Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 1
Results: 37
Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 270, doi. 10.1007/s11664-013-2790-x
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- Article
Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 9, doi. 10.1007/s11664-013-2707-8
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Nanomeshed Pt(Au) Transparent Contact to p-GaN of Light-Emitting Diode.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 166, doi. 10.1007/s11664-013-2734-5
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In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 80, doi. 10.1007/s11664-013-2878-3
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- Article
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 43, doi. 10.1007/s11664-013-2789-3
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Structure-Property Correlations in CoFe-SiO Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 142, doi. 10.1007/s11664-013-2716-7
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- Article
Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 16, doi. 10.1007/s11664-013-2664-2
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Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 88, doi. 10.1007/s11664-013-2755-0
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- Article
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 219, doi. 10.1007/s11664-013-2675-z
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Influence of High- G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 69, doi. 10.1007/s11664-013-2736-3
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- Article
Optical Properties of AlO/Ni/AlO Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 229, doi. 10.1007/s11664-013-2829-z
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- Article
Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 284, doi. 10.1007/s11664-013-2877-4
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- Article
High-Frequency Inductor Materials.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 117, doi. 10.1007/s11664-013-2787-5
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Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x
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Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4
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Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 57, doi. 10.1007/s11664-013-2788-4
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- Article
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 26, doi. 10.1007/s11664-013-2672-2
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Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 121, doi. 10.1007/s11664-013-2842-2
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- Article
Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 247, doi. 10.1007/s11664-013-2722-9
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- Article
Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 277, doi. 10.1007/s11664-013-2786-6
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Interfacial Reactions of High-Bi Alloys on Various Substrates.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 155, doi. 10.1007/s11664-013-2703-z
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Dissolution and Interfacial Reactions of (Cu,Ni)Sn Intermetallic Compound in Molten Sn-Cu-Ni Solders.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 195, doi. 10.1007/s11664-013-2708-7
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Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 176, doi. 10.1007/s11664-013-2735-4
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Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 187, doi. 10.1007/s11664-013-2727-4
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Mitigation of Sn Whisker Growth by Small Bi Additions.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 1, doi. 10.1007/s11664-013-2706-9
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Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 52, doi. 10.1007/s11664-013-2828-0
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- Article
Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 290, doi. 10.1007/s11664-013-2838-y
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Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 170, doi. 10.1007/s11664-013-2784-8
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Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 137, doi. 10.1007/s11664-013-2725-6
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Soft Magnetic Alloy-Polymer Composite for High-Frequency Power Electronics Application.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 126, doi. 10.1007/s11664-013-2866-7
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- Article
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 33, doi. 10.1007/s11664-013-2667-z
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Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 212, doi. 10.1007/s11664-013-2741-6
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Characterization of ALD Beryllium Oxide as a Potential High- k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 151, doi. 10.1007/s11664-013-2754-1
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Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 96, doi. 10.1007/s11664-013-2835-1
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- Article
Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 132, doi. 10.1007/s11664-013-2765-y
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- Article
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 259, doi. 10.1007/s11664-013-2800-z
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- Article
Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 109, doi. 10.1007/s11664-013-2783-9
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- Article