Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 12

Results: 30

Physicochemical Properties of Sb-Sn-Zn Alloys.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4374, doi. 10.1007/s11664-014-3320-1

By:

Gancarz, Tomasz

Publication type:

Article

Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4386, doi. 10.1007/s11664-014-3321-0

By:

Tasooji, Amaneh;
Lara, Leticia;
Lee, Kyuoh

Publication type:

Article

Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4582, doi. 10.1007/s11664-014-3330-z

By:

Rahman, Md.;
Ho, Cheng;
Gierlotka, Wojciech;
Kuo, Jui

Publication type:

Article

Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4395, doi. 10.1007/s11664-014-3345-5

By:

Zuo, Yong;
Ma, Limin;
Guo, Fu;
Qiao, Lei;
Shu, Yutian;
Lee, Andree;
Subramanian, K.

Publication type:

Article

Tuning of Magnetic Properties and GMI Effect of Co-Based Amorphous Microwires by Annealing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4532, doi. 10.1007/s11664-014-3348-2

By:

Zhukov, Arcady;
Talaat, Ahmed;
Blanco, Juan;
Ipatov, Mihail;
Zhukova, Valentina

Publication type:

Article

Pressureless Bonding Using Sputtered Ag Thin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4406, doi. 10.1007/s11664-014-3355-3

By:

Oh, Chulmin;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4594, doi. 10.1007/s11664-014-3358-0

By:

Wang, Chao-hong;
Li, Po-yi;
Li, Kuan-ting

Publication type:

Article

Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4413, doi. 10.1007/s11664-014-3368-y

By:

Ishizaki, Toshitaka;
Watanabe, Ryota

Publication type:

Article

Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Fe-rich Microwires.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4540, doi. 10.1007/s11664-014-3370-4

By:

Zhukova, V.;
Talaat, A.;
Ipatov, M.;
del Val, J.;
Gonzalez-Legarreta, L.;
Hernando, B.;
Zhukov, A.

Publication type:

Article

Strongly Dipolar Polythiourea and Polyurea Dielectrics with High Electrical Breakdown, Low Loss, and High Electrical Energy Density.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4548, doi. 10.1007/s11664-014-3374-0

By:

Wu, Shan;
Burlingame, Quinn;
Cheng, Zhao-Xi;
Lin, Minren;
Zhang, Q.

Publication type:

Article

Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4421, doi. 10.1007/s11664-014-3375-z

By:

Elmer, John;
Li, Yan;
Barth, Holly;
Parkinson, Dilworth;
Pacheco, Mario;
Goyal, Deepak

Publication type:

Article

High-Performance, Wide-Bandgap Power Electronics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4552, doi. 10.1007/s11664-014-3376-y

By:

McNutt, Ty;
Passmore, Brandon;
Fraley, John;
McPherson, Brice;
Shaw, Robert;
Olejniczak, Kraig;
Lostetter, Alex

Publication type:

Article

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4428, doi. 10.1007/s11664-014-3377-x

By:

Kim, Youngseok;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki;
Ueshima, Minoru;
Albrecht, Hans-Juergen;
Wilke, Klaus;
Strogies, Joerg

Publication type:

Article

Significance of Nucleation Kinetics in Sn Whisker Formation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4435, doi. 10.1007/s11664-014-3379-8

By:

Chason, E.;
Pei, F.;
Briant, C.;
Kesari, H.;
Bower, A.

Publication type:

Article

A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography ( μXCT).

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4442, doi. 10.1007/s11664-014-3382-0

By:

Mertens, J.C.E.;
Williams, J.J.;
Chawla, Nikhilesh

Publication type:

Article

Polarization Effects of GaN and AlGaN: Polarization Bound Charge, Band Bending, and Electronic Surface States.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4560, doi. 10.1007/s11664-014-3383-z

By:

Eller, Brianna;
Yang, Jialing;
Nemanich, Robert

Publication type:

Article

Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4457, doi. 10.1007/s11664-014-3395-8

By:

Seo, Wonil;
Kim, Kyoung-Ho;
Bang, Jung-Hwan;
Kim, Mok-Soon;
Yoo, Sehoon

Publication type:

Article

An Electroless-Ag Reflector Developed for High-Brightness White LEDs.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4602, doi. 10.1007/s11664-014-3417-6

By:

Liu, W.C.;
Chung, T.;
Chen, Y.;
Hsiao, C.;
Lin, C.;
Liu, C.

Publication type:

Article

Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4610, doi. 10.1007/s11664-014-3430-9

By:

Chuang, T.;
Lin, H.;
Chuang, C.;
Yeh, W.;
Hwang, J.;
Chu, H.

Publication type:

Article

Contact Resistance of Flip-Chip Joints in Wearable Electronic Textiles.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4464, doi. 10.1007/s11664-014-3431-8

By:

Choi, Jung-Yeol;
Oh, Tae

Publication type:

Article

Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4472, doi. 10.1007/s11664-014-3436-3

By:

Hamasha, Sa'd;
Jaradat, Younis;
Qasaimeh, Awni;
Obaidat, Mazin;
Borgesen, Peter

Publication type:

Article

High-Temperature Capacitor Polymer Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4569, doi. 10.1007/s11664-014-3440-7

By:

Tan, Daniel;
Zhang, Lili;
Chen, Qin;
Irwin, Patricia

Publication type:

Article

Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4485, doi. 10.1007/s11664-014-3441-6

By:

Huang, Z.;
Kumar, P.;
Dutta, I.;
Sidhu, R.;
Renavikar, M.;
Mahajan, R.

Publication type:

Article

Effect of Electric Current on Trijunction Equilibrium and Grain Rotation of Lossy Dielectrics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4497, doi. 10.1007/s11664-014-3445-2

By:

Yang, Fuqian

Publication type:

Article

Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga- xCr Pb-Free Solder.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4502, doi. 10.1007/s11664-014-3449-y

By:

Liu, Chin-Wei;
Lin, Kwang-Lung

Publication type:

Article

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4510, doi. 10.1007/s11664-014-3458-x

By:

Caccuri, V.;
Milhet, X.;
Gadaud, P.;
Bertheau, D.;
Gerland, M.

Publication type:

Article

Temperature-Dependent Giant Magnetoimpedance Effect in Amorphous Soft Magnets.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4576, doi. 10.1007/s11664-014-3469-7

By:

Kurniawan, M.;
Roy, R.;
Panda, A.;
Greve, D.;
Ohodnicki, P.;
McHenry, M.

Publication type:

Article

Nanocopper Based Solder-Free Electronic Assembly.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4515, doi. 10.1007/s11664-014-3478-6

By:

Schnabl, K.;
Wentlent, L.;
Mootoo, K.;
Khasawneh, S.;
Zinn, A.;
Beddow, J.;
Hauptfleisch, E.;
Blass, D.;
Borgesen, P.

Publication type:

Article

Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4522, doi. 10.1007/s11664-014-3479-5

By:

Lee, Tae-Kyu;
Xie, Weidong

Publication type:

Article

Wetting of Cu Pads by Bi-2.6Ag- xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4365, doi. 10.1007/s11664-014-3304-1

By:

Fima, Przemyslaw;
Garzel, Grzegorz;
Sypień, Anna

Publication type:

Article