Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 12
Results: 30
Physicochemical Properties of Sb-Sn-Zn Alloys.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4374, doi. 10.1007/s11664-014-3320-1
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Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4386, doi. 10.1007/s11664-014-3321-0
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Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4582, doi. 10.1007/s11664-014-3330-z
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Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4395, doi. 10.1007/s11664-014-3345-5
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Tuning of Magnetic Properties and GMI Effect of Co-Based Amorphous Microwires by Annealing.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4532, doi. 10.1007/s11664-014-3348-2
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Pressureless Bonding Using Sputtered Ag Thin Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4406, doi. 10.1007/s11664-014-3355-3
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Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4594, doi. 10.1007/s11664-014-3358-0
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Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4413, doi. 10.1007/s11664-014-3368-y
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Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Fe-rich Microwires.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4540, doi. 10.1007/s11664-014-3370-4
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Strongly Dipolar Polythiourea and Polyurea Dielectrics with High Electrical Breakdown, Low Loss, and High Electrical Energy Density.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4548, doi. 10.1007/s11664-014-3374-0
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Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4421, doi. 10.1007/s11664-014-3375-z
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High-Performance, Wide-Bandgap Power Electronics.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4552, doi. 10.1007/s11664-014-3376-y
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- Article
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4428, doi. 10.1007/s11664-014-3377-x
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- Article
Significance of Nucleation Kinetics in Sn Whisker Formation.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4435, doi. 10.1007/s11664-014-3379-8
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A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography ( μXCT).
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4442, doi. 10.1007/s11664-014-3382-0
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Polarization Effects of GaN and AlGaN: Polarization Bound Charge, Band Bending, and Electronic Surface States.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4560, doi. 10.1007/s11664-014-3383-z
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Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4457, doi. 10.1007/s11664-014-3395-8
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An Electroless-Ag Reflector Developed for High-Brightness White LEDs.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4602, doi. 10.1007/s11664-014-3417-6
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Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4610, doi. 10.1007/s11664-014-3430-9
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Contact Resistance of Flip-Chip Joints in Wearable Electronic Textiles.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4464, doi. 10.1007/s11664-014-3431-8
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Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4472, doi. 10.1007/s11664-014-3436-3
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High-Temperature Capacitor Polymer Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4569, doi. 10.1007/s11664-014-3440-7
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Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4485, doi. 10.1007/s11664-014-3441-6
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Effect of Electric Current on Trijunction Equilibrium and Grain Rotation of Lossy Dielectrics.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4497, doi. 10.1007/s11664-014-3445-2
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Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga- xCr Pb-Free Solder.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4502, doi. 10.1007/s11664-014-3449-y
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Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4510, doi. 10.1007/s11664-014-3458-x
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Temperature-Dependent Giant Magnetoimpedance Effect in Amorphous Soft Magnets.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4576, doi. 10.1007/s11664-014-3469-7
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Nanocopper Based Solder-Free Electronic Assembly.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4515, doi. 10.1007/s11664-014-3478-6
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Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4522, doi. 10.1007/s11664-014-3479-5
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Wetting of Cu Pads by Bi-2.6Ag- xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4365, doi. 10.1007/s11664-014-3304-1
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