glass Frit Coated with Ag Material Prepared by Electroless Silver Plating.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1326, doi. 10.1007/s11664-014-3012-x
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Effect of Zr Content on the Grain Growth, Dielectric Relaxation Behavior, and Ferroelectric Properties of BaSrTiZrO Nano-Ceramics Prepared by Different Methods Assisted by Fast Microwave Sintering.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1466, doi. 10.1007/s11664-014-3107-4
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