Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 5
1
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1362, doi. 10.1007/s11664-014-3098-1
- Wang, Chao-hong;
- Chen, Hsien-hsin;
- Chiu, Chun-wei
- Article
2
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1411, doi. 10.1007/s11664-014-3035-3
- Metz, R.;
- Hassanzadeh, M.;
- Mahesh, K.;
- Ananthakumar, S.
- Article
3
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1317, doi. 10.1007/s11664-014-3071-z
- Cavallari, Marco;
- Zanchin, Vinicius;
- Pojar, Mariana;
- Seabra, Antonio;
- Assumpção Pereira-da-Silva, Marcelo;
- Fonseca, Fernando;
- Andrade, Adnei
- Article
4
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1370, doi. 10.1007/s11664-014-3074-9
- Oder, Tom;
- Smith, Andrew;
- Freeman, Mark;
- Mcmaster, Michael;
- Cai, Bo;
- Nakarmi, Mim
- Article
5
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1443, doi. 10.1007/s11664-014-3096-3
- Siraji, Ashfaqul;
- Alam, M.
- Article
6
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1397, doi. 10.1007/s11664-014-3110-9
- Sheng, Fengfeng;
- Zhou, Changhe;
- Sun, Shiwen;
- Yang, Jianrong
- Article
7
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1384, doi. 10.1007/s11664-014-3083-8
- Lee, Jin-Woo;
- Kwon, Hyeon-Min;
- Kim, Myeong-Ho;
- Lee, Seung-Ryul;
- Kim, Young-Bae;
- Choi, Duck-Kyun
- Article
8
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1347, doi. 10.1007/s11664-014-3087-4
- Spinelli, José;
- Silva, Bismarck;
- Garcia, Amauri
- Article
9
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1460, doi. 10.1007/s11664-014-3106-5
- Yan, Yangxi;
- He, Hongliang;
- Feng, Yujun
- Article
10
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1436, doi. 10.1007/s11664-014-3092-7
- Reddy, Ch.;
- Reddy, A.;
- Reddy, P.
- Article
11
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1403, doi. 10.1007/s11664-014-2979-7
- Bajpai, P.;
- Pastor, Mukul;
- Singh, K.
- Article
12
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1335, doi. 10.1007/s11664-014-3085-6
- Mostofizadeh, Milad;
- Pippola, Juha;
- Frisk, Laura
- Article
13
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1307, doi. 10.1007/s11664-014-3067-8
- Pandey, R.;
- Stapleton, William;
- Sutanto, Ivan;
- Scantlin, Amanda;
- Lin, Sidney
- Article
14
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1432, doi. 10.1007/s11664-014-3086-5
- He, Q.L.;
- Qin, Z.;
- Zhang, J.;
- Gao, F.;
- Hu, X.;
- Song, H.Z.
- Article
15
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1379, doi. 10.1007/s11664-014-3079-4
- Li, Enling;
- Song, Sha;
- Ma, Deming;
- Fu, Nannan;
- Zhang, Yulong
- Article
16
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1424, doi. 10.1007/s11664-014-3082-9
- Shang, Xunzhong;
- Guo, Jinming;
- Xiao, Wanping;
- Lu, Yinmei;
- Chang, Gang;
- Zhou, Taosheng;
- He, Yunbin
- Article
17
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1450, doi. 10.1007/s11664-014-3102-9
- Parvazian, E.;
- Karimzadeh, F.;
- Enayati, M.
- Article
18
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1419, doi. 10.1007/s11664-014-3069-6
- Manan, Abdul;
- Qazi, Ibrahim;
- Khan, Umer
- Article
19
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1389, doi. 10.1007/s11664-014-3093-6
- Kessler, V.;
- Dehnen, M.;
- Chavez, R.;
- Engenhorst, M.;
- Stoetzel, J.;
- Petermann, N.;
- Hesse, K.;
- Huelser, T.;
- Spree, M.;
- Stiewe, C.;
- Ziolkowski, P.;
- Schierning, G.;
- Schmechel, R.
- Article
20
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1326, doi. 10.1007/s11664-014-3012-x
- Huang, Bei;
- Gan, Weiping;
- Zhou, Jian;
- Li, Yingfen;
- Lin, Tao;
- Liu, Xiaogang
- Article
21
- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1466, doi. 10.1007/s11664-014-3107-4
- Zixiong, Sun;
- Yongping, Pu;
- Yuwen, Liu
- Article