Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 4
1
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1249, doi. 10.1007/s11664-014-3027-3
- SayyedFattahi, S.;
- Rostami, A.;
- Pouladian, M.;
- Dolatyari, M.;
- Rashidi, M.;
- Rostami, G.
- Article
2
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 863, doi. 10.1007/s11664-014-3066-9
- Todd, Devin;
- Clark, Jerry;
- Farlow, G.C.
- Article
3
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 809, doi. 10.1007/s11664-013-2836-0
- Brunt, Edward;
- Agarwal, Anant;
- Burk, Al;
- Cheng, Lin;
- O'Loughlin, Michael;
- Palmour, John;
- Suvorov, Alexander
- Article
4
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 938, doi. 10.1007/s11664-014-3089-2
- Mosleh, Aboozar;
- Ghetmiri, Seyed;
- Conley, Benjamin;
- Hawkridge, Michael;
- Benamara, Mourad;
- Nazzal, Amjad;
- Tolle, John;
- Yu, Shui-Qing;
- Naseem, Hameed
- Article
5
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 921, doi. 10.1007/s11664-014-3028-2
- Nakasu, Taizo;
- Kobayashi, Masakazu;
- Togo, Hiroyoshi;
- Asahi, Toshiaki
- Article
6
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 850, doi. 10.1007/s11664-014-3021-9
- Tompkins, R.;
- Smith, J.;
- Kirchner, K.;
- Jones, K.;
- Leach, J.;
- Udwary, K.;
- Preble, E.;
- Suvarna, P.;
- Leathersich, J.M.;
- Shahedipour-Sandvik, F.
- Article
7
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1181, doi. 10.1007/s11664-013-2958-4
- Article
8
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1232, doi. 10.1007/s11664-014-2999-3
- Article
9
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1076, doi. 10.1007/s11664-014-2984-x
- Jamalian, Majid;
- Ghasemi, Ali;
- Paimozd, Ebrahim
- Article
10
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 873, doi. 10.1007/s11664-013-2839-x
- Zutter, Brian;
- Schulte, Kevin;
- Kim, Tae;
- Mawst, Luke;
- Kuech, T.;
- Foran, Brendan;
- Sin, Yongkun
- Article
11
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1017, doi. 10.1007/s11664-014-3011-y
- Gan, C.;
- Classe, F.;
- Chan, B.;
- Hashim, U.
- Article
12
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 884, doi. 10.1007/s11664-013-2962-8
- Feldberg, N.;
- Aldous, J.;
- Stampe, P.;
- Kennedy, R.;
- Veal, T.;
- Durbin, S.
- Article
13
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 857, doi. 10.1007/s11664-014-3022-8
- Modic, A.;
- Sharma, Y.K.;
- Xu, Y.;
- Liu, G.;
- Ahyi, A.C.;
- Williams, J.R.;
- Feldman, L.C.;
- Dhar, S.
- Article
14
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1302, doi. 10.1007/s11664-014-3062-0
- Yuan, Wen-Xiang;
- WU, Q.;
- Luo, Z.;
- Wu, H.
- Article
15
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1207, doi. 10.1007/s11664-014-2978-8
- Hussin, H.;
- Soin, N.;
- Bukhori, M.F.;
- Abdul Wahab, Y.;
- Shahabuddin, S.
- Article
16
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1161, doi. 10.1007/s11664-014-3010-z
- Joshi, Girish;
- Deshmukh, Kalim
- Article
17
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1295, doi. 10.1007/s11664-014-3055-z
- Chen, Z.;
- Han, Y.;
- Zhou, M.;
- Song, C.;
- Huang, R.;
- Zhou, Y.;
- Li, L.
- Article
18
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 894, doi. 10.1007/s11664-013-2966-4
- Zhao, Xin;
- Montgomery, Kyle;
- Woodall, Jerry
- Article
19
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 843, doi. 10.1007/s11664-013-2973-5
- Nath, A.;
- Rao, Mulpuri;
- Tian, Y.;
- Parisini, A.;
- Nipoti, R.
- Article
20
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1174, doi. 10.1007/s11664-014-3061-1
- Singh, Sonika;
- Khatkar, Satyender;
- Arora, Rajni;
- Sangwan, Dayawati;
- Khatkar, Avni;
- Taxak, Vinod
- Article
21
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 947, doi. 10.1007/s11664-013-2967-3
- Article
22
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1255, doi. 10.1007/s11664-014-3036-2
- Gaucher, A.;
- Martinez, E.;
- Baylet, J.;
- Cardinaud, C.
- Article
23
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1026, doi. 10.1007/s11664-014-3017-5
- Maleki, Milad;
- Cugnoni, Joë;
- Botsis, John
- Article
24
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1107, doi. 10.1007/s11664-014-3026-4
- Li, Yingxiang;
- Li, Hao;
- Li, Junshan;
- Tang, Bin;
- Zhang, Shuren;
- Chen, Hetuo;
- Wei, Ya
- Article
25
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1226, doi. 10.1007/s11664-014-2998-4
- Azizian-Kalandaragh, Yashar;
- Aydemir, Umut;
- Altindal, Şemsettin
- Article
26
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1055, doi. 10.1007/s11664-013-2975-3
- Wu, Shuangshuang;
- Zhu, Wenfeng;
- Liu, Laijun;
- Shi, Danping;
- Zheng, Shaoying;
- Huang, Yanming;
- Fang, Liang
- Article
27
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1062, doi. 10.1007/s11664-014-2976-x
- Babu, Ganguli;
- Kalaiselvi, N.;
- Bhuvaneswari, D.
