Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 11

Results: 61

Preparation, Infrared Emissivity, and Dielectric and Microwave Absorption Properties of Fe-Doped ZnO Powder.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3942, doi. 10.1007/s11664-014-3218-y

By:

Su, Xiaolei;
Jia, Yan;
Liu, Xiaoqin;
Wang, Junbo;
Xu, Jie;
He, Xinhai;
Fu, Chong;
Liu, Songtao

Publication type:

Article

Effects of Rapid Thermal Annealing on Electrical Transport in Heavily Doped ZnO Thin Films Deposited at Different Substrate Temperatures.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3973, doi. 10.1007/s11664-014-3254-7

By:

Zhu, Ke;
Yang, Ye;
Huang, Jinhua;
Lu, Yuehui;
Li, Jia;
Tan, Ruiqin;
Cui, Ping;
Song, Weijie

Publication type:

Article

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4090, doi. 10.1007/s11664-014-3298-8

By:

Mattila, Toni;
Hokka, Jussi;
Paulasto-Kröckel, Mervi

Publication type:

Article

Thermodynamic Re-modeling of the Sb-Te System Using Associate and Ionic Models.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4082, doi. 10.1007/s11664-014-3299-7

By:

Guo, Cuiping;
Li, Changrong;
Du, Zhenmin

Publication type:

Article

Sensor Performance of Nanostructured TiO-CrO Thin Films Derived by a Particulate Sol-Gel Route with Various Cr:Ti Molar Ratios.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3922, doi. 10.1007/s11664-014-3301-4

By:

Mohammadi, M.R.;
Fray, D.J.

Publication type:

Article

Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-HO Slurry.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4186, doi. 10.1007/s11664-014-3303-2

By:

Jiang, Ting;
Lei, Hong

Publication type:

Article

Characterization of CdS Nanowires Self-Assembled in a Nanoporous Alumina Template.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3979, doi. 10.1007/s11664-014-3305-0

By:

Poduri, Shripriya;
Dutta, Mitra;
Stroscio, Michael

Publication type:

Article

Interface Reaction Between Electroless Ni-Sn-P Metallization and Lead-Free Sn-3.5Ag Solder with Suppressed NiP Formation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4103, doi. 10.1007/s11664-014-3306-z

By:

Yang, Ying;
Balaraju, J.;
Huang, Yizhong;
Tay, Yee;
Shen, Yiqiang;
Tsakadze, Zviad;
Chen, Zhong

Publication type:

Article

Phase Equilibria of the Sn-Ni-V System at 800°C.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4111, doi. 10.1007/s11664-014-3307-y

By:

Wu, Changjun;
Su, Xuping;
Wang, Jianhua;
Liu, Ya;
Tu, Hao;
Zhang, Yifan

Publication type:

Article

Fabrication of Relaxer-Based Piezoelectric Energy Harvesters Using a Sacrificial Poly-Si Seeding Layer.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3898, doi. 10.1007/s11664-014-3308-x

By:

Fuentes-Fernandez, E.;
Salomon-Preciado, A.;
Gnade, B.;
Quevedo-Lopez, M.;
Shah, P.;
Alshareef, H.

Publication type:

Article

Impact of Ni Concentration on the Performance of Ni Silicide/HfO/TiN Resistive RAM (RRAM) Cells.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4193, doi. 10.1007/s11664-014-3309-9

By:

Chen, Z.X.;
Fang, Z.;
Wang, Y.;
Yang, Y.;
Kamath, A.;
Wang, X.P.;
Singh, N.;
Lo, G.-Q.;
Kwong, D.-L.;
Wu, Y.H.

Publication type:

Article

Elemental Compositions of Over 80 Cell Phones.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4199, doi. 10.1007/s11664-014-3310-3

By:

Christian, Beverley;
Romanov, Alexandre;
Romanova, Irina;
Turbini, Laura

Publication type:

Article

Achieving Both High d and High Q for the Pb(ZrSnTi)FeO Ternary System for Use in High-Power Ultrasonic Transducers.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3905, doi. 10.1007/s11664-014-3311-2

By:

Xing, Zhuo;
Jin, Li;
Wang, Tong;
Hu, Qingyuan;
Feng, Yujun;
Wei, Xiaoyong

Publication type:

Article

IMC Growth at the Interface of Sn-2.0Ag-2.5Zn Solder Joints with Cu, Ni, and Ni-W Substrates.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4119, doi. 10.1007/s11664-014-3313-0

By:

Liang, Jiaxing;
Wang, Haozhe;
Hu, Anmin;
Li, Ming

Publication type:

Article

Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4126, doi. 10.1007/s11664-014-3315-y

By:

Lee, Tae-Kyu;
Duh, Jeng-Gong

Publication type:

Article

Design of Polarization- and Incident Angle-Independent Perfect Metamaterial Absorber with Interference Theory.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3949, doi. 10.1007/s11664-014-3316-x

By:

Dincer, Furkan;
Karaaslan, Muharrem;
Unal, Emin;
Akgol, Oguzhan;
Sabah, Cumali

Publication type:

