Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 1

Results: 37

Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 270, doi. 10.1007/s11664-013-2790-x

By:

Yang, Tsung-Han;
Lin, Yu-Min;
Ouyang, Fan-Yi

Publication type:

Article

Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 9, doi. 10.1007/s11664-013-2707-8

By:

Lee, Chin;
Hsu, Shou-Jen;
Wu, Yuan-Yun

Publication type:

Article

Nanomeshed Pt(Au) Transparent Contact to p-GaN of Light-Emitting Diode.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 166, doi. 10.1007/s11664-013-2734-5

By:

Li, Xu;
Chang, Cheng-Chieh;
Liu, Yen-Shuo;
Chen, Po-Han;
Liu, Cheng-Yi

Publication type:

Article

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 80, doi. 10.1007/s11664-013-2878-3

By:

Pei, Fei;
Chason, Eric

Publication type:

Article

The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 43, doi. 10.1007/s11664-013-2789-3

By:

Linares, Xioranny;
Kinney, Chris;
Lee, Kyu-Oh;
Morris, J.

Publication type:

Article

Structure-Property Correlations in CoFe-SiO Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 142, doi. 10.1007/s11664-013-2716-7

By:

Ohodnicki, P.R.;
Sokalski, V.;
Baltrus, J.;
Kortright, J.B.;
Zuo, X.;
Shen, S.;
DeGeorge, V.;
McHenry, M.E.;
Laughlin, D.E.

Publication type:

Article

Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 16, doi. 10.1007/s11664-013-2664-2

By:

Ho, C.;
Wang, S.;
Fan, C.;
Wu, W.

Publication type:

Article

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 88, doi. 10.1007/s11664-013-2755-0

By:

Huang, Z.;
Kumar, P.;
Dutta, I.;
Sidhu, R.;
Renavikar, M.;
Mahajan, R.

Publication type:

Article

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 219, doi. 10.1007/s11664-013-2675-z

By:

Wang, S.;
Hsu, L.;
Wang, N.;
Ho, C.

Publication type:

Article

Influence of High- G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 69, doi. 10.1007/s11664-013-2736-3

By:

Lee, Tae-Kyu;
Kim, Choong-Un;
Bieler, Thomas

Publication type:

Article

Optical Properties of AlO/Ni/AlO Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 229, doi. 10.1007/s11664-013-2829-z

By:

Tsai, T.;
Hsueh, S.;
Fang, J.

Publication type:

Article

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 284, doi. 10.1007/s11664-013-2877-4

By:

Chien, P.;
Yeh, C.;
Hsu, H.;
Wu, Albert

Publication type:

Article

High-Frequency Inductor Materials.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 117, doi. 10.1007/s11664-013-2787-5

By:

Varga, L.

Publication type:

Article

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x

By:

Lin, Shih-kang;
Cho, Cheng-liang;
Chang, Hao-miao

Publication type:

Article

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4

By:

Hsu, Hao;
Lin, Tzu-Yang;
Ouyang, Fan-Yi

Publication type:

Article

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 57, doi. 10.1007/s11664-013-2788-4

By:

Zhou, Bite;
Muralidharan, Govindarajan;
Kurumadalli, Kanth;
Parish, Chad;
Leslie, Scott;
Bieler, Thomas

Publication type:

Article

Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 26, doi. 10.1007/s11664-013-2672-2

By:

Liu, Sihan;
Ma, Limin;
Shu, Yutian;
Subramanian, K.;
Lee, Andre;
Guo, Fu

Publication type:

Article

Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 121, doi. 10.1007/s11664-013-2842-2

By:

Yao, Y.;
Sha, Y.;
Liu, J.;
Zhang, F.;
Zuo, L.

Publication type:

Article

Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 247, doi. 10.1007/s11664-013-2722-9

By:

Hashiba, M.;
Shinmei, W.;
Kajihara, M.

Publication type:

Article

Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 277, doi. 10.1007/s11664-013-2786-6

By:

Hu, Y.J.;
Hsu, Y.C.;
Lu, C.T.;
Huang, T.S.;
Chen, C.Y.;
Chuang, W.N.;
Hsiao, C.Y.;
Lin, C.P.;
Liu, C.Y.