- Article
28
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 838, doi. 10.1007/s11664-013-2968-2
- Zhou, Tianyi;
- Raghothamachar, Balaji;
- Wu, Fangzhen;
- Dalmau, Rafael;
- Moody, Baxter;
- Craft, Spalding;
- Schlesser, Raoul;
- Dudley, Michael;
- Sitar, Zlatko
- Article
29
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1150, doi. 10.1007/s11664-014-3032-6
- Li, L.-G.;
- Lotfi, S.;
- Vallin, Ö.;
- Olsson, J.
- Article
30
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1131, doi. 10.1007/s11664-014-3041-5
- Chen, Wei-Min;
- Zhang, Li-Jun;
- Du, Yong;
- Huang, Bai-Yun
- Article
31
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1263, doi. 10.1007/s11664-014-3050-4
- Mukhopadhyay, Partha;
- Bag, Ankush;
- Gomes, Umesh;
- Banerjee, Utsav;
- Ghosh, Saptarsi;
- Kabi, Sanjib;
- Chang, Edward;
- Dabiran, Amir;
- Chow, Peter;
- Biswas, Dhrubes
- Article
32
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1091, doi. 10.1007/s11664-014-3013-9
- Shih, Hung-Rung;
- Teoh, Lay-Gaik;
- Lin, Huang-Zuo;
- Chen, Yi-Jin;
- Chang, Yee-Shin
- Article
33
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 983, doi. 10.1007/s11664-013-2971-7
- Li, J.;
- Agyakwa, P.;
- Johnson, C.
- Article
34
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1043, doi. 10.1007/s11664-013-2904-5
- Zhang, Rong-Fen;
- Deng, Chao-Yong;
- Ren, Li;
- Li, Zheng;
- Zhou, Jian-Ping
- Article
35
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 833, doi. 10.1007/s11664-013-2955-7
- Brendel, M.;
- Knigge, A.;
- Brunner, F.;
- Einfeldt, S.;
- Knauer, A.;
- Kueller, V.;
- Zeimer, U.;
- Weyers, M.
- Article
36
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 902, doi. 10.1007/s11664-014-3029-1
- DeMeo, Dante;
- Shemelya, Corey;
- Downs, Chandler;
- Licht, Abigail;
- Magden, Emir;
- Rotter, Tom;
- Dhital, Chetan;
- Wilson, Stephen;
- Balakrishnan, Ganesh;
- Vandervelde, Thomas
- Article
37
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1083, doi. 10.1007/s11664-014-3009-5
- Thanh, Tran;
- Van, Hoang;
- Phan, The-Long;
- Yu, Seong-Cho
- Article
38
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1112, doi. 10.1007/s11664-014-3030-8
- Chen, Jie;
- Chen, Xiuli;
- He, Fen;
- Wang, Yiliang;
- Zhou, Huanfu;
- Fang, Liang
- Article
39
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1154, doi. 10.1007/s11664-014-2985-9
- Jamalian, Majid;
- Ghasemi, Ali;
- Paimozd, Ebrahim
- Article
40
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1071, doi. 10.1007/s11664-014-2981-0
- Zhang, Chao;
- Wang, Xiaofei;
- Yan, Haitao;
- Kang, Dawei;
- Li, Liben;
- Lu, Xiaomei;
- Han, Daofu;
- Yan, Feng;
- Zhu, Jinsong
- Article
41
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1280, doi. 10.1007/s11664-014-3031-7
- Dmitriev, A.;
- Tkacheva, E.
- Article
42
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1188, doi. 10.1007/s11664-014-3047-z
- Tadjer, Marko;
- Mastro, Michael;
- Rojo, José;
- Mojena, Alberto;
- Calle, Fernando;
- Kub, Francis;
- Eddy, Charles
- Article
43
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1237, doi. 10.1007/s11664-014-3004-x
- Huang, Shenming;
- Liu, Yajun;
- Chen, Yang;
- Kang, Zhitao
- Article
44
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 814, doi. 10.1007/s11664-013-2871-x
- Richter, E.;
- Fleischmann, S.;
- Goran, D.;
- Hagedorn, S.;
- John, W.;
- Mogilatenko, A.;
- Prasai, D.;
- Zeimer, U.;
- Weyers, M.;
- Tränkle, G.
- Article
45
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 828, doi. 10.1007/s11664-013-2942-z
- Zhang, Zeng;
- Jackson, Christine;
- Arehart, Aaron;
- McSkimming, Brian;
- Speck, James;
- Ringel, Steven
- Article
46
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 978, doi. 10.1007/s11664-014-3068-7
- Singh, S.S.;
- Sarkar, R.;
- Xie, H.-X.;
- Mayer, C.;
- Rajagopalan, J.;
- Chawla, N.
- Article
47
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1289, doi. 10.1007/s11664-014-2997-5
- Li, J.;
- Liu, X.;
- Li, Y.;
- Deng, J.;
- Ye, R.;
- Song, S.;
- Liu, F.;
- Ao, W.
- Article
48
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1166, doi. 10.1007/s11664-014-3039-z
- Article
49
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 879, doi. 10.1007/s11664-013-2950-z
- Chen, Chihyu;
- Zheng, Jiazhen;
- Nguy, Kevin;
- Naab, Fabian;
- Phillips, Jamie
- Article
50
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1200, doi. 10.1007/s11664-013-2974-4
- Kaspar, K.;
- Pelz, U.;
- Hillebrecht, H.
- Article