Article

Effect of Excess Li Content on the Microwave Dielectric Properties of the M-Phase of LiO-NbO-TiO Ceramics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3954, doi. 10.1007/s11664-014-3317-9

By:

Li, Enzhu;
Zou, Mengying;
Duan, Shuxin;
Xu, Ning;
Yuan, Ying;
Zhou, Xiaohua

Publication type:

Article

Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4134, doi. 10.1007/s11664-014-3318-8

By:

Lin, Jui-Ching;
Qin, Yi;
Woertink, Julia

Publication type:

Article

Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4214, doi. 10.1007/s11664-014-3319-7

By:

Choi, Yongwon;
Shin, Jiwon;
Suk, Kyung-lim;
Kim, Young;
Kim, Il;
Paik, Kyung-Wook

Publication type:

Article

Review of Capabilities of the ENEPIG Surface Finish.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3885, doi. 10.1007/s11664-014-3322-z

By:

Ratzker, Menahem;
Pearl, Adam;
Osterman, Michael;
Pecht, Michael;
Milad, George

Publication type:

Article

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4146, doi. 10.1007/s11664-014-3323-y

By:

Hammad, A.E.;
El-Taher, A.M.

Publication type:

Article

Photoassisted Chemically Deposited Tin Sulfide Thin Films Based on Two Different Chemical Formulations.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3984, doi. 10.1007/s11664-014-3325-9

By:

Remadevi, T.;
Dhanya, A.;
Deepa, K.

Publication type:

Article

Synthesis and Thermoelectric Properties of Yb-doped CaYbLaMnO Ceramics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4048, doi. 10.1007/s11664-014-3326-8

By:

Zhang, Bo;
Chang, Aimin;
Zhao, Qing;
Ye, Haitao;
Wu, Yiquan

Publication type:

Article

Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4056, doi. 10.1007/s11664-014-3327-7

By:

Bhatta, Rudra;
Henderson, Mark;
Eufrasio, Andreza;
Pegg, Ian;
Dutta, Biprodas

Publication type:

Article

The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4308, doi. 10.1007/s11664-014-3328-6

By:

Stein, J.;
Rehm, S.;
Welzel, U.;
Huegel, W.;
Mittemeijer, E.

Publication type:

Article

Synthesis and Characterization of the 25GaS-(75 − x) GeS- xCsCl System for Engineering a Chemically Stable, Mid-IR Transparent Glass.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4018, doi. 10.1007/s11664-014-3329-5

By:

Seo, Inseok

Publication type:

Article

Density, Electrical and Optical Properties of Yttrium-Containing Tellurium Bismuth Borate Glasses.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4023, doi. 10.1007/s11664-014-3331-y

By:

Shaaban, M.;
Ali, A.

Publication type:

Article

An RDL UBM Structural Design for Solving Ultralow- K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4229, doi. 10.1007/s11664-014-3332-x

By:

Chen, K.;
Wu, C.;
Wang, C.;
Cheng, H.;
Huang, N.

Publication type:

Article

Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film Transistors.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4224, doi. 10.1007/s11664-014-3333-9

By:

Parthiban, S.;
Park, K.;
Kim, H.-J.;
Yang, S.;
Kwon, J.-Y.

Publication type:

Article

Role of Zinc Source in Chemical Bath Deposition of Zinc Sulfide Thin Films on SiN.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4317, doi. 10.1007/s11664-014-3334-8

By:

Luque, P.;
Gómez-Gutiérrez, Claudia;
Lastra, G.;
Carrillo-Castillo, A.;
Quevedo-López, M.;
Olivas, A.

Publication type:

Article

Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3933, doi. 10.1007/s11664-014-3336-6

By:

Choi, Chung;
Yeo, Sang;
Kim, Dohwan;
Kim, Jongchae;
Yoo, Kyung;
Lee, Hyuck

Publication type:

Article

Effects of Carbon Coating on Microstructure and Dielectric Properties of CaCuTiO.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4322, doi. 10.1007/s11664-014-3337-5

By:

Wang, Mao-Hua;
Ma, Xiao-Yu;
Zhang, Bo;
Zhou, Fu

Publication type:

Article

Impact of Tellurium Precipitates in CdZnTe Substrates on MBE HgCdTe Deposition.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3993, doi. 10.1007/s11664-014-3338-4

By:

Benson, J.;
Bubulac, L.;
Smith, P.;
Jacobs, R.;
Markunas, J.;
Jaime-Vasquez, M.;
Almeida, L.;
Stoltz, A.;
Wijewarnasuriya, P.;
Brill, G.;
Chen, Y.;
Peterson, J.;
Reddy, M.;
Vilela, M.;
Johnson, S.;
Lofgreen, D.;
Yulius, A.;
Bostrup, G.;
Carmody, M.;
Lee, D.