Publication type:

Article

Interfacial Reactions of High-Bi Alloys on Various Substrates.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 155, doi. 10.1007/s11664-013-2703-z

By:

Wang, Jin-Yi;
Chen, Chih-Ming;
Yen, Yee-Wen

Publication type:

Article

Dissolution and Interfacial Reactions of (Cu,Ni)Sn Intermetallic Compound in Molten Sn-Cu-Ni Solders.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 195, doi. 10.1007/s11664-013-2708-7

By:

Wang, Chao-hong;
Lai, Wei-han;
Chen, Sinn-wen

Publication type:

Article

Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 176, doi. 10.1007/s11664-013-2735-4

By:

Rahman, Md.;
Fan, Chia-Wei;
Wang, Shin-Ju;
Ho, Cheng-En;
Gierlotka, Wojciech

Publication type:

Article

Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 187, doi. 10.1007/s11664-013-2727-4

By:

Yen, Yee-Wen;
Hsieh, Yu-Ping;
Jao, Chien-Chung;
Chiu, Chao-Wei;
Li, Yi-Shan

Publication type:

Article

Mitigation of Sn Whisker Growth by Small Bi Additions.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 1, doi. 10.1007/s11664-013-2706-9

By:

Jo, Jung-Lae;
Nagao, Shijo;
Hamasaki, Kyoko;
Tsujimoto, Masanobu;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 52, doi. 10.1007/s11664-013-2828-0

By:

Hsu, Hsueh-Hsien;
Chiu, Tz-Cheng;
Chang, Tao-Chih;
Huang, Shin-Yi;
Lee, Hsin-Yi;
Ku, Ching-Shun;
Lin, Yang-Yi;
Su, Chien-Hao;
Chou, Li-Wei;
Ouyang, Yao-Tsung;
Huang, YI-Ting;
Wu, Albert

Publication type:

Article

Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 290, doi. 10.1007/s11664-013-2838-y

By:

Jung, Myung-Won;
Kang, Sung;
Lee, Jae-Ho

Publication type:

Article

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 170, doi. 10.1007/s11664-013-2784-8

By:

Hu, Y.;
Hsu, Y.;
Huang, T.;
Lu, C.;
Wu, Albert;
Liu, C.

Publication type:

Article

Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 137, doi. 10.1007/s11664-013-2725-6

By:

Ucar, Huseyin;
Craven, Mark;
Laughlin, D.;
McHenry, M.

Publication type:

Article

Soft Magnetic Alloy-Polymer Composite for High-Frequency Power Electronics Application.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 126, doi. 10.1007/s11664-013-2866-7

By:

Calata, Jesus;
Lu, Guo-Quan;
Ngo, Khai

Publication type:

Article

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 33, doi. 10.1007/s11664-013-2667-z

By:

Xie, H.X.;
Friedman, D.;
Mirpuri, K.;
Chawla, N.

Publication type:

Article

Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 212, doi. 10.1007/s11664-013-2741-6

By:

Fang, Jau-Shiung;
Su, Wu-Jia;
Huang, Meng-Shuo;
Chiu, Chin-Fu;
Chin, Tsung-Shune

Publication type:

Article

Characterization of ALD Beryllium Oxide as a Potential High- k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 151, doi. 10.1007/s11664-013-2754-1

By:

Johnson, Derek;
Yum, Jung;
Hudnall, Todd;
Mushinski, Ryan;
Bielawski, Christopher;
Roberts, John;
Wang, Wei-E;
Banerjee, Sanjay;
Harris, H.

Publication type:

Article

Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 96, doi. 10.1007/s11664-013-2835-1

By:

DeGeorge, V.;
Shen, S.;
Ohodnicki, P.;
Andio, M.;
McHenry, M.

Publication type:

Article

Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 132, doi. 10.1007/s11664-013-2765-y

By:

Wang, Ling;
Wan, Chao;
Fu, Yonggao;
Chen, Hongtao;
Liu, Xiaojian;
Li, Mingyu

Publication type:

Article

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 259, doi. 10.1007/s11664-013-2800-z

By:

Chang, Jaewon;
Kang, Sung;
Lee, Jae-Ho;
Kim, Keun-Soo;
Lee, Hyuck

Publication type:

Article

Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 109, doi. 10.1007/s11664-013-2783-9

By:

Calata, Jesus;
Lu, Guo-Quan;
Ngo, Khai;
Nguyen, Luu

Publication type:

Article