Publication type:

Article

Lattice Thermal Conductivity Reduction Due to In Situ-Generated Nano-Phase in BiSbTe Alloys by Microwave-Activated Hot Pressing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4327, doi. 10.1007/s11664-014-3339-3

By:

Yang, Fan;
Fan, Xi;
Rong, Zhen;
Cai, Xin;
Li, Guang

Publication type:

Article

Hall Effect Studies of AlGaAs Grown by Liquid-Phase Epitaxy for Tandem Solar Cell Applications.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3999, doi. 10.1007/s11664-014-3340-x

By:

Zhao, Xin;
Montgomery, Kyle;
Woodall, Jerry

Publication type:

Article

Effect of Sprayed Solution Flow Rate on the Physical Properties of Anatase TiO Thin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4033, doi. 10.1007/s11664-014-3341-9

By:

Naffouti, Wafa;
Nasr, Tarek;
Mehdi, Ahmed;
Kamoun-Turki, Najoua

Publication type:

Article

Zinc Oxide Thin-Film Transistors Fabricated at Low Temperature by Chemical Spray Pyrolysis.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4241, doi. 10.1007/s11664-014-3342-8

By:

Jeong, Yesul;
Pearson, Christopher;
Lee, Yong;
Winchester, Lee;
Hwang, Jaeeun;
Kim, Hongdoo;
Do, Lee-Mi;
Petty, Michael

Publication type:

Article

Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4335, doi. 10.1007/s11664-014-3344-6

By:

Kim, J.H.;
Yu, Jin

Publication type:

Article

Design of Dual-Junction Three-Terminal CdTe/InGaAs Solar Cells.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4344, doi. 10.1007/s11664-014-3346-4

By:

Alshkeili, Sara;
Emziane, Mahieddine

Publication type:

Article

Effects of TaO/YO Codoping on the Microstructure and Microwave Dielectric Properties of Ba(CoZn)NbO Ceramics.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3959, doi. 10.1007/s11664-014-3347-3

By:

Bin, Tang;
Feng, Si;
Ying-xiang, Li;
He-tuo, Chen;
Xiao, Zhang;
Shu-ren, Zhang

Publication type:

Article

Interfacial Reaction Between Nb Foil and n-Type PbTe Thermoelectric Materials During Thermoelectric Contact Fabrication.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4064, doi. 10.1007/s11664-014-3350-8

By:

Xia, Haiyang;
Chen, Cheng-Lung;
Drymiotis, Fivos;
Wu, Aiping;
Chen, Yang-Yuan;
Snyder, G.

Publication type:

Article

Electron Paramagnetic Resonance and Photoluminescence Studies of LaMgAlO:Mn Green Phosphors.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4041, doi. 10.1007/s11664-014-3351-7

By:

Singh, Vijay;
Chakradhar, R.;
Rao, J.;
Dhoble, S.;
Kim, S.

Publication type:

Article

Design, Modeling, Fabrication, and Evaluation of Thermoelectric Generators with Hot-Wire Chemical Vapor Deposited Polysilicon as Thermoelement Material.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4070, doi. 10.1007/s11664-014-3352-6

By:

de Leon, Maria;
Tarazona, Antulio;
Chong, Harold;
Kraft, Michael

Publication type:

Article

Structural and Electrical Properties of TaLaO Thin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4349, doi. 10.1007/s11664-014-3353-5

By:

Khorshidi, Zahra;
Bahari, Ali;
Gholipur, Reza

Publication type:

Article

Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4246, doi. 10.1007/s11664-014-3354-4

By:

Lee, Seung-Woo;
Lee, Tae-Hyung;
Park, Ji-Won;
Park, Cho-Hee;
Kim, Hyun-Joong;
Song, Jun-Yeob;
Lee, Jae-Hak

Publication type:

Article

Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4158, doi. 10.1007/s11664-014-3359-z

By:

Mokhtari, Omid;
Nishikawa, Hiroshi

Publication type:

Article

Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4262, doi. 10.1007/s11664-014-3360-6

By:

Shih, W.;
Yang, T.;
Chuang, H.;
Kuo, M.;
Kao, C.

Publication type:

Article

Development of Polyaniline Using Electrochemical Technique for Plugging Pinholes in Cadmium Sulfide/Cadmium Telluride Solar Cells.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4003, doi. 10.1007/s11664-014-3361-5

By:

Abdul-Manaf, N.;
Echendu, O.;
Fauzi, F.;
Bowen, L.;
Dharmadasa, I.

Publication type:

Article

Investigating the Exchange-Coupling Interaction in Nanostructure Composite Particles of SrFeO and ZnFeO.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4282, doi. 10.1007/s11664-014-3363-3

By:

Mehdipour, M.;
Shokrollahi, H.;
Bahadoran, A.

Publication type:

Article

Influence of Oxygen Pressure on the Properties of Ni-Mn-Zn Ferrite Films on Silicon Substrate.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4289, doi. 10.1007/s11664-014-3364-2

By:

Qian, Y.;
Deng, J.;
Zheng, H.;
Zheng, P.;
Zheng, L.;
Qin, H.

Publication type:

Article